B23K

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Description

SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal B21C 23/22; building up linings or coverings by casting B22D 19/08; casting by dipping B22D 23/04; manufacture of composite layers by sintering metal powder B22F 7/00; arrangements on machine tools for copying or controlling B23Q; covering metals or covering materials with metals, not otherwise provided for C23C; burners F23D)

Subclasses

SubclassTitle
1/00 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34)
1/002 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of induction heating
1/005 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of radiant energy
1/008 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering within a furnace (B23K 1/012 takes precedence)
1/012 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering with the use of hot gas
1/015 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering with the use of hot gas Vapour-condensation soldering
1/018 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Unsoldering; Removal of melted solder or other residues
1/06 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) making use of vibrations, e.g. supersonic vibrations
1/08 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of dipping in molten solder
1/14 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) specially adapted for soldering seams (making tubes involving operations other than soldering B21C)
1/16 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) specially adapted for soldering seams (making tubes involving operations other than soldering B21C) longitudinal seams, e.g. of shells
1/18 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) specially adapted for soldering seams (making tubes involving operations other than soldering B21C) circumferential seams, e.g. of shells
1/19 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) taking account of the properties of the materials to be soldered
1/20 Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating (preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C)
3/00 Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00)
3/02 Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Soldering irons; Bits
3/03 Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Soldering irons; Bits electrically heated
3/04 Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Heating appliances (soldering lamps or blow-pipes F23D; electric heating in general H05B)
3/047 Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Heating appliances (soldering lamps or blow-pipes F23D; electric heating in general H05B) electric
3/053 Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Heating appliances (soldering lamps or blow-pipes F23D; electric heating in general H05B) electric using resistance wires

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