Description
Class C09J : ADHESIVES; ADHESIVE PROCESSES IN GENERAL
Subclass 11/00: Features of adhesives not provided for in group C09J 9/00, e.g. additives
C09J 11/00
Sub-Class
Stats
- 81 US PATENTS IN FORCE
- 9 US APPLICATIONS PENDING
- 25 Total Patent Owners
- 329 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12221560 | Pressure-sensitive adhesive layer | Dec 10, 20 | Feb 11, 25 | LG Chem Ltd. |
| 12129102 | High-strength packaging bag with effects of heat preservation and watertightness, and preparation process thereof | Mar 14, 24 | Oct 29, 24 | DONGGUAN TAIHONG PACKAGING CO., LTD |
| 12036335 | Adhesive containing microparticles | Jun 06, 23 | Jul 16, 24 | Avery Dennison Corporation |
| 11993731 | Adhesive composition for semiconductor circuit connection and adhesive film containing the same | Jun 05, 20 | May 28, 24 | LG Chem Ltd. |
| 11970634 | Waterborne adhesives for reduced basis weight multilayer substrates and use thereof | Aug 30, 22 | Apr 30, 24 | Henkel AG & Co KGaA |
| 11820920 | Microfibrillated cellulose as a crosslinking agent | Aug 14, 18 | Nov 21, 23 | BORREGAARD AS |
| 11802228 | Asphalt shingle waste adhesive compositions for roofing applications and related methods | Jul 28, 22 | Oct 31, 23 | BMIC LLC |
| 11739241 | High temperature epoxy adhesive formulations | Apr 10, 18 | Aug 29, 23 | DDP SPECIALTY ELECTRONIC MATERIAL US, LLC |
| 11707549 | Adhesive containing microparticles | May 20, 21 | Jul 25, 23 | Avery Dennison Corporation |
| 11571876 | Dielectric film with pressure sensitive microcapsules of adhesion promoter | Mar 17, 17 | Feb 07, 23 | Intel Corp. |
| 11505672 | System and method for flexible sealant with density modifier | Apr 29, 20 | Nov 22, 22 | Polymer Adhesive Sealant Systems, Inc. |
| 11505673 | System and method for flexible sealant with density modifier | Apr 29, 20 | Nov 22, 22 | Polymer Adhesive Sealant Systems, Inc. |
| 11485884 | Extrudable pressure sensitive adhesive based on polybutene-1 polymer and a styrene copolymer suitable for reclosable packagings | May 14, 19 | Nov 01, 22 | Henkel AG & Co KGaA |
| 11459490 | Waterborne adhesives for reduced basis weight multilayer substrates and use thereof | Mar 20, 19 | Oct 04, 22 | Henkel AG & Co KGaA |
| 11455716 | Image analysis of applied adhesive with fluorescence enhancement | Nov 13, 18 | Sep 27, 22 | Rivian IP Holdings, LLC |
| 11407926 | Water-based adhesives | Apr 24, 20 | Aug 09, 22 | BRIDGESTONE CORPORATION |
| 11401449 | Methods of forming an adhesive composition from asphalt shingle waste powder | Jun 15, 20 | Aug 02, 22 | BMIC LLC |
| 11274234 | Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair | Mar 08, 19 | Mar 15, 22 | CHENGDU ESWIN SIP TECHNOLOGY CO., LTD. |
| 11203182 | Filling-bonding material, protective sheet-equipped filling-bonding material, laminated body, optical device, and protective panel for optical device | Jan 16, 18 | Dec 21, 21 | SEKISUI CHEMICAL CO., LTD. |
| 11193048 | Waterborne adhesives for reduced basis weight multilayer substrates and use thereof | Sep 18, 20 | Dec 07, 21 | Henkel IP & Holding GmbH |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0228,835 | WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF | Mar 27, 24 | Jul 11, 24 | Not available |
| 2024/0116,268 | COMPOSITIONS INCORPORATING SILICA FIBERS | Dec 18, 23 | Apr 11, 24 | Not available |
| 2024/0076,525 | METHOD OF USING A TECHNICAL ADHESIVE TAPE | Oct 23, 23 | Mar 07, 24 | Not available |
| 2023/0051,048 | APPARATUS FOR SEPARATING SEMICONDUCTOR CHIP AND METHOD FOR SEPARATING SEMICONDUCTOR BY USING SAME | Feb 04, 21 | Feb 16, 23 | LG Chem Ltd. |
| 2022/0243,096 | ADHESIVE TAPE AND MOBILE TERMINAL | Jul 02, 19 | Aug 04, 22 | LG Electronics Inc. |
| 2020/0107,523 | TEAT OPENING PROTECTION PATCH FOR LIVESTOCK | Oct 08, 19 | Apr 09, 20 | TOKUYAMA CORPORATION |
| 2020/0102,481 | TECHNICAL ADHESIVE TAPE, PARTICULARLY CABLE-WRAPPING TAPE | Sep 18, 19 | Apr 02, 20 | Not available |
| 2014/0261,078 | MODIFIED TONER BASED ADDITIVE FOR ASPHALT-BASED COMPOSITIONS | Mar 12, 14 | Sep 18, 14 | CLOSE THE LOOP TECHNOLOGIES PTY LTD. |
| 2010/0016,143 | FIBERGLASS BINDER COMPRISING EPOXIDIZED OIL AND MULTIFUNCTIONAL CARBOXYLIC ACIDS OR ANHYDRIDES | Sep 08, 09 | Jan 21, 10 | JOHNS MANVILLE |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 38 Months (last 2 years Issuances)
- 38 Months (last 5 years Issuances)