H05K

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Description

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
9821153 Punctual stimulation device Mar 21, 12 Nov 21, 17 , Not available
9821397 Solder precoating method and workpiece for electronic equipment Dec 20, 04 Nov 21, 17 , Senju Metal Industry Co. LTD
9821723 Height adjustable holder for mobile device Oct 30, 14 Nov 21, 17 , Faurecia Interieur Industrie
9821736 Device for ventilating and supplying electrical power to an aircraft engine computer Jun 28, 13 Nov 21, 17 , SNECMA
9821787 Circuit board and vehicle brake hydraulic pressure control unit Feb 26, 15 Nov 21, 17 , AUTOLIV NISSIN BRAKE SYSTEMS JAPAN CO., LTD.
9821935 Fixing structure Feb 24, 16 Nov 21, 17 , Fujitsu Ten Limited
9821975 Tape feeder and tape setting method Mar 04, 13 Nov 21, 17 , Panasonic Intellectual Property Management Co., Ltd.
9822226 Dry film and printed wiring board Nov 06, 15 Nov 21, 17 , Taiyo Ink MFG. Co. Ltd.
9822227 High Tg epoxy formulation with good thermal properties Jun 18, 15 Nov 21, 17 , Isola USA Corp.
9822261 Compound wherein conductive circuits can be made Aug 16, 13 Nov 21, 17 , SPF LOGICA S.R.L.
9822459 Clamper and holding jig including same Aug 07, 14 Nov 21, 17 , C. Uyemura & Co., Ltd.
9822486 Flame-resistant paper for wave absorber member and wave absorber member Dec 04, 13 Nov 21, 17 , Toray Industries, Inc.
9822921 Supporting stand for display device Jul 12, 16 Nov 21, 17 , Syncmold Enterprise Corp.
9823140 Sensor abnormality determining apparatus Jul 31, 14 Nov 21, 17 , Nissan Motor Co. Ltd.
9823221 Microstructured polymer devices Feb 13, 13 Nov 21, 17 , STRATEC Consumables GmbH
9823399 Display device Aug 26, 15 Nov 21, 17 , Samsung Display Co., Ltd.
9823680 Data center power conversion efficiency management Feb 07, 14 Nov 21, 17 , International Business Machine Corporation
9823691 Semiconductor storage device Mar 04, 16 Nov 21, 17 , TOSHIBA MEMORY CORPORATION
9823703 Modules and connections for modules to couple to a computing device Feb 19, 15 Nov 21, 17 , Google Inc.
9823704 Protective case for a computing device with adjustable stand Aug 02, 16 Nov 21, 17 , Urban Armor Gear LLC

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2017/0326,489 FILTER FOR IMMERSION COOLING APPARATUS May 15, 17 Nov 16, 17 , Not available
2017/0326,576 SYSTEM OF DISPENSING MATERIAL ON A SUBSTRATE WITH A SOLENOID VALVE OF A PNEUMATICALLY-DRIVEN DISPENSING UNIT May 12, 16 Nov 16, 17 , Not available
2017/0326,577 METHOD OF DISPENSING MATERIAL ON A SUBSTRATE WITH A SOLENOID VALVE OF A PNEUMATICALLY-DRIVEN DISPENSING UNIT May 12, 16 Nov 16, 17 , Not available
2017/0326,592 PHASED ARRAY ULTRASONIC TRANSDUCER AND METHOD OF MANUFACTURE May 15, 17 Nov 16, 17 , Not available
2017/0326,639 ELECTRICALLY CONDUCTIVE FINE PARTICLES Nov 05, 15 Nov 16, 17 , TOKUSEN KOGYO CO., LTD.
2017/0326,689 METHODS OF FORMING A SUBSTRATE HAVING AN OPEN PORE THEREIN AND PRODUCTS FORMED THEREBY May 12, 17 Nov 16, 17 , Not available
2017/0326,841 Electronic Component and Process of Producing Electronic Component Jul 28, 17 Nov 16, 17 , TE Connectivity Corporation; TE Connectivity Germany GmbH;
2017/0327,167 METHOD FOR MANUFACTURING AN AUTOMOTIVE MIRROR Dec 07, 15 Nov 16, 17 , Not available
2017/0327,343 ELEVATOR OPERATION PANEL Mar 03, 15 Nov 16, 17 , Mitsubishi Electric Corporation
2017/0327,377 FABRICATION AND APPLICATION OF NANOFIBER RIBBONS AND SHEETS AND TWISTED AND NON-TWISTED NANOFIBER YARNS Oct 21, 16 Nov 16, 17 , 501 Board of Regents The University of Texas System
2017/0327,630 RESIN FILM, COVERLAY FOR PRINTED WIRING BOARD, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD Oct 13, 15 Nov 16, 17 , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
2017/0327,683 RESIN COMPOSITION AND PRODUCT MADE THEREFROM Sep 07, 16 Nov 16, 17 , Not available
2017/0327,702 WATER-BASED ORGANIC SOLDERABILITY PRESERVATIVE, AND ELECTRONIC BOARD AND SURFACE TREATMENT METHOD USING THE SAME May 10, 17 Nov 16, 17 , Not available
2017/0328,368 MOTOR INTERCONNECT DEVICE Aug 02, 17 Nov 16, 17 , Apple Inc.
2017/0328,371 METHOD AND DEVICE FOR ADJUSTING OPERATION DATA Aug 01, 17 Nov 16, 17 , Beijing Smartmi Technology Co. Ltd.; Xiaomi Inc.;
2017/0328,544 SNAP-IN ASSEMBLING OF LED BOARDS IN LUMINAIRES May 16, 16 Nov 16, 17 , Not available
2017/0329,079 OPTO-ELECTRIC HYBRID BOARD Nov 20, 15 Nov 16, 17 , NITTO DENKO CORPORATION
2017/0329,093 OPTO-ELECTRIC HYBRID BOARD AND METHOD OF MANUFACTURING SAME Nov 25, 15 Nov 16, 17 , NITTO DENKO CORPORATION
2017/0329,205 ELECTRONIC DEVICE May 11, 17 Nov 16, 17 , AVer Information Inc.
2017/0329,372 COMPONENT PLACEMENT WITHIN A SOLID STATE DRIVE Aug 04, 17 Nov 16, 17 , Not available

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Patents Issued To Date - By Filing Year

Average Time to Issuance

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