Class B24D : TOOLS FOR GRINDING, BUFFING, OR SHARPENING
Subclass 3/32: Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents (composition of friction linings F16D 69/02) the constituent being used as bonding agent and being essentially organic Resins for porous or cellular structure
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 11795287 | Pore inducer and porous abrasive form made using the same | Jun 24, 21 | Oct 24, 23 | 3M Innovative Properties Company |
| 11745303 | Polishing body and manufacturing method therefor | Jul 10, 17 | Sep 05, 23 | NORITAKE CO., LIMITED |
| 11545365 | Chemical planarization | May 13, 20 | Jan 03, 23 | CHEMPOWER CORPORATION |
| 11458594 | Method for manufacturing cutting blade, and cutting blade | Dec 18, 19 | Oct 04, 22 | TOKYO SEIMITSU CO., LTD. |
| 11433502 | Polishing table and polishing apparatus having ihe same | Jun 04, 18 | Sep 06, 22 | Ebara Corporation |
| 10919125 | Grindstone | Oct 19, 16 | Feb 16, 21 | NANO TEM CO., LTD. |
| 10850368 | Nonwoven abrasive articles and methods of making the same | Jul 26, 19 | Dec 01, 20 | 3M Innovative Properties Company |
| 10737327 | Super hard constructions and methods of making same | Dec 19, 16 | Aug 11, 20 | ELEMENT SIX (UK) LIMITED |
| 10702970 | Polishing pad and polishing apparatus | Jan 05, 18 | Jul 07, 20 | SAN FANG CHEMICAL INDUSTRY CO., LTD. |
| 10518383 | Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same | May 25, 18 | Dec 31, 19 | SKC CO., LTD. |
| 10513007 | Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same | May 25, 18 | Dec 24, 19 | SKC CO., LTD. |
| 10414023 | Nonwoven abrasive articles and methods of making the same | Mar 19, 14 | Sep 17, 19 | 3M Innovative Properties Company |
| 10350732 | Bonded abrasive articles and methods of manufacture | Nov 13, 15 | Jul 16, 19 | 3M Innovative Properties Company |
| 10245708 | Method of making an abrasive article and abrasive article | Aug 05, 15 | Apr 02, 19 | 3M Innovative Properties Company |
| 10195713 | Lapping pads and systems and methods of making and using the same | Aug 11, 16 | Feb 05, 19 | 3M Innovative Properties Company |
| 10195714 | Polishing pad and process for producing same | Mar 17, 15 | Feb 05, 19 | Fujibo Holdings Inc. |
| 10086500 | Method of manufacturing a UV curable CMP polishing pad | Dec 18, 14 | Oct 02, 18 | Applied Materials Inc. |
| 10040226 | Methods and materials for making a monolithic porous pad cast onto a rotatable base | Dec 29, 14 | Aug 07, 18 | Entegris, Inc. |
| 9975214 | Composite polishing pad having layers with different hardness and process for producing the same | Aug 11, 16 | May 22, 18 | Nan Ya Plastics Corporation |
| 9951054 | CMP porous pad with particles in a polymeric matrix | Apr 15, 10 | Apr 24, 18 | Cabot Microelectronics Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0025,983 | CMP POLISHING PAD | Oct 08, 24 | Jan 23, 25 | Not available |
| 2024/0293,915 | POLISHING PAD AND WAFER POLISHING METHOD | Mar 01, 24 | Sep 05, 24 | NORITAKE CO., LIMITED; BBS KINMEI CO., LTD.; |
| 2024/0091,901 | CMP POLISHING PAD | Nov 07, 23 | Mar 21, 24 | Not available |
| 2023/0405,765 | DUAL-CURE RESIN FOR PREPARING CHEMICAL MECHANICAL POLISHING PADS | Jun 15, 23 | Dec 21, 23 | Not available |
| 2020/0122,297 | METHOD FOR MANUFACTURING CUTTING BLADE, AND CUTTING BLADE | Dec 18, 19 | Apr 23, 20 | TOKYO SEIMITSU CO. LTD |
| 2019/0202,032 | NONWOVEN ABRASIVE ARTICLE INCLUDING ABRASIVE PARTICLES | Jun 30, 17 | Jul 04, 19 | Not available |
| 2019/0047,121 | POROUS MATERIAL FOR POLISHING AND POLISHING TOOL HAVING THE SAME | Feb 29, 16 | Feb 14, 19 | XEBEC Technology Co. Ltd. |
| 2018/0264,627 | METHOD FOR MANUFACTURING CUTTING BLADE, AND CUTTING BLADE | May 17, 18 | Sep 20, 18 | TOKYO SEIMITSU CO. LTD |
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