HOUSING ASSEMBLY, METHOD FOR MANUFACTURING HOUSING ASSEMBLY, AND ELECTRONIC APPARATUS

World Intellectual Property Organization Patent

APP PUB NO WO-2023207699-A1
SERIAL NO

PCTCN2023089179

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Abstract

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A housing assembly, a method for manufacturing a housing assembly, and an electronic apparatus. The housing assembly comprises: a substrate, which comprises a first surface and a second surface arranged opposite each other, wherein the first surface of the substrate is close to the electronic apparatus, and the substrate is hot-pressed and formed by means of soaking a glass fiber cloth in epoxy resin glue solution; a first decorative layer, which is provided on the first surface of the substrate; a light shielding layer, which is provided on the surface of the first decorative layer away from the substrate; and a second decorative layer, which is provided on the second surface of the substrate. The substrate uses a glass fiber epoxy resin plate, thus having high strength, high modulus, and light and thin material; and due to having high transparency, the two surfaces of the substrate can both be provided with a decorative layer, achieving a better decorative effect.

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Patent Owner(s)

Patent OwnerAddress
HUAWEI TECHNOLOGIES CO LTDCNHUAWEI ADMINISTRATION BUILDING BANTIAN LONGGANG DISTRICT SHENZHEN GUANGDONG 518129

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Inventor(s)

Inventor Name Address
XING CHONG SHENZHEN GUANGDONG 518129
XING TIANYI SHENZHEN GUANGDONG 518129
YANG XUTONG 518129 BANTIAN HUAWEI HEADQUARTERS OFFICE BUILDING LONGGANG DISTRICT GUANGDONG SHENZHEN SHENZHEN CITY GUANGDONG PROVINCE 518129

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