B23H 5/08

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Description

Class  B23H : WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL


Subclass 5/08: Combined machining Electrochemical machining combined with mechanical working, e.g. grinding or honing Electrolytic grinding

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12123271 Downhole toolMay 26, 21Oct 22, 24DSOLVE AS
11491565 Probe forming deviceDec 23, 19Nov 08, 22METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
11248429 Downhole toolSep 27, 17Feb 15, 22INNOVATION ENERGY AS
11173561 Method for processing probeAug 26, 20Nov 16, 21METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
10821532 Advanced herringbone gear designJan 30, 17Nov 03, 20Sikorsky Aircraft Corporation
10646938 Precision electrochemical machine for gear manufactureJan 11, 18May 12, 20Sikorsky Aircraft Corporation
10625397 Grind machining apparatusDec 13, 17Apr 21, 20METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
10603731 Method and apparatus for polishing metal parts with complex geometriesNov 25, 15Mar 31, 20General Electric Company
9956631 Machine for machining gear teeth and gear teeth machining methodFeb 15, 17May 01, 18Sikorsky Aircraft Corporation
9804067 Observation and photography apparatusJun 18, 13Oct 31, 17KAGOSHIMA UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, NAKAYAMADENKI CO., LTD.,
9751142 High-frequency-vibration-assisted electrolytic grinding method and device thereforApr 12, 13Sep 05, 17MICRON MACHINERY CO., LTD
9597743 Machine for machining gear teeth and gear teeth machining methodJan 17, 14Mar 21, 17SIKORSKY AIRCRAFT CORPORATION
9403228 Method and apparatus for pulsed electrochemical grindingJul 29, 14Aug 02, 16FARADAY TECHNOLOGY, INC.
9375821 Electrically assisted chemical-mechanical planarization (EACMP) system and method thereofMay 27, 12Jun 28, 16NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
9214359 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substratesMay 19, 14Dec 15, 15MICRON TECHNOLOGY, INC.
8974655 Methods of planarization and electro-chemical mechanical polishing processesMar 24, 08Mar 10, 15MICRON TECHNOLOGY, INC.
8906221 Electrochemical grinding tool and methodAug 06, 12Dec 09, 14GENERAL ELECTRIC COMPANY
8834689 Device, apparatus, and method for abrasive electrochemical finishingMar 10, 11Sep 16, 14GENERAL ELECTRIC COMPANY
8747625 Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafersJul 14, 10Jun 10, 14NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
7815778 Electro-chemical mechanical planarization pad with uniform polish performanceNov 21, 06Oct 19, 10SEMIQUEST, INC.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0018,486 SYSTEM AND METHOD OF THINNING WAFER SUBSTRATENov 15, 22Jan 16, 25Not available
2024/0307,988 HYBRID ELECTROCHEMICAL AND ABRASIVE FLUID POLISHINGJun 01, 22Sep 19, 24Not available
2024/0246,161 AN ELECTRICAL MACHINING DEVICEMay 27, 22Jul 25, 24Not available
2023/0339,032 ANODIC OXIDATION-ASSISTED GRINDING APPARATUS AND ANODIC OXIDATION-ASSISTED GRINDING METHODApr 20, 23Oct 26, 23JTEKT MACHINE SYSTEMS CORPORATION
2021/0387,274 ELECTROLYSIS AND GRINDING COMBINED MACHINING DEVICE AND METHODMar 17, 21Dec 16, 21JIANGXI UNIVERSITY OF SCIENCE AND TECHNOLOGY
2019/0210,130 PRECISION ELECTROCHEMICAL MACHINE FOR GEAR MANUFACTUREJan 11, 18Jul 11, 19Not available

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