HIGH-SPEED PURE GOLD ELECTROFORMING/ELECTROPLATING BATH

World Intellectual Property Organization Patent

APP PUB NO WO-2023041972-A1
SERIAL NO

PCTIB2021059275

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A high-speed pure gold electroforming/electroplating bath consisting of a. gold potassium sulphite and sodium gold sulphite of 1-40g/l; b. lithium, sodium, potassium, rubidium or cesium salts of sulphurous acid of 2-100g/l; c. alkali salts of phosphoric acid of 2 - 100g/l; d. phosphonic acids in the form of 1 hydroxyl ethane - 1, 1, diphosphonic acid, methylene phosphonic acid, ethylene diamine tetramethylene phosphonic acid of 2 -50g/l; e. bismuth as citrate, tartrate, oxalate, phosphonate or NTA complex of 5-1000mg/l; and f. some amount of pyrophosphate, polyphosphates and other supporting electrolytes and wetting agents. The high-speed pure gold electroforming/electroplating bath allows the formation of wire structure in IC chips and/or dental/jewellery application with fine grain, high density, high uniformity, ability to withstand electrical stress, and different hardness without using cyanide.

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Patent Owner(s)

Patent OwnerAddress
P & S GALVASOLSIN490-1 4TH PHASE PEENYA INDUSTRIAL AREA KARNATAKA BANGALORE 560058

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Inventor Name Address
P & S GALVASOLS 490-1 4TH PHASE PEENYA INDUSTRIAL AREA BANGALORE KARNATAKA - 560058 BANGALORE 560058 560058

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