H05K

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Description

PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
9976042 Conductive paste, method for forming an interconnection and electrical device Jan 29, 16 May 22, 18 , Nanyang Technological University; Lockheed Martin Corporation;
9977939 Programming and placement techniques for RFID tags without antennas Aug 23, 16 May 22, 18 , III Holdings 1, LLC
9980384 Circuit board and electronic apparatus including the same Jun 21, 13 May 22, 18 , Kyocera Corporation
9980391 Method of manufacturing an on-board wireless module architecture Mar 30, 15 May 22, 18 , Marvell International Ltd.
9978499 Methods for manufacturing integrated magnetic components and LED power supply Nov 07, 14 May 22, 18 , ZHEJIANG SHENGHUI LIGHTING CO., LTD
9979427 Privacy and security systems and methods of use Sep 09, 15 May 22, 18 , Not available
9980412 Flexible heat spreader Sep 29, 16 May 22, 18 , Intel Corp.
9979320 Electronic inverter assembly Aug 26, 16 May 22, 18 , Deere & Company
9980403 Case with connector and method of manufacturing case with connector Mar 02, 17 May 22, 18 , Yazaki -Corporation
9980394 Bonding electronic components to patterned nanowire transparent conductors Jul 18, 14 May 22, 18 , 3M Innovative Properties Company
9979803 Electronic device having latching portions Aug 17, 16 May 22, 18 , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
9976898 Optical sensing module with multi-directional optical sensing function Jul 24, 16 May 22, 18 , PixArt Imaging Inc.
9978705 Semiconductor substrate and semiconductor package structure having the same Jul 28, 16 May 22, 18 , Advanced Semiconductor Engineering, Inc.
9976711 Speed tape assembly for LED strip tapes in light box Aug 17, 16 May 22, 18 , Not available
9978721 Apparatus for stacked semiconductor packages and methods of fabricating the same Aug 19, 16 May 22, 18 , Samsung Electronics Co. Ltd.
9980374 Support entering into the fabrication of an electronic device, corresponding memory card connector, memory card read terminal and manufacturing method Oct 24, 14 May 22, 18 , INGENICO GROUP
9980389 Display device Jul 14, 16 May 22, 18 , Semiconductor Energy Laboratory Co., Ltd.
9977474 Heat dissipating assembly and electronic device using the same Mar 25, 16 May 22, 18 , Acer Incorporated
9977204 Optical apparatus, printed circuit board Sep 29, 16 May 22, 18 , Sumitomo Electric Industries Ltd.
9975638 Cradle device, cradle set, and terminal device Mar 24, 16 May 22, 18 , Panasonic Intellectual Property Management Co., Ltd.

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2018/0139,841 FLEXIBLE PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD Jul 06, 17 May 17, 18 , Not available
2018/0134,920 SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD May 23, 16 May 17, 18 , Not available
2018/0139,864 HEAT TRANSPORT DEVICE AND ELECTRONIC DEVICE Jan 12, 18 May 17, 18 , Fujitsu Limited
2018/0132,822 ULTRASOUND SYSTEM AND APPARATUS HAVING A PORTABLE STORAGE BIN Nov 17, 16 May 17, 18 , General Electric Company
2018/0135,976 BOARD INSPECTION MACHINE Jun 24, 15 May 17, 18 , FUJI MACHINE MFG. CO. LTD
2018/0139,848 PRODUCTION METHOD FOR COPPER-CLAD LAMINATE PLATE Jan 31, 17 May 17, 18 , MITSUI MINING & SMELTING CO., LTD.
2018/0139,857 Protective Enclosure For Encasing an Electronic Device Nov 13, 17 May 17, 18 , Not available
2018/0132,721 HOUSING FOR A CIRCUIT THAT IS TO BE IMPLANTED IN-VIVO AND PROCESS OF MAKING THE SAME Jul 24, 17 May 17, 18 , Senseonics, Incorporated
2018/0135,196 ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH CONTAINING SAID ADDITIVE, AND COPPER ELECTROPLATING METHOD USING SAID COPPER ELECTROPLATING BATH Dec 21, 17 May 17, 18 , Adeka Corporation
2018/0138,615 STRUCTURE FOR CONNECTING BOARD AND CONNECTOR, BOARD, AND METHOD FOR CONNECTING BOARD AND CONNECTOR Nov 14, 17 May 17, 18 , Hirose Electric Co., Ltd.
2018/0137,979 COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON Feb 17, 17 May 17, 18 , Not available
2018/0139,840 FABRICATION METHOD OF SUBSTRATE STRUCTURE Jan 11, 18 May 17, 18 , Not available
2018/0138,612 ADAPTIVE CARD AND MOTHERBOARD HAVING THE SAME Nov 15, 17 May 17, 18 , Not available
2018/0138,669 ENCLOSURE, AND WINDOW ASSEMBLY AND ASSEMBLING METHOD THEREFOR Jan 11, 18 May 17, 18 , Eaton Corporation
2018/0138,440 DISPLAY MODULE AND A DISPLAY DEVICE INCLUDING THE SAME Aug 10, 17 May 17, 18 , Not available
2018/0136,699 HINGE ASSEMBLY FOR A COMPUTING DEVICE Jun 19, 15 May 17, 18 , Not available
2018/0136,559 LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD Oct 12, 16 May 17, 18 , Not available
2018/0139,847 SEMICONDUCTOR DEVICE Jan 12, 18 May 17, 18 , Not available
2018/0135,350 ONE OR MORE DOORS WITH ONE OR MORE ANGLED SIDE FLANGES FOR ELECTRICAL PANEL ENCLOSURE Nov 17, 17 May 17, 18 , Cooper Technologies Company
2018/0139,851 MANUFACTURING A PRODUCT USING A SOLDERING PROCESS Jan 15, 18 May 17, 18 , Not available

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Patents Issued To Date - By Filing Year

Average Time to Issuance

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