Active chip package substrate and method for preparing the same

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United States of America Patent

PATENT NO 9730329
SERIAL NO

14360906

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Abstract

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An active chip package substrate and a method for preparing the same. The active chip package substrate includes: a core board; at least one upper active chip, embedded in the core board and having an active surface facing toward a lower surface of the core board, the upper active chip being an active bare chip; and at least one lower active chip, embedded in the core board and having an active surface facing toward an upper surface of the core board, the lower active chip being an active bare chip.

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Patent Owner(s)

  • INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yu, Zhongyao Beijing, CN 5 13
Zhang, Xia Beijing, CN 86 791

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