SEMICONDUCTOR WAFER PROCESSING TO INCREASE THE USABLE PLANAR SURFACE AREA

World Intellectual Property Organization Patent

APP PUB NO WO-2002045143-A1
SERIAL NO

PCTAU0101546

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Abstract

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The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

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Patent Owner(s)

Patent OwnerAddress
UNIV AUSTRALIANAU

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Inventor(s)

Inventor Name Address
WEBER KLAUS JOHANNES AUSTRALIAN CAPTAL TERRITORY
BLAKERS ANDREW WILLIAM AUSTRALIAN CAPITAL TERRITORY

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