THIN DIAMOND FILM BONDING PROVIDING LOW VAPOR PRESSURE AT HIGH TEMPERATURE

World Intellectual Property Organization Patent

APP PUB NO WO-2015023356-A1
SERIAL NO

PCTUS2014042573

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Abstract

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This disclosure concerns bonding a thin film of diamond to a second thick diamond substrate in a way that does not cause the exposed (un-bonded) diamond surface to become contaminated by the bonding process or when the bonded diamond is held at high temperature for many hours in vacuum.

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Patent Owner(s)

Patent OwnerAddress
US GOVERNMENTUSALBUQUERQUE ENGINEER DISTRICT (CESPA-OC) 4101 JEFFERSON PL NE ALBUQUERQUE NM 87109-3434 87109-3434

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Inventor(s)

Inventor Name Address
HANNA JEREMY FAIRFAX VA
SHAW JONATHAN L SPRINGFIELD VA

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