Description
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES (piezo-electric, electrostrictive or magnetostrictive elements per se H01L 41/00)
B81B
Technology
Sub-Class
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- 71 2863 US PATENTS IN FORCE
- 1506 US APPLICATIONS PENDING
- 680 Total Patent Owners
- 7060 TOTAL INVENTORS
Subclasses
| Subclass | Title |
|---|---|
| 1/00 | Devices without movable or flexible elements, e.g. micro-capillary devices |
| 3/00 | Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B 5/00 takes precedence) |
| 5/00 | Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements |
| 7/00 | Micro-structural systems |
| 7/02 | Micro-structural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. micro-electro-mechanical systems (MEMS) (B81B 7/04 takes precedence) |
Recent Patents
Not AvailableRecent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2021/0179,421 | STACKED-DIE MEMS RESONATOR | Jan 06, 21 | Jun 17, 21 | Not available |
| 2021/0183,808 | SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS | Dec 13, 19 | Jun 17, 21 | Not available |
| 2021/0180,952 | MICROELECTROMECHANICAL GYROSCOPE SYSTEM | Apr 03, 20 | Jun 17, 21 | National Applied Research Laboratories |
| 2021/0181,070 | AIRCRAFT AIR CONTAMINANT ANALYZER AND METHOD OF USE | Feb 19, 21 | Jun 17, 21 | Not available |
| 2021/0181,151 | PHOTOACOUSTIC SENSORS AND MEMS DEVICES | Dec 09, 20 | Jun 17, 21 | Infineon Technologies AG |
| 2021/0179,422 | METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A DAMPER STRUCTURE | Nov 29, 19 | Jun 17, 21 | Not available |
| 2021/0179,419 | MICRO-ELECTRO MECHANICAL SYSTEM DEVICE CONTAINING A BUMP STOPPER AND METHODS FOR FORMING THE SAME | Dec 16, 19 | Jun 17, 21 | Not available |
| 2021/0180,723 | VIRTUAL VALVE IN A MEMS-BASED COOLING SYSTEM | Dec 16, 19 | Jun 17, 21 | Not available |
| 2021/0179,423 | CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM (MEMS) | Nov 24, 20 | Jun 17, 21 | Not available |
| 2021/0185,448 | MEMS CAPACITIVE MICROPHONE | Aug 05, 19 | Jun 17, 21 | Not available |
| 2021/0179,420 | ON-CHIP SIGNAL PATH WITH ELECTRICAL AND PHYSICAL CONNECTION | Dec 17, 19 | Jun 17, 21 | Not available |
| 2021/0171,340 | METHODS FOR MANUFACTURING MICROMECHANICAL COMPONENTS AND METHOD FOR MANUFACTURING A MOULD INSERT COMPONENT | Feb 17, 21 | Jun 10, 21 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement |
| 2021/0171,338 | Pressure Relief Device for Microphone Protection in an Electronic Device and Corresponding Methods | Dec 04, 19 | Jun 10, 21 | Not available |
| 2021/0176,894 | CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS | Jun 29, 20 | Jun 10, 21 | Not available |
| 2021/0171,337 | VIBRATION DAMPING IN MEMS ACCELERATION SENSORS | May 13, 19 | Jun 10, 21 | Not available |
| 2021/0176,549 | MICROPHONE | Dec 05, 19 | Jun 10, 21 | Not available |
| 2021/0171,339 | Cellular Array Electrostatic Actuator | Dec 09, 20 | Jun 10, 21 | Not available |
| 2021/0172,788 | IMAGING DEVICES HAVING PIEZOELECTRIC TRANSCEIVERS | Feb 19, 21 | Jun 10, 21 | Not available |
| 2021/0176,569 | FORCE FEEDBACK ACTUATOR FOR A MEMS TRANSDUCER | Dec 09, 20 | Jun 10, 21 | Not available |
| 2021/0172,813 | SEALED FORCE SENSOR WITH ETCH STOP LAYER | Nov 02, 18 | Jun 10, 21 | Not available |
Top Owners in This Class
Top Owners in This Subclass
Applications Filed in This Class - By Year
Applications Filed in This Subclass - By Year
Patents Issued To Date - By Filing Year
Average Time to Issuance
- 29 Months (last 2 years Issuances)
- 29 Months (last 5 years Issuances)
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