H05K

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PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2019/0281,669 Adaptive Preheating and Filament Current Control for Magnetron Power Supply Mar 01, 19 Sep 12, 19 , Not available
2019/0281,692 DISPLAY DEVICE INCLUDING CUTOUT PORTION AT FOLDING AXIS Mar 04, 19 Sep 12, 19 , Not available
2019/0280,611 POWER CONVERTER FOR ELECTRIC VEHICLE DRIVE SYSTEMS Aug 01, 18 Sep 12, 19 , Not available
2019/0278,340 EXTENDABLE STRUCTURE FOR PROTECTING ELECTRICAL CONNECTORS May 23, 19 Sep 12, 19 , Not available
2019/0280,374 ANTENNA MODULE Aug 24, 18 Sep 12, 19 , Samsung Electronics Co. Ltd.
2019/0281,717 FLEXIBLE PACKAGING FOR A WEARABLE ELECTRONIC DEVICE Sep 28, 16 Sep 12, 19 , Not available
2019/0281,724 Module Arrangement With Resetting Mechanism May 30, 19 Sep 12, 19 , TE Connectivity Germany GmbH; ABB Schweiz AG;
2019/0281,706 Layer Stack of Component Carrier Material With Embedded Components and Common High Temperature Robust Dielectric Structure Mar 06, 19 Sep 12, 19 , Not available
2019/0276,955 STRUCTURE OF FABRIC AND ELECTRONIC COMPONENTS May 24, 19 Sep 12, 19 , Not available
2019/0280,075 DISPLAY DEVICE Nov 20, 18 Sep 12, 19 , Not available
2019/0281,719 RETENTION OF DUAL IN-LINE MEMORY MODULES May 24, 19 Sep 12, 19 , Not available
2019/0279,543 DISPLAY DEVICE Dec 20, 18 Sep 12, 19 , Not available
2019/0281,707 METHOD FOR MANUFACTURING AN EMBEDDED FLEXIBLE CIRCUIT BOARD May 30, 19 Sep 12, 19 , Not available
2019/0280,375 ANTENNA STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME Mar 05, 19 Sep 12, 19 , Not available
2019/0278,951 Active shield portion serving as serial keypad Mar 12, 18 Sep 12, 19 , Not available
2019/0281,727 COOLING APPARATUS Mar 04, 19 Sep 12, 19 , Fujitsu Limited
2019/0280,411 MULTI-MODE AND/OR MULTI-SPEED NON-VOLATILE MEMORY (NVM) EXPRESS (NVME) OVER FABRICS (NVME-OF) DEVICE Jul 11, 18 Sep 12, 19 , Not available
2019/0278,335 ROLLABLE DISPLAY DEVICE Feb 11, 19 Sep 12, 19 , Not available
2019/0281,732 DATA CENTER COOLING SYSTEM May 24, 19 Sep 12, 19 , Not available
2019/0280,442 HIGH OUTLET DENSITY POWER DISTRIBUTION UNIT May 24, 19 Sep 12, 19 , Not available

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