RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN-MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE WITH PLATED LAYER

World Intellectual Property Organization Patent

APP PUB NO WO-2013183789-A1
SERIAL NO

PCTJP2013066129

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Abstract

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Provided is a resin composition excellent in mechanical strength while maintaining LDS activity. The resin composition for laser direct structuring comprises, relative to 100 parts by weight of a polycarbonate resin component, 10 to 100 parts by weight of a glass filler and 1 to 30 parts by weight of a laser direct structuring additive, wherein the polycarbonate resin component consists of 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene-based resin, or consists of a polycarbonate; and the laser direct structuring additive comprises antimony and tin.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ENG PLASTICS CORPJP

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Inventor(s)

Inventor Name Address
MARUYAMA HIROYOSHI TOKYO 100-8324
MOTEGI ATSUSHI TOKYO

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