B23H 5/10

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Description

Class  B23H : WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL


Subclass 5/10: Combined machining Electrodes specially adapted therefor or their manufacture (B23H 1/04, B23H 3/04 take precedence)

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11992890 Electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materialsApr 29, 22May 28, 24Changsha University of Science and Technology
9254530 Method for removing material from a component, and electrodeDec 05, 08Feb 09, 16MTU AERO ENGINES GMBH
9090983 Electrode for electrochemical processes and method for obtaining the sameAug 21, 12Jul 28, 15Industrie De Nora S.p.A.
9044746 Photocatalyst with enhanced stability for hydrogen production and oxidative reactionsSep 16, 11Jun 02, 15NORTHWESTERN UNIVERSITY
8932442 Electrode for oxygen evolution in industrial electrolytic processesJan 26, 12Jan 13, 15Industrie De Nora S.p.A.
8932977 Spinel catalysts for water and hydrocarbon oxidationJun 24, 11Jan 13, 15RUTGERS, THE STATE UNIVERSITY OF NEW JERSEY
8869873 Method for manufacturing anodesApr 04, 11Oct 28, 14Not available
8747625 Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafersJul 14, 10Jun 10, 14NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
8097131 Electrochemical machining method and electrochemical machining deviceJun 23, 06Jan 17, 12IHI CORPORATION, APC Aerospecialty Inc.,
7976989 Precious metal oxide catalyst for water electrolysisOct 29, 04Jul 12, 11UMICORE AG & CO. KG
7815778 Electro-chemical mechanical planarization pad with uniform polish performanceNov 21, 06Oct 19, 10SEMIQUEST, INC.
6946062 Electropolish/grinding means for an inner surface of a long tubeMar 01, 02Sep 20, 05INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0018,486 SYSTEM AND METHOD OF THINNING WAFER SUBSTRATENov 15, 22Jan 16, 25Not available

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