Description
Class C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES
Subclass 1/12: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Gaseous compositions
C23F 1/12
Sub-Class
Stats
- 123 US PATENTS IN FORCE
- 18 US APPLICATIONS PENDING
- 41 Total Patent Owners
- 397 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12247279 | Method for preparing a conductive, transparent and flexible membrane | Feb 11, 22 | Mar 11, 25 | Centre National De La Recherche Scientifique (CNRS); Nantes University; |
| 12241860 | Sensor and manufacturing method thereof | Oct 13, 21 | Mar 04, 25 | Rohm Co. Ltd. |
| 12237172 | Etch process for oxide of alkaline earth metal | May 17, 22 | Feb 25, 25 | Tokyo Electron Limited |
| 12176217 | Method for manufacturing a semiconductor using slurry | May 17, 23 | Dec 24, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12170206 | Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus | Mar 18, 22 | Dec 17, 24 | Kokusai Electric Corporation |
| 12094686 | Atomic layer etching processes | Mar 22, 23 | Sep 17, 24 | ASM IP Holding B.V. |
| 12065746 | Substrate processing method and substrate processing apparatus | Feb 24, 22 | Aug 20, 24 | SCREEN Holdings Co., Ltd. |
| 12017276 | Self-terminating etching interfaces using iodine-based chemistries | Mar 17, 22 | Jun 25, 24 | Colorado School of Mines |
| 11972955 | Dry etching method, method for manufacturing semiconductor element, and cleaning method | Apr 30, 21 | Apr 30, 24 | Resonac Corporation |
| 11967522 | Amorphous layers for reducing copper diffusion and method forming same | Apr 25, 22 | Apr 23, 24 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 11926903 | Etching of alkali metal compounds | Jun 09, 22 | Mar 12, 24 | Applied Materials Inc. |
| 11915939 | Semiconductor fabricating method | Sep 01, 20 | Feb 27, 24 | HITACHI HIGH-TECH CORPORATION |
| 11769671 | Systems and methods for selective metal compound removal | Sep 11, 20 | Sep 26, 23 | Applied Materials Inc. |
| 11745202 | Dry non-plasma treatment system | Jul 15, 15 | Sep 05, 23 | Tokyo Electron Limited |
| 11739428 | Thermal atomic layer etching processes | Dec 29, 21 | Aug 29, 23 | ASM IP Holding B.V. |
| 11739427 | Thermal atomic layer etching processes | Dec 28, 21 | Aug 29, 23 | ASM IP Holding B.V. |
| 11715643 | Gas phase etch with controllable etch selectivity of metals | Jun 02, 20 | Aug 01, 23 | Tokyo Electron Limited |
| 11688607 | Slurry | Jul 27, 20 | Jun 27, 23 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 11682560 | Systems and methods for hafnium-containing film removal | Oct 11, 18 | Jun 20, 23 | Applied Materials Inc. |
| 11619773 | Method of manufacturing metal wire and metal wire grid, wire grid polarizer, electronic device | Jan 24, 19 | Apr 04, 23 | BOE Technology Group Co. Ltd. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0109,501 | ATOMIC LAYER ETCHING OF METALS USING NOVEL CO-REACTANTS AS HALOGENATING AGENTS | Feb 01, 23 | Apr 03, 25 | Not available |
| 2025/0069,898 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | Nov 14, 24 | Feb 27, 25 | Kokusai Electric Corporation |
| 2025/0062,130 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | Nov 01, 24 | Feb 20, 25 | Not available |
| 2025/0037,970 | ATOMIC LAYER ETCHING PROCESSES | Jul 31, 24 | Jan 30, 25 | Not available |
| 2024/0258,160 | AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME | Mar 19, 24 | Aug 01, 24 | Not available |
| 2024/0191,359 | ETCHING METHOD AND PROCESSING DEVICE | Apr 04, 22 | Jun 13, 24 | Not available |
| 2024/0124,992 | NOVEL NICKEL FOAM HAVING HIERARCHICAL PORE STRUCTURE, METHOD OF PRODUCING THE SAME, AND APPLICATION THEREOF | Oct 17, 23 | Apr 18, 24 | Daegu Gyeongbuk Institute of Science and Technology |
| 2024/0026,548 | THERMAL ATOMIC LAYER ETCHING PROCESSES | Jul 10, 23 | Jan 25, 24 | Not available |
| 2023/0193,475 | SYSTEMS AND METHODS FOR PROCESSING A SILICON SURFACE USING MULTIPLE RADICAL SPECIES | Dec 19, 22 | Jun 22, 23 | Not available |
| 2023/0151,495 | ATOMIC LAYER ROUGHNESS REDUCING METHODS AND DEVICES | Nov 16, 22 | May 18, 23 | Not available |
| 2023/0005,749 | SEMICONDUCTOR FABRICATING METHOD | Sep 01, 20 | Jan 05, 23 | Not available |
| 2022/0356,585 | VAPOR CLEANING OF SUBSTRATE SURFACES | Jun 23, 20 | Nov 10, 22 | Not available |
| 2022/0325,418 | METAL REMOVAL METHOD, DRY ETCHING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT | Apr 17, 20 | Oct 13, 22 | EC-Showa Denko K.K. |
| 2022/0056,593 | DRY ETCHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ETCHING DEVICE | Feb 19, 20 | Feb 24, 22 | CENTRAL GLASS COMPANY, LIMITED |
| 2021/0066,601 | METHOD FOR PRODUCING VAPOR DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT | Nov 16, 20 | Mar 04, 21 | Dai Nippon Printing Co., Ltd. |
| 2019/0363,257 | METHOD FOR PRODUCING VAPOR DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT | Aug 06, 19 | Nov 28, 19 | Dai Nippon Printing Co., Ltd. |
| 2018/0327,913 | ETCHING REACTANTS AND PLASMA-FREE ETCHING PROCESSES USING THE SAME | Sep 01, 16 | Nov 15, 18 | Not available |
| 2018/0265,988 | System And Method For Controllable Non-Volatile Metal Removal | May 16, 18 | Sep 20, 18 | Not available |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 23 Months (last 2 years Issuances)
- 23 Months (last 5 years Issuances)