POLYAMIC ACID, POLYIMIDE RESIN AND POLYIMIDE FILM

World Intellectual Property Organization Patent

APP PUB NO WO-2016129926-A1
SERIAL NO

PCTKR2016001378

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Abstract

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The present invention relates to a poliamic acid which is a polymerization reaction product of diamine and dianhydride, wherein the diamine comprises 9,9-bis(3-fluoro-4-aminophenyl)fluororene (FFDA), and the dianhydride comprises 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and, more particularly, to a polyamide resin which is an imide thereof, and a polyamide film.

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Patent Owner(s)

Patent OwnerAddress
KOLON INCKRGYEONGGI DO SOUTH KOREA

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Inventor(s)

Inventor Name Address
JUNG HAK GEE YONGIN-SI GYEONGGI-DO 446-797
YANG JONG WON 07793 서울특별시 강서구 마곡동로 110 (마곡동) SEOUL 07793

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