Class C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES
Subclass 1/18: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching copper or alloys thereof
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12051621 | Microelectronic assembly from processed substrate | May 26, 22 | Jul 30, 24 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 11866831 | Methods for wet atomic layer etching of copper | Apr 20, 22 | Jan 09, 24 | Tokyo Electron Limited |
| 11821092 | Etchant for selectively etching copper and copper alloy, and method for manufacturing semiconductor substrate using said etchant | Nov 19, 19 | Nov 21, 23 | Mitsubishi Gas Chemical Company, Inc. |
| 11708637 | Methods of supporting a graphene sheet disposed on a frame support | Aug 06, 20 | Jul 25, 23 | The Regents of the University of California |
| 11674229 | Etching chelating agent, manufacturing method thereof, and etching solution composition | May 07, 20 | Jun 13, 23 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 11672253 | Antibacterial surface treated copper material and a method for preparing the same | Aug 25, 21 | Jun 13, 23 | Hyundai Motor Company; KIA CORPORATION; |
| 11530487 | Method of generating artificial latent fingerprints for latent fingerprint development experiments | Jun 28, 21 | Dec 20, 22 | REPUBLIC OF KOREA (NATIONAL FORENSIC SERVICE DIRECTOR MINISTRY OF THE INTERIOR AND SAFETY) |
| 11441071 | Etchant composition and methods for manufacturing metal pattern and array substrate using the same | Dec 04, 19 | Sep 13, 22 | Samsung Display Co., Ltd. |
| 11401612 | Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus | Feb 05, 18 | Aug 02, 22 | JX Nippon Mining & Metals Corporation |
| 11398712 | Diamond-coated composite heat sinks for high-power laser systems | Jun 22, 21 | Jul 26, 22 | Panasonic Intellectual Property Management Co., Ltd. |
| 11367652 | Microelectronic assembly from processed substrate | Apr 07, 20 | Jun 21, 22 | INVENSAS BONDING TECHNOLOGIES, INC. |
| 11345852 | Etchant composition | Aug 15, 19 | May 31, 22 | Lam Research Corporation |
| 11306399 | Nanoparticle compositions | Aug 12, 20 | Apr 19, 22 | January Therapeutics, Inc. |
| 11208726 | Microetching agent for copper, copper surface roughening method and wiring board production method | Aug 20, 18 | Dec 28, 21 | Mec Company Ltd. |
| 11099131 | Systems and methods for copper etch rate monitoring and control | Dec 06, 17 | Aug 24, 21 | University of North Texas |
| 11070023 | Diamond-coated composite heat sinks for high-power laser systems | Dec 18, 18 | Jul 20, 21 | Panasonic Intellectual Property Management Co., Ltd. |
| 11053594 | Microetchant for copper and method for producing wiring board | Jan 07, 20 | Jul 06, 21 | Mec Company Ltd. |
| 10933233 | Production method for a ring electrode | Feb 18, 19 | Mar 02, 21 | Heraeus Deutschland GmbH & Co. KG |
| 10923514 | Etch chemistries for metallization in electronic devices | Dec 12, 18 | Feb 16, 21 | H. C. Starck Inc.; Daetec, LLC; |
| 10857774 | Transferring graphitic thin films with a liquid gallium probe | Nov 20, 18 | Dec 08, 20 | VAON, LLC |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0011,940 | ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING ROUGHENED COPPER FOIL | Nov 15, 22 | Jan 09, 25 | Mitsubishi Gas Chemical Company Inc. |
| 2024/0240,036 | SOLID-INFUSED SURFACES, ARTICLES INCORPORATING SOLID-INFUSED SURFACES, METHODS OF MAKING, AND METHODS OF USE THEREOF | May 07, 22 | Jul 18, 24 | Not available |
| 2024/0183,052 | A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT CURRENT DENSITIES | Mar 25, 22 | Jun 06, 24 | Atotech Deutschland GmbH & Co. KG |
| 2024/0074,064 | METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED METAL CERAMIC SUBSTRATE | Nov 05, 21 | Feb 29, 24 | Not available |
| 2023/0407,486 | ETCHING AGENT AND METHOD FOR PRODUCING CIRCUIT BOARD | Sep 30, 21 | Dec 21, 23 | Mec Company Ltd. |
| 2022/0389,592 | COPPER ETCHING SOLUTION | Apr 22, 22 | Dec 08, 22 | Not available |
| 2022/0349,064 | ETCHANT AND ETCHING METHOD FOR COPPER-MOLYBDENUM FILM LAYER | Dec 29, 20 | Nov 03, 22 | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 2021/0178,461 | ARTICLE SUPERIOR IN DESIGN AND METHOD FOR PRODUCING THE SAME | Nov 16, 20 | Jun 17, 21 | NGK INSULATORS, LTD. |
| 2020/0396,842 | METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE | Jun 26, 20 | Dec 17, 20 | Kateeva, Inc. |
| 2020/0263,308 | MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND WIRING BOARD PRODUCTION METHOD | Aug 20, 18 | Aug 20, 20 | Mec Company Ltd. |
| 2019/0323,129 | ETCHING SOLUTION COMPOSITION | May 09, 18 | Oct 24, 19 | Not available |
| 2019/0255,317 | PRODUCTION METHOD FOR A RING ELECTRODE | Feb 18, 19 | Aug 22, 19 | Heraeus Deutschland GmbH & Co. KG |
| 2019/0003,062 | MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD | Feb 08, 17 | Jan 03, 19 | Mec Company Ltd. |
| 2019/0003,061 | ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES | Dec 14, 16 | Jan 03, 19 | Atotech Deutschland GmbH |
| 2018/0298,500 | ETCHANT COMPOSITION FOR MULTILAYERED METAL FILM OF COPPER AND MOLYBDENUM, METHOD OF ETCHING USING SAID COMPOSITION, AND METHOD FOR PROLONGING LIFE OF SAID COMPOSITION | Nov 17, 15 | Oct 18, 18 | Kanto Kagaku Kabushiki Kaisha |
| 2018/0142,359 | COPPER PROCESS DEVICE WITH EXPLOSION-PROOF FUNCTION AND COPPER PROCESS EXPLOSION-PROOF METHOD | May 12, 16 | May 24, 18 | SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 2017/0275,767 | COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS | Oct 30, 15 | Sep 28, 17 | ATOTECH DEUTSCHLAND GMBH |
| 2017/0037,519 | METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTERCONNECTION PROCESS AND CU-INTERCONNECTION ETCHING DEVICE | Oct 19, 16 | Feb 09, 17 | SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 2016/0053,382 | ETCHANT COMPOSITION | May 11, 15 | Feb 25, 16 | ENF TECHNOLOGY CO., LTD., LG DISPLAY CO., LTD., |
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