METHOD OF MANUFACTURING A CHEMICAL MECHANICAL PLANARIZATION PAD

World Intellectual Property Organization Patent

APP PUB NO WO-2013123105-A2
SERIAL NO

PCTUS2013026015

Stats

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present disclosure relates to a process for forming a chemical mechanical planarization pad. The process includes forming a chemical mechanical planarization pad including a polymer matrix and an embedded structure by heating the polymer matrix and the embedded structure at a first temperature T1 and a first pressure P1. The chemical mechanical planarization pad is then allowed to deform at a second temperature T2 and a second pressure P2. The chemical mechanical planarization pad is then compressed at given mold cavity thickness by applying heat at a third temperature T3, wherein T1> T2, P1>P2, T1≤T3.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • Owner owned or assignment not recorded

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

  • No Inventor to display

Cited Art Landscape

Load Citation