CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

World Intellectual Property Organization Patent

APP PUB NO WO-2023124804-A1
SERIAL NO

PCTCN2022136576

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Abstract

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The present application provides a circuit board assembly and an electronic device, the circuit board assembly comprising a first circuit board and a second circuit board. The first circuit board is a flexible circuit board, and a first surface of the first circuit board is provided with a reinforcing plate and one or more first bonding pads. The reinforcing plate is provided with a first through hole, at least one first bonding pad being located in the first through hole, and the hardness of the reinforcing plate being greater than that of the first circuit board. In addition, the second circuit board is provided with a second bonding pad, and at least one first bonding pad is welded to the second bonding pad, thereby achieving an electrical connection between the first circuit board and the second circuit board. Using the circuit board assembly provided in the present application, a reinforcing plate with relatively high hardness is provided on the first circuit board, which may help improve the structural strength and flatness of the area of the first circuit board which is provided with the reinforcing plate. In this way, weld reliability of the first bonding pad and the second bonding pad may be improved, so as to improve the reliability of a connection between the first circuit board and the second circuit board.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HUAWEI TECHNOLOGIES CO LTDCNLONGGANG DISTRICT SHENZHEN GUANGDONG 518129

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Inventor(s)

Inventor Name Address
WANG HAO ZHEJIANG
JIANG FAN 中国四川省成都市高新区高新大道创业路26号 610041 610041
ZHANG TONG NO 168 PUJIANG EAST ROAD XIANNV TOWN JIANGDU DISTRICT YANGZHOU CITY JIANGSU PROVINCE 225200 YANGZHOU CITY JIANGSU PROVINCE 225200
LI KELIN SHENZHEN GUANGDONG 518129
LI JIGUANG 中国广东省深圳市盐田区北山工业区综合楼及11栋2楼 518083 518083
ZHOU HAISHENG EAST 12TH FLOOR BUILDING 2 NO 168 MAJIAN ROAD HIGH TECH ZONE SUZHOU CITY JIANGSU PROVINCE 215129 SUZHOU CITY JIANGSU PROVINCE 215129
WEI DAN 610000 NO 24 SOUTH PART OF WUHOU DISTRICT FIRST RING ROAD CHENGDU SICHUAN CHENGDU CITY SICHUAN PROVINCE 610000
TANG HEYUJIA DONGGUAN

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