C09G 1/18

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Class  C09G : POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES


Subclass 1/18: Polishing compositions (French polish C09F 11/00; detergents C11D) Other polishing compositions based on non-waxy substances on other substances

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12221557 Polishing composition and polishing methodFeb 24, 22Feb 11, 25FUJIMI INCORPORATED
12023707 Methods of temporarily enhancing the luster and brilliance of jewelry and gem stonesApr 14, 23Jul 02, 24Not available
11970632 Use of sulfonic acids in dry electrolytes to polish metal surfaces through ion transportDec 30, 20Apr 30, 24DRYLYTE, S.L.
11970633 Use of sulfonic acids in dry electrolytes to polish metal surfaces through ion transportFeb 28, 22Apr 30, 24DRYLYTE, S.L.
11560495 CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the sameJan 22, 21Jan 24, 23Samsung SDI Co., Ltd.
11545365 Chemical planarizationMay 13, 20Jan 03, 23CHEMPOWER CORPORATION
11518913 Fluid composition and method for conducting a material removing operationAug 27, 20Dec 06, 22Saint-Gobain Ceramics & Plastics, Inc.
11401442 Polishing liquid and chemical mechanical polishing methodJul 23, 20Aug 02, 22FUJIFILM Corporation
11312882 CMP slurry solution for hardened fluid materialSep 14, 20Apr 26, 22TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
11292938 Method of selective chemical mechanical polishing cobalt, zirconium oxide, poly-silicon and silicon dioxide filmsSep 11, 19Apr 05, 22Rohm and Haas Electronic Materials CMP Holdings, Inc.
11279852 CMP slurry compositions and methods of fabricating a semiconductor device using the sameJun 25, 20Mar 22, 22Samsung Electronics Co., Ltd.; KCTECH CO.. LTD.;
10858544 Chemical mechanical polishing slurry and chemical mechanical polishing process using the sameMay 24, 18Dec 08, 20Taiwan Semiconductor Manufacturing Company Ltd.
10774241 CMP slurry solution for hardened fluid materialFeb 13, 17Sep 15, 20Taiwan Semiconductor Manufacturing Company Ltd.
10479911 Composition and method for polishing memory hard disks exhibiting reduced edge roll offJun 05, 18Nov 19, 19Cabot Microelectronics Corporation
10358579 CMP compositions and methods for polishing nickel phosphorous surfacesDec 03, 13Jul 23, 19Cabot Microelectronics Corporation
10190024 Polishing compositionOct 15, 15Jan 29, 19Fujimi Incorporated
10039699 Compositions comprising metathesized unsaturated polyol estersMay 03, 17Aug 07, 18Elevance Renewable Sciences, Inc.
9982166 Metal oxide-polymer composite particles for chemical mechanical planarizationDec 16, 14May 29, 18Cabot Corporation
9777192 Chemical mechanical polishing (CMP) composition comprising a proteinJan 25, 13Oct 03, 17BASF SE
9771497 Methods of forming earth-boring toolsNov 02, 15Sep 26, 17BAKER HUGHES, A GE COMPANY, LLC, ELEMENT SIX LIMITED,

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0033,081 METHODS OF TEMPORARILY ENHANCING THE LUSTER AND BRILLIANCE OF JEWELRY AND GEM STONESMay 20, 24Jan 30, 25Not available
2024/0254,366 POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATEJan 24, 24Aug 01, 24Not available
2024/0240,053 USE OF SULFONIC ACIDS IN DRY ELECTROLYTES TO POLISH METAL SURFACES THROUGH ION TRANSPORTMar 29, 24Jul 18, 24Not available
2023/0104,949 SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHINGJul 08, 22Apr 06, 23Not available
2022/0290,009 POLISHING SOLUTION, POLISHING APPARATUS, AND POLISHING METHODSep 10, 21Sep 15, 22Kioxia Corporation
2020/0362,200 SEMICONDUCTOR PROCESSING COMPOSITION AND PROCESSING METHODMay 11, 20Nov 19, 20JSR Corporation
2019/0359,859 CHEMICAL MECHANICAL POLISHING SLURRY AND CHEMICAL MECHANICAL POLISHING PROCESS USING THE SAMEMay 24, 18Nov 28, 19Not available

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Patents Issued To Date - By Filing Year

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