B23K 1/00

Sub-Class

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/00: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34)

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10605637 Probe tip for air data probeDec 29, 17Mar 31, 20Honeywell International Inc.
10605010 Fixed cutter drill bit having cutter orienting systemMay 04, 18Mar 31, 20Varel Europe S.A.S.
10607907 Ceramic-aluminum conjugate, power module substrate, and power moduleAug 29, 16Mar 31, 20Mitsubishi Materials Corporation; Japan as represented by President of the University of Tokyo;
10603732 Sinter-brazed componentAug 04, 15Mar 31, 20SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
10601149 Window assembly with casing for solder jointAug 15, 14Mar 24, 20AGC Automotive Americas R&D, Inc.
10601404 Contactless readable programmable transponder to monitor chip joinAug 20, 18Mar 24, 20IBM Corporation
10598030 Assembly, treated article, and process of treating a turbine componentJan 10, 17Mar 24, 20General Electric Company
10596649 Heat transfer device for producing a soldered connection of electrical componentsDec 09, 15Mar 24, 20Pink GmbH Thermosysteme
10595403 Ceramic circuit board and semiconductor moduleJan 11, 19Mar 17, 20KABUSHIKI KAISHA TOSHIBA; TOSHIBA MATERIALS CO., LTD.;
10593584 Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameNov 02, 16Mar 17, 20Component Re-Engineering Company, Inc.
10595424 Hermetic sealing lid memberDec 24, 15Mar 17, 20Hitachi Metals LTD
10584602 Multi-airfoil split and rejoin methodDec 16, 13Mar 10, 20United Technologies Corporation
10583302 Gold wetting on ceramic surfaces upon coating with titanium hydrideSep 22, 17Mar 10, 20Greatbatch Ltd.
10583510 Heating and cooling deviceApr 04, 17Mar 10, 20Fuji Electric Co. Ltd.
10586781 Bonding apparatus and method of estimating position of landing point of bonding toolDec 09, 16Mar 10, 20SHINKAWA LTD.
10588219 Metallized particle interconnect with solder componentsOct 09, 14Mar 10, 20International Business Machine Corporation
10576567 Reflow soldering oven with at least one gas purification system comprising a catalyst unitJan 26, 16Mar 03, 20Illinois Tool Works Inc.
10576565 Laser welding of copper with reaction materialsSep 23, 16Mar 03, 20GM Global Technology Operations LLC
10576587 Brazing conceptSep 11, 14Mar 03, 20Alfa Laval Corporate AB
10576566 Solder paste misprint cleaningJun 06, 16Mar 03, 20International Business Machine Corporation

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2020/0094,335 Soldering ApparatusMay 08, 18Mar 26, 20Not available
2020/0094,339 Wire Automatic Soldering SystemNov 15, 19Mar 26, 20Tyco Electronics (Shanghai) Co. Ltd.; TE CONNECTIVITY SERVICES GMBH; Measurement Specialties (Chengdu) Ltd.; Shenzhen AMI Technology Co. Ltd.;
2020/0086,411 BONDING MATERIALS OF DISSIMILAR COEFFICIENTS OF THERMAL EXPANSIONNov 21, 19Mar 19, 20Not available
2020/0086,412 BONDING MATERIALS OF DISSIMILAR COEFFICIENTS OF THERMAL EXPANSIONNov 21, 19Mar 19, 20Not available
2020/0023,452 ATTACHMENT OF STRUCTURES HAVING DIFFERENT PHYSICAL CHARACTERISTICSSep 10, 18Jan 23, 20Not available
2020/0009,671 METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEATSINKFeb 28, 18Jan 09, 20Not available
2019/0366,458 DEVICE ADAPTED TO DOSING PASTY SUBSTANCESSep 12, 17Dec 05, 19Not available
2019/0364,668 VARIABLE TEMPERATURE CONTROLLED SOLDERING IRONAug 05, 19Nov 28, 19Not available
2019/0337,072 METHOD OF FABRICATING HEAT EXCHANGER WITH MICRO TUBES AND FINSMay 04, 18Nov 07, 19Not available
2019/0337,073 BRAZE REPAIR OF TURBOMACHINE ENGINE COMPONENTMay 26, 17Nov 07, 19Not available
2019/0329,344 COMPOSITE COMPONENT HAVING ANGLED BRAZE JOINT, COUPON BRAZING METHOD AND RELATED STORAGE MEDIUMJul 10, 19Oct 31, 19Not available
2019/0329,343 AUTO-ADAPTIVE BRAZE DISPENSING SYSTEMS AND METHODSApr 26, 18Oct 31, 19United Technologies Corporation
2019/0314,915 Resistance Spot Welding Workpiece Stack-Ups Having Steel Workpieces With Surface CoatingsApr 13, 18Oct 17, 19Not available
2019/0314,914 Resistance Spot Brazing Workpiece Stack-Ups Having One Or More Thin-Gauge Steel WorkpiecesApr 13, 18Oct 17, 19Not available
2019/0319,005 ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAMEJun 27, 19Oct 17, 19Not available
2019/0320,536 PRINTING DEVICE AND PRINTING METHOD FOR APPLYING A VISCOUS OR PASTY MATERIALOct 06, 17Oct 17, 19Not available
2019/0314,937 Sn Whisker Growth Mitigation Using NiO SublayersApr 11, 19Oct 17, 19The University of Toledo
2019/0291,199 Semiconductor Processing Equipment With High Temperature Resistant Nickel Alloy Joints And Methods For Making SameNov 28, 18Sep 26, 19Not available
2019/0291,879 SURFACE MODIFIED HEATER ASSEMBLYMar 23, 18Sep 26, 19Not available
2019/0283,163 METHOD FOR BONDING LARGE MODULES, AND BONDING ARRANGEMENTMay 31, 19Sep 19, 19Hesse GmbH

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Patents Issued To Date - By Filing Year

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