SILICON-ASSISTED PACKAGING OF HIGH POWER INTEGRATED SOA ARRAY
World Intellectual Property Organization Patent
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Abstract
A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SO A) array and a U-tum chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SO As are arranged parallel to one another. The U-tum chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into a plurality of beams. The waveguide assembly guides each of the plurality of beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction. And each of the plurality of SOAs are configured to amplify their respective beams to generate a plurality of amplified output beams.
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