Description
Class C08K : USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
Subclass 3/38: Use of inorganic ingredients Boron-containing compounds
C08K 3/38
Sub-Class
Stats
- 671 US PATENTS IN FORCE
- 147 US APPLICATIONS PENDING
- 230 Total Patent Owners
- 3,062 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12264223 | Method for manufacturing a composite material comprising a polymer and nanomaterials | Jan 26, 22 | Apr 01, 25 | Commissariat à l'énergie atomique et aux énergies alternatives |
| 12264229 | Resin composition, resin cured product, and composite molded body | Mar 19, 21 | Apr 01, 25 | Mitsubishi Chemical Corporation |
| 12247121 | Curable epoxy composition and its use in prepregs and core filling | Mar 10, 20 | Mar 11, 25 | Von Roll Schweiz AG |
| 12247124 | Resin sheet | Jan 15, 21 | Mar 11, 25 | Lintec Corporation |
| 12234345 | Flame retardant-stabilizer combination for thermoplastic polymers | Jun 11, 21 | Feb 25, 25 | CLARIANT INTERNATIONAL LTD |
| 12215261 | Boron nitride-phosphor composites, systems, and methods | Nov 29, 22 | Feb 04, 25 | The Florida State University Research Foundation Inc. |
| 12217909 | Soft bistable magnetic actuator and fabrication method thereof, fatigue testing device and auto underwater vehicle | Mar 22, 22 | Feb 04, 25 | City University of Hong Kong Matter Science Research Institute (Futian) |
| 12195667 | Boron nitride nanomaterial and resin composition | Oct 29, 19 | Jan 14, 25 | SEKISUI CHEMICAL CO., LTD. |
| 12187954 | SiC-filled polymers with high electrical resistivity and high thermal conductivity | Nov 18, 21 | Jan 07, 25 | WASHINGTON MILLS MANAGEMENT, INC. |
| 12180409 | Double-crosslinked thermal phase transition gel temporary plugging agent and application thereof | Sep 04, 24 | Dec 31, 24 | SOUTHWEST PETROLEUM UNIVERSITY |
| 12180412 | Thermally conductive polymer compositions containing carbon black | Jun 28, 23 | Dec 31, 24 | Cabot Corporation |
| 12179421 | Three-dimensional printing | Apr 27, 19 | Dec 31, 24 | Hewlett-Packard Development Company, L.P. |
| 12152108 | Flame retardant polyamide compositions | Aug 30, 18 | Nov 26, 24 | Celanese Polymers Holding, Inc. |
| 12152113 | Filler-loaded high thermal conductive dispersion liquid composition having excellent segregation stability, method for producing said dispersion liquid composition, filler-loaded high thermal conductive material using said dispersion liquid composition, method for producing said material, and molded article obtained using said material | Oct 20, 23 | Nov 26, 24 | Takagi Chemicals Inc. |
| 12152116 | Polymer film and laminate | Aug 03, 23 | Nov 26, 24 | FUJIFILM Corporation |
| 12145844 | Hexagonal boron nitride powder, resin composition, resin sheet, and method for producing hexagonal boron nitride powder | Feb 28, 20 | Nov 19, 24 | Tokuyama Corporation; Japan as represented by Director General of Shinshu University; |
| 12139608 | Non-halogenated flame retardant polyamide compositions | Apr 01, 20 | Nov 12, 24 | Ascend Performance Materials Operations LLC |
| 12140549 | Polymer dye for detecting hydrogen peroxide and structure for detecting hydrogen peroxide | Dec 02, 20 | Nov 12, 24 | CANON KABUSHIKI KAISHA |
| 12129384 | Pectin based antimicrobial surface coating material | Dec 07, 22 | Oct 29, 24 | YEDITEPE UNIVERSITESI |
