H05K

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Description

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

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Recent Publications

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Publication #TitleFiling DatePub DatePatent Owner
2018/0324,940 SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI) COMPARTMENT SHIELDING FOR COMPONENTS DISPOSED INSIDE OF SYSTEM ELECTRONIC PACKAGES Jul 13, 18 Nov 08, 18 , Not available
2018/0319,092 CENTRIFUGAL GLUE INJECTION SYSTEM AND METHOD THEREOF Oct 23, 17 Nov 08, 18 , Not available
2018/0318,589 BIOCOMPATIBLE COMPOSITE SYSTEM May 01, 18 Nov 08, 18 , Heraeus Deutschland GmbH & Co. KG; HERAEUS QUARTZ AMERICA LLC;
2018/0324,977 THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN Jul 19, 18 Nov 08, 18 , Apple Inc.
2018/0319,108 METHODS OF FABRICATING ELECTRONIC AND MECHANICAL STRUCTURES Jun 07, 18 Nov 08, 18 , Not available
2018/0320,859 ELECTRONICS CASE WITH LIGHT-REFLECTIVE ELEMENTS May 04, 18 Nov 08, 18 , CASE-MATE, INC.
2018/0321,286 Combined DC Current, AC Current and Voltage Sensor for High Voltage Electric Power Lines May 04, 18 Nov 08, 18 , Not available
2018/0324,975 ELECTRICAL SWITCH AND MOUNTING ASSEMBLY THEREFOR May 04, 17 Nov 08, 18 , Eaton Corporation
2018/0323,010 MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Nov 13, 17 Nov 08, 18 , Not available
2018/0322,326 FINGERPRINT IDENTIFICATION MODULE Jan 22, 16 Nov 08, 18 , Not available
2018/0323,524 Electrical Connections And their Use in Wearables and Other Applications Jul 11, 18 Nov 08, 18 , Not available
2018/0324,985 ELECTRIC SHOCK PREVENTION APPARATUS Oct 28, 16 Nov 08, 18 , Not available
2018/0324,954 TREATMENT FLUID EXTRACTING DEVICE AND ETCHING DEVICE COMPRISING THE LATTER Oct 19, 16 Nov 08, 18 , Not available
2018/0317,659 LIGHTED CUP HOLDER FOR SEATING ARRANGEMENTS Jul 10, 18 Nov 08, 18 , Not available
2018/0323,361 THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD Jul 10, 18 Nov 08, 18 , Not available
2018/0324,984 INSTALLATION TOOL FOR FLEXIBLE ELEMENTS May 03, 17 Nov 08, 18 , Not available
2018/0323,502 PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY May 01, 18 Nov 08, 18 , Not available
2018/0324,941 MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR Jul 11, 18 Nov 08, 18 , Amphenol Corporation
2018/0322,625 DETECTING POTENTIALLY DEFECTIVE PACKAGED RADIO-FREQUENCY MODULES Jul 12, 18 Nov 08, 18 , Not available
2018/0318,955 MODULAR WELDING SYSTEM Jul 10, 18 Nov 08, 18 , Not available

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Patents Issued To Date - By Filing Year

Average Time to Issuance

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