MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS OF FABRICATION

World Intellectual Property Organization Patent

APP PUB NO WO-2016137892-A1
SERIAL NO

PCTUS2016018953

Stats

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Two microelectronic components (110, 120), e.g. a die and an interposer, are bonded to each other. One of the components' contact pads (110C) include metal, and the other component has silicon (410) which reacts with the metal to form metal silicide (504). Then a hole (510) is made through one of the components to reach the metal silicide and possibly even the unreacted metal (110C) of the other component. The hole is filled with a conductor (130), possibly metal, to provide a conductive via that can be electrically coupled to contact pads (120C.B) attachable to other circuit elements or microelectronic components, e.g. to a printed circuit board.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
INVENSAS CORPUSCALIFORNIA USA

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address
SHEN HONG 3025 ORCHARD PARKWAY SAN JOSE CALIFORNIA 95134 95134
WANG LIANG 1600 MISSION SPRINGS CIRCLE SAN JOSE CALIFORNIA 95131 95131
SITARAM ARKALGUD R CUPERTINO CA

Cited Art Landscape

Load Citation