C23F 1/26

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Class  C23F : NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES


Subclass 1/26: Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching refractory metals

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12264396 Substrate processing methodNov 22, 23Apr 01, 25Tokyo Electron Limited
12243751 Chemical solution, etching method, and method for manufacturing semiconductor deviceSep 03, 21Mar 04, 25Kioxia Corporation
12221717 Method for creating a chromium-plated surface with a matte finishApr 03, 23Feb 11, 25Kings Mountain International, Inc.
12184899 Nested and non-nested SEI messages in video bitstreamsMar 27, 23Dec 31, 24BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.; BYTEDANCE INC.;
12119499 Chromium-containing steel sheet for current collector of nonaqueous electrolyte secondary battery and method for manufacturing the sameJun 02, 20Oct 15, 24JFE Steel Corporation
12077867 Surface structure having function freezing delay and icing layer separation and manufacturing method thereofMar 08, 22Sep 03, 24Kookmin University Industry Academy Cooperation Foundation
11949900 Sub-bitstream extractionMar 27, 23Apr 02, 24BEIJING BYTEDANCE NETWORK TECHNOLOY CO., LTD.; BYTEDANCE INC.;
11932947 Composition and method for creating nanoscale surface geometry on a cobalt chromium implantable deviceAug 28, 20Mar 19, 24Tech Met Inc.
11908938 Substrate processing liquid for etching a metal layer, substrate processing method and substrate processing apparatusMar 04, 21Feb 20, 24SCREEN Holdings Co., Ltd.
11905603 Substrate processing method and substrate processing apparatusDec 17, 21Feb 20, 24Tokyo Electron Limited
11875991 Substrate treatment method and substrate treatment deviceJun 04, 19Jan 16, 24Tokyo Electron Limited
11795550 Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the sameMay 06, 21Oct 24, 23Samsung Electronics Co. Ltd.; SOULBRAIN CO., LTD;
11725116 CMP composition including a novel abrasiveMar 30, 21Aug 15, 23CMC Materials, Inc.
11718906 Method of metallic component surface modification for electrochemical applicationsMar 01, 21Aug 08, 23TREADSTONE TECHNOLOGIES INC.
11686002 Method for manufacturing ruthenium wiringAug 05, 21Jun 27, 23Tokyo Ohka Kogyo Co. LTD
11655545 Method and device for improving the surface condition of a turbomachine componentJul 31, 19May 23, 23SAFRAN AIRCRAFT ENGINES
11512397 Etchant composition and method for etchingDec 23, 20Nov 29, 22Kanto Kagaku Kabushiki Kaisha
11499236 Etching solution for tungsten word line recessMar 11, 19Nov 15, 22VERSUM MATERIALS US, LLC
11479863 Chemical solution and method for treating substrateFeb 24, 21Oct 25, 22FUJIFILM Corporation
11441071 Etchant composition and methods for manufacturing metal pattern and array substrate using the sameDec 04, 19Sep 13, 22Samsung Display Co., Ltd.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0088,671 NESTED AND NON-NESTED SEI MESSAGES IN VIDEO BITSTREAMSNov 21, 24Mar 13, 25Not available
2025/0054,782 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODDec 26, 22Feb 13, 25Tokyo Electron Limited
2024/0254,390 COMPOSITION AND METHOD FOR CREATING NANOSCALE SURFACE GEOMETRY ON AN IMPLANTABLE DEVICEApr 07, 24Aug 01, 24Tech Met Inc.
2024/0254,391 WET ETCH FORMULATIONS AND RELATED METHODSFeb 01, 24Aug 01, 24Not available
2024/0035,168 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODJul 19, 23Feb 01, 24Not available
2024/0010,915 Etching Solution For Titanium Nitride And Molybdenum Conductive Metal LinesMar 02, 21Jan 11, 24VERSUM MATERIALS US, LLC
2022/0205,110 ETCHANT COMPOSITION, AND METHOD FOR MANUFACTURING METAL PATTERN AND THIN FILM TRANSISTOR SUBSTRATE USING THE SAMEDec 30, 21Jun 30, 22Not available
2021/0404,068 ETCHING SOLUTION, ANNEXING AGENT, AND MANUFACTURING METHOD OF METAL WIRINGMar 17, 20Dec 30, 21Not available
2021/0062,347 COMPOSITION AND METHOD FOR CREATING NANOSCALE SURFACE GEOMETRY ON A COBALT CHROMIUM IMPLANTABLE DEVICEAug 28, 20Mar 04, 21Tech Met Inc.
2020/0109,475 ETCHING METHODDec 09, 19Apr 09, 20Not available
2020/0102,642 METHOD OF METALLIC COMPONENT SURFACE MODIFICATION FOR ELECTROCHEMICAL APPLICATIONSOct 07, 19Apr 02, 20TREADSTONE TECHNOLOGIES INC.
2019/0301,026 ETCHANT COMPOSITIONS AND METHOD FOR ETCHINGJul 07, 17Oct 03, 19Not available
2019/0274,791 TITANIUM NANO-SCALE ETCHING ON AN IMPLANT SURFACEDec 17, 18Sep 12, 19Not available
2018/0044,801 ETCHING LIQUID AND ETCHING METHODJan 21, 16Feb 15, 18Not available
2017/0218,522 METALLIC WORKPIECE OF TITANIUM AND/OR A TITANIUM ALLOY AND/OR NICKEL-TITANIUM ALLOYS AND ALSO NITINOL WITH A POROUS SURFACE AND PRODUCTION PROCESSJul 31, 15Aug 03, 17CHRISTIAN-ALBRECHTS-UNIVERSITAET ZU KIEL
2015/0259,804 COMPOSITIONS AND METHODS FOR CMP OF TUNGSTEN MATERIALSMar 05, 15Sep 17, 15CABOT MICROELECTRONICS CORPORATION

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