H05K

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Description

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
RE47790 Systems and methods for synthetic jet enhanced natural cooling Aug 01, 13 Dec 31, 19 , General Electric Company

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2020/0029,439 SUBSTRATE, DISPLAY PANEL AND FABRICATION METHOD THEREOF, AND SPLICED SCREEN May 30, 18 Jan 23, 20 , Not available
2020/0029,475 ELECTRONIC DEVICE INCLUDING STRUCTURE FOR PROTECTING DISPLAY DRIVER FROM STATIC ELECTRICITY Jun 18, 19 Jan 23, 20 , Not available
2020/0026,336 DATA CENTER AIR HANDLING UNIT INCLUDING UNINTERRUPTABLE COOLING FAN WITH WEIGHTED ROTOR AND METHOD OF USING THE SAME Sep 30, 19 Jan 23, 20 , Not available
2020/0029,428 Integrated Electronic Device with Flexible and Stretchable Substrate Sep 17, 19 Jan 23, 20 , Carnegie Mellon University
2020/0029,477 ELECTROMAGNETIC SHIELDING MATERIAL AND METHOD FOR PRODUCING THE SAME Sep 25, 18 Jan 23, 20 , Not available
2020/0029,470 DATA CENTER COOLANT SWITCH May 21, 19 Jan 23, 20 , Not available
2020/0028,376 DEVICE FOR PERFORMING WIRELESS CHARGING AND METHOD THEREOF Sep 30, 19 Jan 23, 20 , Not available
2020/0027,803 Methods and Apparatus for Package with Interposers Sep 30, 19 Jan 23, 20 , Not available
2020/0027,299 METAL DETECTION SYSTEMS AND METHODS Jul 17, 18 Jan 23, 20 , Not available
2020/0029,480 SUBSTRATE PROCESSING MACHINE Mar 30, 17 Jan 23, 20 , FUJI CORPORATION
2020/0027,653 MAGNETIC COUPLING COIL ELEMENT AND METHOD OF MANUFACTURING THE SAME Jul 15, 19 Jan 23, 20 , Not available
2020/0029,451 Portable Electronic Apparatus, Flexible Display Device Thereof and Driving Mechanism of Flexible Display Screen Jul 22, 19 Jan 23, 20 , Not available
2020/0024,492 USING MAGNETIC FIELDS TO INCREASE THE BONDING AREA OF AN ADHESIVE JOINT Nov 16, 18 Jan 23, 20 , Not available
2020/0029,435 PRINTED CIRCUIT BOARD INCLUDING SUB-CIRCUIT BOARD Sep 30, 19 Jan 23, 20 , SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2020/0027,808 RECONFIGURABLE COOLING ASSEMBLY FOR INTEGRATED CIRCUITRY Sep 30, 16 Jan 23, 20 , Not available
2020/0029,438 MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND SUBSTRATE WITH A BUILT-IN ELECTRONIC COMPONENT Jul 15, 19 Jan 23, 20 , Not available
2020/0029,462 COOLING MODULE AND ELECTRONIC UNIT COMPRISING SUCH A MODULE Sep 28, 17 Jan 23, 20 , Not available
2020/0029,432 DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME Sep 26, 19 Jan 23, 20 , Not available
2020/0029,456 ELECTRONIC UNIT WITH REVERSIBLE MODULES Sep 28, 17 Jan 23, 20 , Not available
2020/0029,441 Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method for Manufacturing Same Jul 03, 19 Jan 23, 20 , Not available

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Patents Issued To Date - By Filing Year

Average Time to Issuance

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