SEMICONDUCTOR PACKAGE

World Intellectual Property Organization Patent

APP PUB NO WO-2008106187-A1
SERIAL NO

PCTUS2008002627

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Abstract

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A semiconductor package that includes a substrate having a metallic back plate, an insulation body and plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to package using a conductive adhesive.

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Patent Owner(s)

Patent OwnerAddress
INT RECTIFIER CORPUS

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Inventor(s)

Inventor Name Address
STANDING MARTIN TONBRIDGE

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