ORGANOSILICA MATERIALS AND USES THEREOF
World Intellectual Property Organization Patent
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Abstract
Organosilica materials, which are a polymer of at least one independent monomer of Formula [Z1OZ2SiCH2]3 (I), wherein each Z1 represents a hydrogen atom, a C1-C4 alkyl group or a bond to a silicon atom of another monomer and each Z2 represents a hydroxyl group, a C1-C4 alkoxy group, a C1-C6 alkyl group or an oxygen atom bonded to a silicon atom of another monomer and at least one other monomer are provided herein. Processes of using the organosilica materials, e.g., gas separation, etc., are also provided herein.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
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Patent Owner(s)
Patent Owner | Address |
---|---|
EXXONMOBIL RES & ENG CO | US1545 ROUTE 22 EAST P O BOX 900 ANNNANDALE NJ 08801-0900 08801-0900 |
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Inventor(s)
Inventor Name | Address |
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KAMAKOTI PREETI | BERKELEY HEIGHTS NJ |
LI QUANCHANG | DAYTON NJ |
CALABRO DAVID CHARLES | BRIDGEWATER NJ 08807 |
SHAH MATU J | LIVINGSTON NJ 07039-1803 |
PODSIADLO PAUL | EASTON PA |
BEECKMAN JEAN WILLEM LODEWIJK | COLUMBIA MD 21044 |
COLMYER DOUG F | SPINNERSTOWN PA |
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