Thermally conductive EMI suppression compositions

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United States of America Patent

PATENT NO 9999158
SERIAL NO

13733668

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Abstract

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An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Misra, Sanjay Shoreview, US 29 364
Seethamraju, Kasyap Eden Praire, US 14 13
Timmerman, John Minneapolis, US 6 8

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