Description
Class C09J : ADHESIVES; ADHESIVE PROCESSES IN GENERAL
Subclass 4/00: Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 4/00
Sub-Class
Stats
- 558 US PATENTS IN FORCE
- 101 US APPLICATIONS PENDING
- 156 Total Patent Owners
- 1,862 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12258498 | Adhesive set, adhesive body, and manufacturing method therefor | Nov 17, 20 | Mar 25, 25 | Not available |
| 12252569 | Resin composition, adhesive member, and display device including the same | Dec 16, 20 | Mar 18, 25 | Samsung Display Co., Ltd. |
| 12202927 | Mass fixable by actinic radiation, and use of said mass | Jan 30, 19 | Jan 21, 25 | DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA |
| 12187925 | Adhesive composition with retarding additive | Dec 12, 19 | Jan 07, 25 | HUNTSMAN ADVANCED MATERIALS LICENSING (Switzerland) GmbH |
| 12180395 | Two-part, cyanoacrylate/free radically curable adhesive systems | Apr 16, 21 | Dec 31, 24 | Henkel AG & Co. KGaA |
| 12173196 | Two-part urethane adhesive composition | Sep 22, 22 | Dec 24, 24 | Sika Technology AG |
| 12174431 | Methods and compositions for the surface treatment of ferrules and fibers for improved bonding of optical fibes within ferrules | Apr 07, 21 | Dec 24, 24 | CommScope Technologies LLC |
| 12157784 | Two-part curable composition | Mar 18, 20 | Dec 03, 24 | BOSTIK SA |
| 12152175 | Composition made from (meth)acrylate monomers | Nov 24, 20 | Nov 26, 24 | BOSTIK SA; UNIVERSITE DE HAUTEALSACE; Centre National De La Recherche Scientifique (CNRS); |
| 12139646 | Compound, resin precursor, cured object, optical element, optical system, interchangeable camera lens, optical device, cemented lens, and method for manufacturing cemented lens | May 07, 21 | Nov 12, 24 | Nikon Corporation |
| 12116508 | UV curable adhesive | Feb 04, 20 | Oct 15, 24 | 3M Innovative Properties Company |
| 12110253 | System and method of curing adhesive during assembly of glass syringes | Jun 14, 21 | Oct 08, 24 | Not available |
| 12110430 | Adhesive composition, and production method thereof | Aug 30, 19 | Oct 08, 24 | CJ CHEILJEDANG CORPORATION |
| 12091583 | Polymer compound peeling agent, adhesive material, and method of using adhesive materials | May 08, 20 | Sep 17, 24 | Japan as represented by Director General of National Institute of Advanced Industrial Science and Technology Ministry of Economy Trade and Industry; TAT INC.; |
| 12077649 | Malonates and derivatives for in-situ films | May 24, 21 | Sep 03, 24 | Zephyros, Inc. |
| 12071567 | Moisture resistance improver for water-based adhesive for inorganic materials, and water-based adhesive for inorganic materials | Jul 24, 18 | Aug 27, 24 | Sanyo Chemical Industries Ltd. |
| 12059342 | Intraocular lens materials and components | Mar 30, 20 | Aug 13, 24 | Alcon Inc. |
| 12038121 | Heat conservation-insulating material coated with UV curing-type film and having maximized heat efficiency, and method for manufacturing same | Apr 01, 19 | Jul 16, 24 | Not available |
| 12037319 | Curable compound | Jun 10, 19 | Jul 16, 24 | Daicel Corporation Industries Ltd. |
| 12030971 | Two-part cyanoacrylate curable adhesive system | Jan 25, 21 | Jul 09, 24 | Henkel AG & Co. KGaA |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0066,643 | ANISOTROPIC CONDUCTIVE ADHESIVE AND COMPOSITION THEREOF | Dec 28, 22 | Feb 27, 25 | Not available |
| 2025/0062,152 | DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING THE SAME | Aug 14, 24 | Feb 20, 25 | Samsung Electronics Co., Ltd.; Seoul National University R&DB Foundation; |
| 2025/0059,402 | PHOTOCURABLE COMPOSITIONS | Nov 01, 24 | Feb 20, 25 | Not available |
| 2025/0043,150 | UV LED Curable Hotmelt Pressure Sensitive Adhesive Composition | Oct 21, 24 | Feb 06, 25 | Not available |
| 2025/0011,625 | SOLVENT COMPOSITION FOR WELDING OPTICAL MODULE AND CAMERA MODULE USING THE SAME | Apr 09, 24 | Jan 09, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0427,958 | TRACTION POWER SIMULATION | May 07, 24 | Dec 26, 24 | Not available |
| 2024/0400,865 | PHOTOPOLYMERIZABLE COMPOSITION, METHODS OF BONDING AND SEALING, AND AT LEAST PARTIALLY POLYMERIZED COMPOSITION | Aug 18, 22 | Dec 05, 24 | Not available |
| 2024/0400,864 | ADHESIVE COMPOSITION FOR PHOTOFABRICATION ARTICLES | Dec 28, 21 | Dec 05, 24 | KURARAY NORITAKE DENTAL INC. |
| 2024/0392,049 | ACTIVE ENERGY RAY CURABLE COMPOSITION | Oct 24, 22 | Nov 28, 24 | KJ Chemicals Corporation |
| 2024/0368,429 | LOW STRESS AND TAILORABLE STRESS ADHESIVES FOR BONDING OF SENSITIVE COMPONENTS AND PROCESS FOR CREATING THE SAME | May 02, 23 | Nov 07, 24 | The Aerospace Corporation |
| 2024/0350,256 | INTRAOCULAR LENS MATERIALS AND COMPONENTS | Jul 02, 24 | Oct 24, 24 | Alcon Inc. |
| 2024/0343,944 | Preparation of High Molecular Weight Polymers with Minimal Gel Content | Jul 27, 22 | Oct 17, 24 | Not available |
| 2024/0318,041 | METHOD FOR ACCELERATING CURING OF MONOMER AND INSTANT ADHESIVE KIT | Mar 19, 24 | Sep 26, 24 | Not available |
| 2024/0309,242 | One-Component Moisture-Curable Adhesive Compsition | Jul 12, 22 | Sep 19, 24 | Not available |
| 2024/0301,243 | ULTRAVIOLET-CURABLE COMPOSITION | May 30, 22 | Sep 12, 24 | SEKISUI CHEMICAL CO., LTD. |
| 2024/0301,113 | RESIN COMPOSITION, ELECTRICALLY CONDUCTIVE ADHESIVE, CURED OBJECT, AND SEMICONDUCTOR DEVICE | Feb 28, 22 | Sep 12, 24 | Not available |
| 2024/0294,815 | HYDROSILYLATION BASED BETA-DIKETONE PRIMERS FOR ADHESION TO METAL | Jun 29, 22 | Sep 05, 24 | Not available |
| 2024/0287,358 | ADHESIVE SHEET, FLEXIBLE IMAGE DISPLAY MEMBER, AND FLEXIBLE IMAGE DISPLAY DEVICE | May 02, 24 | Aug 29, 24 | Kimmon Manufacturing Co. Ltd. and Mitsubishi Chemical Corporation |
| 2024/0279,516 | HIGH TEMPERATURE RESISTANT ACRYLIC ADHESIVE | Feb 14, 24 | Aug 22, 24 | Illinois Tool Works Inc. |
| 2024/0284,762 | ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME | Dec 19, 23 | Aug 22, 24 | Not available |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 35 Months (last 2 years Issuances)
- 35 Months (last 5 years Issuances)