BONDING DEVICE
World Intellectual Property Organization Patent
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Abstract
[Problem] To provide a bonding device which makes it possible to freely control the distal end of a capillary when a ball formed at the distal end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.[Solution] A bonding device is provided with a vibration driving part (7), and the vibration driving part (7) is provided with a plurality of piezoelectric elements (10) which each have one end secured to the distal end of a bonding arm (3) and extend and contract along the axial direction of the bonding arm (3), a plurality of capillary holding parts (15) which are each secured to the other end of each of the plurality of piezoelectric elements (10) and are in contact with a proximal end side peripheral surface of a capillary (20), and a pressing/holding part (21) which presses the capillary (20) against the plurality of capillary holding parts (15) and holds the capillary therebetween with at least one end side thereof being secured to the bonding arm (3) and the other end side thereof being in contact with the opposite side to the capillary holding part (15) of the proximal end side peripheral surface of the capillary (20). The plurality of piezoelectric elements perform a functional operation of amplitude, phase, frequency, or waveform to a driving voltage waveform to be applied to each of the piezoelectric elements.
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