Description
RESISTORS
H01C
Technology
Stats
- 3,211 US PATENTS IN FORCE
- 754 US APPLICATIONS PENDING
- 2,014 Total Patent Owners
- 12,073 TOTAL INVENTORS
Subclasses
| Subclass | Title |
|---|---|
| 1/00 | Details |
| 1/01 | Details Mounting; Supporting |
| 1/012 | Details Mounting; Supporting the base extending along, and imparting rigidity or reinforcement to, the resistive element (H01C 1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical, or toroidal winding H01C 3/18, H01C 3/2; the resistive element being formed as one or more layers or coatings on a base H01C 7/00) |
| 1/014 | Details Mounting; Supporting the resistor being suspended between, and being supported by, two supporting sections (H01C 1/016 takes precedence) |
| 1/016 | Details Mounting; Supporting with compensation for resistor expansion or contraction |
| 1/02 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure |
| 1/022 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being openable or separable from the resistive element |
| 1/024 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed (H01C 1/028, H01C 1/032, H01C 1/034 take precedence) |
| 1/026 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed (H01C 1/028, H01C 1/032, H01C 1/034 take precedence) with gaseous or vacuum spacing between the resistive element and the housing or casing |
| 1/028 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath |
| 1/03 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath with powdered insulation |
| 1/032 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element (H01C 1/028 takes precedence) |
| 1/034 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath (H01C 1/032 takes precedence) |
| 1/036 | Details Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath (H01C 1/032 takes precedence) on wound resistive element |
| 1/04 | Details Arrangements of distinguishing marks, e.g. colour coding |
| 1/06 | Details Electrostatic or electromagnetic shielding arrangements |
| 1/08 | Details Cooling, heating, or ventilating arrangements |
| 1/082 | Details Cooling, heating, or ventilating arrangements using forced fluid flow |
| 1/084 | Details Cooling, heating, or ventilating arrangements using self-cooling, e.g. fins, heat sinks |
| 1/12 | Details Arrangements of current collectors |
Recent Patents
Not Available
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0118,461 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | Dec 17, 24 | Apr 10, 25 | Murata Manufacturing Co. Ltd. |
| 2025/0118,462 | ELECTRONIC COMPONENT | Dec 19, 24 | Apr 10, 25 | Murata Manufacturing Co. Ltd. |
| 2025/0118,463 | RESISTOR WITH TEMPERATURE COEFFICIENT OF RESISTANCE (TCR) COMPENSATION | Jun 10, 24 | Apr 10, 25 | Vishay Dale Electronics, LLC |
| 2025/0118,464 | CHIP RESISTOR | Oct 31, 22 | Apr 10, 25 | KOA Corporation |
| 2025/0119,151 | VARIABLE RESISTOR AND DIGITAL-TO-ANALOG CONVERTER | Nov 03, 23 | Apr 10, 25 | United Microelectronics Corp. |
| 2025/0111,965 | RESISTOR MOUNTING STRUCTURE | Dec 13, 24 | Apr 03, 25 | Not available |
| 2025/0111,966 | ENHANCED COMPOSITE WRAPPED SURGE ARRESTER AND METHODS OF PROVIDING THE SAME | Dec 12, 24 | Apr 03, 25 | Not available |
| 2025/0109,073 | ANTIMONY OXIDE SUBSTITUTE ZINC OXIDE ELEMENT | Mar 08, 23 | Apr 03, 25 | Not available |
| 2025/0113,501 | METHOD OF FABRICATING HIGH ACCURACY EMBEDDED RESISTORS IN FLEX SUBSTRATES | Sep 28, 23 | Apr 03, 25 | Not available |
Top Owners in This Class
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Applications Filed in This Class - By Year
Patents Issued To Date - By Filing Year
Average Time to Issuance
- 30 Months (last 2 years Issuances)
- 30 Months (last 5 years Issuances)