Class C23G : CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
Subclass 1/10: Cleaning or pickling metallic material with solutions or molten salts (with organic solvents C23G 5/02) with acid solutions Other heavy metals
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12237166 | Methods for selective removal of surface oxides on metal films | Jun 13, 22 | Feb 25, 25 | Tokyo Electron Limited |
| 12173425 | Silver-plated product and method for producing same | Jan 21, 21 | Dec 24, 24 | Dowa Metaltech Co., Ltd. |
| 12116659 | Preparation method of large-scale die blank for vacuum isothermal forging | Jul 15, 22 | Oct 15, 24 | BEIJING RESEARCH INSTITUTE OF MEHCNAICAL & ELECTRICAL TECHNOLOGY CO. LTD.CAM |
| 11963308 | Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer | May 06, 19 | Apr 16, 24 | Atotech Deutschland GmbH & Co. KG |
| 11866831 | Methods for wet atomic layer etching of copper | Apr 20, 22 | Jan 09, 24 | Tokyo Electron Limited |
| 11761092 | Method for corrosion-protective and cleaning pretreatment of metallic components | Jun 05, 19 | Sep 19, 23 | Henkel AG & Co. KGaA |
| 11739429 | Methods for refurbishing aerospace components | Jun 04, 21 | Aug 29, 23 | APPLIED MATERIALS, INC. |
| 11491517 | Method and system for cleaning copper-exposed substrate | Aug 30, 19 | Nov 08, 22 | Organo Corporation |
| 11294285 | Method for manufacturing circuit board | Apr 08, 20 | Apr 05, 22 | HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.; Avary Holding (Shenzhen) Co., Limited.; |
| 11289232 | Chemical decontamination method using chelate free chemical decontamination reagent for removal of the dense radioactive oxide layer on the metal surface | Aug 14, 18 | Mar 29, 22 | Korea Atomic Energy Research Institute; Korea Hydro and Nuclear Power Co., Ltd.; |
| 11225633 | Treatment liquid, method for washing substrate, and method for removing resist | Nov 05, 18 | Jan 18, 22 | FUJIFILM Corporation |
| 11220740 | Method of manufacturing sputtering target and sputtering target | Dec 13, 19 | Jan 11, 22 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 11198933 | Method of manufacturing sputtering target and sputtering target | Dec 13, 19 | Dec 14, 21 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 11053578 | Removing coatings from ceramic matrix composite substrates | Oct 17, 17 | Jul 06, 21 | Rolls-Royce Corporation |
| 10961629 | Superhydrophobic surface arrangement, article compromising same and method of manufacture thereof | Dec 27, 18 | Mar 30, 21 | CITY UNIVERSITY OF HONG KONG |
| 10765494 | Titanium nano-scale etching on an implant surface | Dec 17, 18 | Sep 08, 20 | Biomet 3i LLC |
| 10762997 | Decontamination method reducing radioactive waste | Sep 22, 17 | Sep 01, 20 | Korea Atomic Energy Research Institute |
| 10745812 | Methods, systems and apparatuses for copper removal from aluminum desmutting solutions | Aug 24, 17 | Aug 18, 20 | The Boeing Company |
| 10718043 | Titanium plate | Jan 18, 16 | Jul 21, 20 | 501 Nippon Steel Corporation |
| 10653011 | Method for manufacturing circuit board | Nov 17, 17 | May 12, 20 | HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.; Avary Holding (Shenzhen) Co., Limited.; |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0240,297 | METHOD FOR TREATING STEEL PARTS WHICH ARE ALREADY GALVANISED AND HAVE A ZINC LAYER, IN PARTICULAR FOR REPROCESSING USED GALVANISED STEEL PARTS, APPARATUS THEREFOR, AND REPROCESSED GALVANISED STEEL PART | Jul 11, 22 | Jul 18, 24 | Not available |
| 2024/0218,554 | METHOD FOR SMOOTHING SURFACE OF COPPER FOIL AND COPPER FOIL OBTAINED | Mar 13, 23 | Jul 04, 24 | Nan Ya Plastics Corporation |
| 2020/0362,461 | Metallic Material Surface Treatment Agent, Metallic Material Having Surface Treatment Coating, and Manufacturing Method Therefor | Dec 20, 18 | Nov 19, 20 | Not available |
| 2019/0301,028 | COMPOSITION FOR SURFACE TREATMENT, AND METHOD FOR SURFACE TREATMENT AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE USING THE SAME | Aug 28, 17 | Oct 03, 19 | Fujimi Incorporated |
| 2019/0274,791 | TITANIUM NANO-SCALE ETCHING ON AN IMPLANT SURFACE | Dec 17, 18 | Sep 12, 19 | Not available |
| 2019/0256,986 | GE, SIGE OR GERMANIDE WASHING METHOD | Dec 05, 16 | Aug 22, 19 | Not available |
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