| 12110379 | Articles and structures with high heat and reflectance and laser direct structuring function | Feb 11, 21 | Oct 08, 24 | SHPP Global Technologies B.V. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0109,233 | RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD | Oct 13, 22 | Apr 03, 25 | Panasonic Intellectual Property Management Co., Ltd. |
| 2025/0105,693 | COMPONENT USED AS AN ELECTRICAL INSULATION BARRIER BASED ON A POLYARYLETHERKETONE (PAEK) AND A POLYPHENYLSULFONE (PPSU) | Feb 09, 23 | Mar 27, 25 | Not available |
| 2025/0066,197 | BORON NITRIDE PARTICLES AND HEAT DISSIPATION SHEET | Dec 23, 22 | Feb 27, 25 | Not available |
| 2025/0043,132 | ENGINEERED WOOD ADHESIVES INCLUDING GLYCEROL OR OLIGOMERS OF GLYCEROL AND ENGINEERED WOOD THEREFROM | Dec 23, 21 | Feb 06, 25 | CARGILL, INCORPORATED |
| 2025/0043,186 | FIRE-RETARDANT COMPOSITIONS AND INSULATION MATERIALS AND METHOD OF MAKING | Aug 01, 24 | Feb 06, 25 | Not available |
| 2025/0034,354 | THERMOSETTING RESIN COMPOSITION, RESIN CURED PRODUCT AND COMPOSITE MOLDED BODY | Sep 27, 24 | Jan 30, 25 | Mitsubishi Chemical Corporation |
| 2025/0034,376 | POLYMER PROCESSING AIDS FOR LLDPE COMPOSITIONS | Jul 10, 24 | Jan 30, 25 | Equistar Chemicals, LP |
| 2025/0034,386 | FLUORORESIN COMPOSITION AND MOLDED BODY | Sep 26, 24 | Jan 30, 25 | DAIKIN INDUSTRIES, LTD. |
| 2025/0034,425 | COATING COMPOSITION, INSULATING MATERIAL AND LAMINATE | Oct 09, 24 | Jan 30, 25 | Daikin Industries Ltd. |
| 2025/0027,882 | POLYMER DYE FOR DETECTING HYDROGEN PEROXIDE AND HYDROGEN PEROXIDE DETECTING MATERIAL | Oct 03, 24 | Jan 23, 25 | Not available |
| 2025/0026,930 | ROOM TEMPERATURE STORABLE ONE-PART POST CURABLE THERMALLY CONDUCTIVE SILICONE WITH VERTICAL STABILITY | Nov 29, 21 | Jan 23, 25 | Not available |
| 2025/0026,951 | EPOXY RESIN COMPOSITION FOR INTERLAYER INSULATION, RESIN SHEET FOR INTERLAYER INSULATION, LAMINATE FOR CIRCUIT BOARD, METAL- BASED CIRCUIT BOARD, AND POWER MODULE | Sep 16, 24 | Jan 23, 25 | NHK SPRING CO., LTD. |
| 2025/0022,625 | COMPOSITE MATERIAL FOR NEUTRON SHIELDING AND FOR MAINTAINING SUBCRITICALITY, METHOD FOR MANUFACTURING SAME AND USES THEREOF | Jun 08, 22 | Jan 16, 25 | Not available |
| 2025/0019,497 | THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION | Aug 25, 22 | Jan 16, 25 | Not available |
| 2025/0014,965 | THERMAL INTERFACE MATERIAL | Sep 20, 24 | Jan 09, 25 | Not available |
| 2025/0011,508 | ETHYLENE-VINYL ALCOHOL COPOLYMER COMPOSITION, METHOD FOR PRODUCING ETHYLENE-VINYL ALCOHOL COPOLYMER COMPOSITION, PELLETS, MULTILAYER STRUCTURE, AND METHOD FOR PRODUCING MULTILAYER STRUCTURE | Sep 25, 24 | Jan 09, 25 | Kimmon Manufacturing Co. Ltd. and Mitsubishi Chemical Corporation |
| 2025/0002,771 | INORGANIC FILLER AND HEAT DISSIPATION MEMBER | Nov 10, 22 | Jan 02, 25 | DENKA COMPANY LIMITED |
| 2025/0002,630 | COPOLYMER, SURFACTANT, RESIN COMPOSITION, AND HEAT DISSIPATION SHEET | Nov 10, 22 | Jan 02, 25 | DENKA COMPANY LIMITED |
| 2024/0425,186 | FLEXIBLE NANO COATING WITH SIGNIFICANTLY ENHANCED ELECTRICAL, THERMAL AND SEMICONDUCTOR PROPERTIES | Sep 09, 24 | Dec 26, 24 | Not available |
| 2024/0425,670 | POLYMER/EXFOLIATED NANO-COMPOSITE FILMS WITH SUPERIOR MECHANICAL PROPERTIES | Jun 27, 24 | Dec 26, 24 | Not available |
Top Owners in This Subclass
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
Patents Issued To Date - By Filing Year
Average Time to Issuance
- 32 Months (last 2 years Issuances)
- 32 Months (last 5 years Issuances)