MOLDING PACKAGING MATERIAL AND BATTERY CASE

World Intellectual Property Organization Patent

APP PUB NO WO-2012133663-A1
SERIAL NO

PCTJP2012058393

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Abstract

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Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). A matte coat layer (6) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer (2), and the gloss value of the surface thereof is suppressed to no greater than 30%.

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Patent Owner(s)

Patent OwnerAddress
SHOWA DENKO PACKAGING COJP31 SUZUKAWA ISEHARA-SHI KANAGAWA 259-1146

International Classification(s)

Inventor(s)

Inventor Name Address
KURAMOTO TETSUNOBU ISEHARA-SHI
MINAMIBORI YUUJI ISEHARA

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