H05K

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Description

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
RE46985 Display device using semiconductor light emitting device and method of fabricating the same Jul 18, 17 Aug 07, 18 , LG Electronics Inc.

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2018/0234,642 RADIOGRAPHIC DETECTOR WITH HEAT SINK Feb 14, 18 Aug 16, 18 , Not available
2018/0233,825 Communication Apparatus Feb 02, 18 Aug 16, 18 , Sony Interactive Entertainment Inc.
2018/0235,080 ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES SUCH AS REFLOW SOLDERING Apr 18, 18 Aug 16, 18 , Heptagon Micro Optics Pte. Ltd.
2018/0235,099 MODULAR PROTECTION CABINET WITH FLEXIBLE BACKPLANE Apr 09, 18 Aug 16, 18 , Not available
2018/0231,276 Pre-Conditioned Air System with Recirculating Evaporative Air Cooling Feb 16, 18 Aug 16, 18 , Verde GSE, Inc.
2018/0235,101 Heat Sink For An Electronic Component Jul 08, 16 Aug 16, 18 , Siemens Aktiengesellschaft
2018/0232,019 FIXING MECHANISM AND COMPUTER CHASSIS Jan 15, 18 Aug 16, 18 , LITE-ON ELECTRONICS (GUANGZHOU) LIMITED; Lite-On Technology Corporation;
2018/0235,075 SHIELDING FOR SEMICONDUCTOR OPTOELECTRONIC DEVICES AND PACKAGES Feb 16, 17 Aug 16, 18 , Not available
2018/0233,298 MATERIAL PROPERTY CAPACITANCE SENSOR Feb 14, 18 Aug 16, 18 , Not available
2018/0235,115 Selectively Plated Rolls Of Materials And Related Methods Apr 06, 18 Aug 16, 18 , Not available
2018/0235,114 GROUNDING STRUCTURE Jan 18, 18 Aug 16, 18 , c/o TOYOTA JIDOSHA KABUSHIKI KAISHA
2018/0231,159 PIPE CONNECTOR STRUCTURE Jun 20, 17 Aug 16, 18 , Not available
2018/0233,860 ELECTRICAL CONNECTOR ASSEMBLY Feb 09, 18 Aug 16, 18 , Not available
2018/0233,965 Transmitting Base with Repeater Feb 13, 18 Aug 16, 18 , Not available
2018/0235,070 Heat Exchanger for an Information Handling System Feb 16, 17 Aug 16, 18 , Not available
2018/0232,191 BEVELED HANDHELD COMMUNICATION DEVICE EDGE Apr 16, 18 Aug 16, 18 , Not available
2018/0233,801 Transmitting Base with Magnetic Shielding and Flexible Transmitting Antenna Feb 13, 18 Aug 16, 18 , Not available
2018/0231,295 ELECTRONIC APPARATUS AND COOLING METHOD OF ELECTRONIC APPARATUS Feb 02, 18 Aug 16, 18 , Fujitsu Limited
2018/0231,723 OPTICAL CONNECTORS WITH POSITIONS Feb 10, 17 Aug 16, 18 , Not available
2018/0232,044 DISTRIBUTED COMPUTING Sep 26, 17 Aug 16, 18 , Not available

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Patents Issued To Date - By Filing Year

Average Time to Issuance

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