H01L

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Description

SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR (conveying systems for semiconductor wafers B65G 49/07; use of semiconductor devices for measuring G01; details of scanning-probe apparatus, in general G12B 21/00; resistors in general H01C; magnets, inductors, transformers H01F; capacitors in general H01G; electrolytic devices H01G 9/00; batteries, accumulators H01M; waveguides, resonators, or lines of the waveguide type H01P; line connectors, current collectors H01R; stimulated-emission devices H01S; electromechanical resonators H03H; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R; electric light sources in general H05B; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K; use of semiconductor devices in circuits having a particular application, see the subclass for the application)

Subclasses

Not Available
Subclass Title
21/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
21/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof
21/027 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L 21/18 or H01L 21/34
21/033 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L 21/18 or H01L 21/34 comprising inorganic layers
21/04 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer

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Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
RE47018 Transparent display apparatus Jul 18, 14 Aug 28, 18 , Samsung Electronics Co., Ltd.
RE47003 Organic thin film transistor with ion exchanged glass substrate Sep 01, 16 Aug 21, 18 , Corning Incorporated

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2018/0261,650 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME May 14, 18 Sep 13, 18 , Not available
2018/0261,717 OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SAME Aug 26, 16 Sep 13, 18 , Not available
2018/0259,805 DISPLAY DEVICE Mar 05, 18 Sep 13, 18 , Not available
2018/0261,446 COMBINED STRUCTURE OF FLEXIBLE SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF TRANSPORTING THE FLEXIBLE SEMICONDUCTOR DEVICE Oct 31, 17 Sep 13, 18 , Not available
2018/0261,636 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Mar 09, 17 Sep 13, 18 , Not available
2018/0261,532 SEMICONDUCTOR DEVICE Jan 11, 18 Sep 13, 18 , c/o TOYOTA JIDOSHA KABUSHIKI KAISHA
2018/0261,672 METHOD FOR FORMING APPARATUS COMPRISING TWO DIMENSIONAL MATERIAL Aug 05, 16 Sep 13, 18 , Not available
2018/0261,675 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Mar 08, 17 Sep 13, 18 , Not available
2018/0261,691 SUPER JUNCTION MOS BIPOLAR TRANSISTOR AND PROCESS OF MANUFACTURE Mar 05, 18 Sep 13, 18 , D3 Semiconductor LLC
2018/0261,518 SEMICONDUCTOR MODULE COMPRISING AN ENCAPSULATING COMPOUND THAT COVERS AT LEAST ONE SEMICONDUCTOR COMPONENT May 09, 18 Sep 13, 18 , Not available
2018/0261,620 THREE DIMENSIONAL MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME Mar 09, 17 Sep 13, 18 , Not available
2018/0261,579 METHOD AND APPARATUS FOR IMPROVED DIRECT TRANSFER OF SEMICONDUCTOR DIE May 12, 18 Sep 13, 18 , Rohinni, LLC.
2018/0256,339 MOBILE COMMERCE PLATFORMS AND ASSOCIATED SYSTEMS AND METHODS FOR CONVERTING CONSUMER COINS, CASH, AND/OR OTHER FORMS OF VALUE FOR USE WITH SAME Sep 15, 17 Sep 13, 18 , Not available
2018/0261,795 ELECTRODE CONTACTS May 08, 18 Sep 13, 18 , Not available
2018/0261,544 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME Dec 19, 17 Sep 13, 18 , Not available
2018/0261,503 LOW TEMPERATURE MOLYBDENUM FILM DEPOSITION UTILIZING BORON NUCLEATION LAYERS Apr 20, 18 Sep 13, 18 , Not available
2018/0261,752 ZZZ COUPLER FOR SUPERCONDUCTING QUBITS Mar 10, 17 Sep 13, 18 , Northrop Grumman Systems Corporation
2018/0261,792 ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME Jan 10, 18 Sep 13, 18 , Not available
2018/0260,058 IN-CELL TOUCH PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE Jun 15, 17 Sep 13, 18 , Boe Technology Group Co., Ltd; Ordos Yuansheng Optoelectronics Co., Ltd.;
2018/0260,001 FLEXIBLE DISPLAY FOR DISPLAYING DEPTH INFORMATION Aug 03, 16 Sep 13, 18 , Audi AG

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Patents Issued To Date - By Filing Year

Average Time to Issuance

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