Class H01G : CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
Subclass 4/002: Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G 9/00) Details
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12199599 | Method and apparatus for use in digitally tuning a capacitor in an integrated circuit device | Feb 17, 22 | Jan 14, 25 | pSemi Corporation |
| 12014875 | Miniaturization process of passive component | Oct 08, 21 | Jun 18, 24 | Trusval Technology Co., Ltd. |
| 11983583 | Multilayer chip component | Apr 04, 23 | May 14, 24 | 501 TDK Corporation |
| 11671091 | Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals | Jul 28, 21 | Jun 06, 23 | pSemi Corporation |
| 11588421 | Receiver device of energy from the earth and its atmosphere | Aug 15, 19 | Feb 21, 23 | Not available |
| 11545304 | Capacitor cluster having capacitors with different shapes | Oct 13, 20 | Jan 03, 23 | Murata Manufacturing Co Ltd. |
| 11335512 | Capacitor assembly structure and method of manufacturing the same | Jul 06, 20 | May 17, 22 | APAQ TECHNOLOGY CO., LTD. |
| 11258440 | Method and apparatus for use in digitally tuning a capacitor in an integrated circuit device | Jul 29, 19 | Feb 22, 22 | pSemi Corporation |
| 11206737 | Composite electronic component and board having the same | Apr 23, 20 | Dec 21, 21 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 11166375 | Composite electronic component and board having the same | Nov 22, 19 | Nov 02, 21 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 10910157 | Electronic component | Nov 19, 18 | Feb 02, 21 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 10847314 | Multilayer capacitor and electronic component device | Jan 19, 18 | Nov 24, 20 | 501 TDK Corporation |
| 10804032 | Multilayer capacitor and electronic component device | Jan 19, 18 | Oct 13, 20 | 501 TDK Corporation |
| 10790094 | Method of forming a leadless stack comprising multiple components | Jun 28, 19 | Sep 29, 20 | KEMET Electronics Corporation |
| 10748707 | Electronic component | Dec 06, 18 | Aug 18, 20 | Samsung Electro-Mechanics Co., Ltd. |
| 10685782 | Capacitor and method of production thereof | Jun 27, 19 | Jun 16, 20 | CAPACITOR SCIENCES INCORPORATED |
| 10672558 | Multilayer ceramic capacitor | Feb 08, 18 | Jun 02, 20 | Taiyo Yuden Co. Ltd. |
| 10650976 | Multilayer ceramic capacitor | Sep 23, 19 | May 12, 20 | Murata Manufacturing Co Ltd. |
| 10630284 | Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals | Jul 02, 18 | Apr 21, 20 | pSemi Corporation |
| 10622157 | Multilayer ceramic structure | Jul 30, 19 | Apr 14, 20 | KEMET Electronics Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0069,805 | CAPACITOR AND METHOD FOR PRODUCING THE SAME | Nov 11, 24 | Feb 27, 25 | Not available |
| 2024/0222,010 | MULTILAYER ELECTRONIC COMPONENT | Jun 22, 23 | Jul 04, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0128,968 | Devices and Methods for Improving Voltage Handling and/or Bi-Directionality of Stacks of Elements When Connected Between Terminals | Jun 02, 23 | Apr 18, 24 | Not available |
| 2023/0283,275 | Methods and Apparatuses for Use in Tuning Reactance in a Circuit Device | Mar 11, 23 | Sep 07, 23 | Not available |
| 2022/0415,572 | CAPACITOR FORMED WITH COUPLED DIES | Jun 25, 21 | Dec 29, 22 | Not available |
| 2022/0406,523 | CAPACITORS IN A GLASS SUBSTRATE | Jun 17, 21 | Dec 22, 22 | Not available |
| 2020/0126,720 | ELECTRONIC COMPONENT | Dec 06, 18 | Apr 23, 20 | Not available |
| 2020/0090,864 | ELECTRONIC COMPONENT | Nov 19, 18 | Mar 19, 20 | Not available |
| 2020/0082,979 | ELECTRONIC COMPONENT | Nov 19, 18 | Mar 12, 20 | Not available |
| 2019/0318,877 | Leadless Stack Comprising Multiple Components | Jun 28, 19 | Oct 17, 19 | Kemet Electronics Corporation |
| 2019/0189,344 | MULTILAYER CAPACITOR AND ELECTRONIC COMPONENT DEVICE | Jan 23, 19 | Jun 20, 19 | 501 TDK Corporation |
| 2018/0240,592 | MULTILAYER CERAMIC CAPACITOR | Feb 08, 18 | Aug 23, 18 | Not available |
| 2018/0226,191 | MULTILAYER CAPACITOR AND ELECTRONIC COMPONENT DEVICE | Jan 19, 18 | Aug 09, 18 | 501 TDK Corporation |
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