POLYAMIDE COMPOSITION FOR LOW TEMPERATURE APPLICATIONS

World Intellectual Property Organization Patent

APP PUB NO WO-2013071744-A1
SERIAL NO

PCTCN2012076319

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Abstract

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A polyamide composition is formed from a low viscosity polyamide-6 and a nucleating agent. The nucleating agent includes an organic material, a first inorganic material and a second inorganic material. Suitable organic materials include organic polymers. Suitable inorganic metallic materials include metal oxides and silicates. The polyamide composition may include polyamide-66 materials and carbon black.

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Patent Owner(s)

Patent OwnerAddress
HONEYWELL INT INCUSNEW JERSEY USA

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Inventor(s)

Inventor Name Address
WANG LEI GUANGDONG 518129
PENG SHUWEN SHANGHAI 200135
WEI JIE 中国北京市海淀区双榆树大泥湾3号楼2门201号 BEIJING 100089 100089
HUANG JIANFENG 中国福建省泉州市晋江市经济开发区（五里园）裕源路10号-1至-2 362200 362200
YUAN JIAYU SHANGHAI

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