H01C 1/034

Sub-Class

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Description

Class  H01C : RESISTORS


Subclass 1/034: Details Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath (H01C 1/032 takes precedence)

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12249448 Resistor and manufacturing method of resistorDec 28, 20Mar 11, 25Koa Corporation
12183488 Electronic componentFeb 22, 21Dec 31, 24ROHM CO., LTD.
11948709 Physically unclonable all-printed carbon nanotube networkFeb 08, 22Apr 02, 24Universities Space Research Association
11769612 Chip resistorMar 25, 20Sep 26, 23ROHM CO., LTD.
11525739 Thermistor die-based thermal probeMay 08, 18Dec 13, 22Agilent Technologies Texas Instruments Incorporated
11506594 Sulfurization detection resistorDec 04, 20Nov 22, 22KOA Corporation
11244775 Physically unclonable all-printed carbon nanotube networkDec 11, 19Feb 08, 22Universities Space Research Association
11239010 Component substrate having a protective functionOct 18, 16Feb 01, 22Epcos AG
10692633 Resistor with upper surface heat dissipationOct 07, 19Jun 23, 20Vishay Dale Electronics, LLC
10618206 Resin-molded electronic device with disconnect preventionNov 16, 17Apr 14, 20Omron Corporation
10541069 Chip resistor and paste for forming resist layer of chip resistorNov 16, 18Jan 21, 20SAMSUNG-ELECTRO-MECHANICS CO. LTD.
10446296 Surge arrester and method of manufacturing a surge arresterMar 16, 18Oct 15, 19Siemens Aktiengesellschaft
10438729 Resistor with upper surface heat dissipationNov 05, 18Oct 08, 19Vishay Dale Electronics, LLC
10410771 Chip resistor and method for producing chip resistorSep 20, 16Sep 10, 19KOA CORPORATION
10141089 Surface-mountable over-current protection deviceNov 30, 17Nov 27, 18Polytronics Technology Corp.
9978483 Surge-resistant wire-wound resistor and method for manufacturing sameJan 17, 14May 22, 18FIRST RESISTOR & CONDENSER CO., LTD.
9958340 Temperature sensorJul 23, 15May 01, 18DENSO Corporation
9892830 Electronic component and production method thereforMay 10, 16Feb 13, 18NIPPON CHEMI-CON CORPORATION
9659690 Method for manufacturing a surface mount deviceOct 14, 14May 23, 17LITTELFUSE, INC.
9646744 Method for manufacturing a surface mount deviceOct 14, 14May 09, 17LITTELFUSE, INC.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0118,461 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENTDec 17, 24Apr 10, 25Murata Manufacturing Co. Ltd.
2025/0095,885 ELECTRONIC COMPONENTDec 03, 24Mar 20, 25ROHM CO., LTD.
2025/0054,663 METAL OXIDE-POLYANILINE POLYMER MATRIX VARISTORAug 09, 23Feb 13, 25Littelfuse, Inc.
2024/0266,094 OVERCURRENT PROTECTION ELEMENTAug 24, 23Aug 08, 24Not available
2024/0221,981 ELECTRONIC COMPONENT AND FILM FORMING METHODMar 18, 24Jul 04, 24Not available
2022/0310,289 PHYSICALLY UNCLONABLE ALL-PRINTED CARBON NANOTUBE NETWORKFeb 08, 22Sep 29, 22Not available
2019/0322,015 Electronic Device and Method for Manufacturing the SameNov 16, 17Oct 24, 19OMRON CORPORATION
2019/0198,203 SURFACE-MOUNTABLE THIN FILM RESISTOR NETWORKJun 02, 17Jun 27, 19KOA Corporation

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Top Owners in This Subclass

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Patents Issued To Date - By Filing Year

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