H05K

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Description

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
9896765 Pre-treatment process for electroless plating Jan 14, 15 Feb 20, 18 , Atotech Deutschland GmbH
9899328 Power semiconductor module Jun 30, 14 Feb 20, 18 , Mitsubishi Electric Corporation
9901019 Tape feeder and method for moving a carrier tape towards a picking position in a component mounting machine Jul 22, 16 Feb 20, 18 , Mycronic AB
9899715 Transmission line member and electronic apparatus Sep 06, 16 Feb 20, 18 , Murata Manufacturing Co Ltd.
9901012 System and method of providing computer resources Dec 04, 15 Feb 20, 18 , BASELAYER Technology, LLC
9899808 Enclosure, and window assembly and assembling method therefor Apr 22, 16 Feb 20, 18 , Eaton Corporation
9899239 Carrier ultra thin substrate Nov 06, 15 Feb 20, 18 , Apple Inc.
9901002 Structures having a molded liner attached to a substrate Feb 24, 16 Feb 20, 18 , Microsoft Technology Licensing, LLC.
9900994 Method for producing film and flexible metal-clad laminate Mar 01, 16 Feb 20, 18 , Kaneka Corporation
9898942 Hanging-strap information display device Jan 19, 15 Feb 20, 18 , Mitsubishi Electric Corporation
9899123 Nanowires-based transparent conductors Apr 04, 08 Feb 20, 18 , Not available
9900976 Integrated circuit package including floating package stiffener Dec 12, 16 Feb 20, 18 , Intel Corp.
9900990 Flexible printed circuit board Apr 04, 16 Feb 20, 18 , SAMSUNG DISPLAY CO., LTD.
9900997 Manufacturing method of a rigid flex board module Dec 31, 15 Feb 20, 18 , Unimicron Technology Corp.
9900982 Buttoned soldering pad for use with fine-pitch hot bar soldering Nov 12, 14 Feb 20, 18 , Finisar Corporation
9897262 Lighting device with overlapping and offset heat sinks Dec 18, 14 Feb 20, 18 , Philips Lighting Holding B.V.
9901020 Nozzle managing system Oct 16, 14 Feb 20, 18 , Fuji Machine Mfg Co. Ltd.
9896277 Component supply device Oct 29, 12 Feb 20, 18 , Fuji Machine Mfg Co. Ltd.
9901015 Display device Mar 24, 16 Feb 20, 18 , QISDA (SUZHOU) CO.,LTD; Qisda Corporation;
9901016 Electromagnetic-interference shielding device Apr 14, 17 Feb 20, 18 , Kinsus Interconnect Technology Corp.

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2018/0049,353 SETUP SUPPORTING DEVICE, COMPONENT MOUNTER, SETUP SUPPORTING METHOD Apr 03, 15 Feb 15, 18 , Yamaha Hatsudoki Kabushiki Kaisha
2018/0049,338 PROTECTOR Feb 25, 16 Feb 15, 18 , POWER SUPPORT CO. LTD.
2018/0049,346 MULTI-PHASE HEAT DISSIPATING DEVICE EMBEDDED IN AN ELECTRONIC DEVICE Aug 12, 16 Feb 15, 18 , Not available
2018/0046,315 Touch Panel and Method for Manufacturing the Same Oct 24, 17 Feb 15, 18 , Not available
2018/0047,334 Display with Vias for Concealed Printed Circuit and Component Attachment Oct 27, 17 Feb 15, 18 , Not available
2018/0045,383 ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND ELECTRONIC COMPONENT MOUNTING METHOD Jan 27, 16 Feb 15, 18 , SONY SEMICONDUCTOR SOLUTIONS CORPORATION
2018/0049,340 TOP LOADING CARTRIDGE Oct 19, 17 Feb 15, 18 , Not available
2018/0049,333 SYSTEM AND METHOD FOR SEISMICALLY STABILIZED UPS Aug 10, 16 Feb 15, 18 , Not available
2018/0049,343 ELECTRONIC EQUIPMENT DATA CENTER OR CO-LOCATION FACILITY DESIGNS AND METHODS OF MAKING AND USING THE SAME Aug 30, 17 Feb 15, 18 , Not available
2018/0049,314 FILTER COMPRISING PRINTED CIRCUIT BOARD AND BUSBARS Aug 10, 17 Feb 15, 18 , Not available
2018/0044,467 Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same Jul 31, 17 Feb 15, 18 , Not available
2018/0047,696 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Oct 12, 17 Feb 15, 18 , Not available
2018/0049,345 LIQUID SUPPLY DEVICE AND LIQUID COOLING SYSTEM Sep 19, 16 Feb 15, 18 , Not available
2018/0049,325 RESIN SUBSTRATE, COMPONENT-MOUNTED RESIN SUBSTRATE, AND METHOD OF MANUFACTURING COMPONENT-MOUNTED RESIN SUBSTRATE Oct 24, 17 Feb 15, 18 , Not available
2018/0046,232 HYBRID COOLING CONTROL OF A COMPUTING SYSTEM Apr 07, 15 Feb 15, 18 , Not available
2018/0049,319 LIGHT EMITTING DEVICE Oct 23, 17 Feb 15, 18 , Not available
2018/0047,314 DISPLAY DEVICE AND CHIP BONDING METHOD THEREOF Nov 05, 16 Feb 15, 18 , BOE Technology Group Co. Ltd.
2018/0049,321 METHODS FOR FORMING AND USING SILVER METAL Aug 09, 16 Feb 15, 18 , Not available
2018/0042,348 CASE FOR A MOBILE DEVICE WITH A SCREEN Oct 24, 17 Feb 15, 18 , Not available
2018/0048,044 HIGH-DENSITY STACKED GROUNDED COPLANAR WAVEGUIDES Oct 23, 17 Feb 15, 18 , Not available

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Patents Issued To Date - By Filing Year

Average Time to Issuance

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