B23K 1/002

Sub-Class

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/002: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of induction heating

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10556285 Metal joined body and manufacturing method for metal joined bodyOct 26, 15Feb 11, 20Kobe Steel, Ltd.
10547152 Electrical connector assembly methodJan 12, 18Jan 28, 20LOTES CO., LTD
10543548 Apparatuses and methods for induction heatingApr 16, 09Jan 28, 20US Synthetic Corporation
10500663 Method of tight crack braze repair using acousticsAug 31, 16Dec 10, 19Siemens Energy Inc.
10486262 Method and system for joining workpiecesMay 09, 13Nov 26, 19Carrier Corporation
10406636 Thermal interface material and methodMar 14, 16Sep 10, 19Purdue Research Foundation
10384284 Carbide wear surface and method of manufactureSep 26, 15Aug 20, 19Syntex Super Materials, Inc.
10352484 Exhaust systemJan 24, 11Jul 16, 19FAURECIA EMISSIONS CONTROL TECHNOLOGIES, GERMANY GMBH
10335879 Method and apparatus for forming a vehicle window assembly using induction solderingSep 15, 17Jul 02, 19Pilkington Group Limited
10322471 Low temperature high reliability alloy for solder hierarchyJul 15, 15Jun 18, 19Alpha Assembly Solutions Inc.
10305239 Pane comprising an electrical connection elementApr 17, 12May 28, 19SAINT - GOBAIN GLASS FRANCE
10293424 Braze for ceramic and ceramic matrix composite componentsMay 02, 16May 21, 19Rolls-Royce Corporation
10245667 Chip joining by induction heatingJul 19, 17Apr 02, 19Globalfoundries Inc.
10227183 Conveyance apparatusDec 01, 17Mar 12, 19Senju Metal Industry Co., Ltd.
10220462 Apparatus for brazing radial bearings and related methodsJan 10, 17Mar 05, 19US Synthetic Corporation
10112248 Method of creating a bonded structure and apparatuses for sameSep 08, 15Oct 30, 18CELLTECH METALS, INC.
10095025 Optical unit, endoscope apparatus, and manufacturing method of optical unitAug 29, 14Oct 09, 18FUJIFILM Corporation
10050012 Method for semiconductor die removal reworkNov 25, 15Aug 14, 18IBM Corporation
10022968 Printing plate assembly and method for an ink jet print head assemblyAug 26, 14Jul 17, 18Illinois Tool Works Inc.
10006300 Armoring sealing fins of TiAl vanes by induction brazing hard-material particlesNov 06, 12Jun 26, 18MTU Aero Engines AG

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2019/0375,036 SOLDERING SYSTEM, CONTROL DEVICE, CONTROL METHOD, AND PROGRAMJan 26, 18Dec 12, 19MITSUBISHI ELECTRIC CORPORATION
2019/0070,684 APPARATUS AND METHOD FOR REPAIRING DAMAGE TO PIPE COATINGSAug 08, 18Mar 07, 19Not available
2019/0054,556 METHOD FOR BONDING A CYLINDER LINER WITHIN A CYLINDER BORE OF A VEHICLE ENGINE BLOCKAug 15, 17Feb 21, 19Not available
2018/0264,574 JOINING DEVICE AND METHOD FOR PRODUCING AN EXHAUST GAS SYSTEMMar 07, 18Sep 20, 18Not available
2018/0242,405 METHOD OF BRAZING A TREATMENT AREA OF A LOAD-BEARING COMPONENTFeb 23, 17Aug 23, 18Not available
2018/0099,340 Staggered-teeth diamond saw blade and preparation method thereofDec 13, 17Apr 12, 18Jiangsu Fengtai Tools Co. Ltd.
2018/0065,201 SOLDER PROCESSING DEVICEMar 25, 16Mar 08, 18AND Co., Ltd.
2018/0051,371 METHODS OF FORMING ROTARY SPUTTERING TARGETMar 17, 16Feb 22, 18VITAL THIN FILM MATERIALS (GUANGDONG) CO., LTD.
2017/0341,188 SOLDER MATERIALApr 04, 17Nov 30, 17PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
2017/0297,130 METHOD FOR SHORTENING THE PROCESS TIME DURING THE SOLDERING OF ELECTRIC OR ELECTRONIC COMPONENTS BY MEANS OF ELECTROMAGNETIC INDUCTION HEATINGSep 10, 15Oct 19, 17FEW FAHRZEUGELEKTRIKWERK GMBH & CO. KG
2017/0203,377 HEATING AND COOLING DEVICEApr 04, 17Jul 20, 17FUJI ELECTRIC CO., LTD.
2017/0151,639 BRAZING Ni-BASE AMORPHOUS ALLOY RIBBON AND STAINLESS STEEL BONDED BODY USING SAMEMay 28, 15Jun 01, 17HITACHI METALS, LTD.
2016/0199,928 METHOD OF MANUFACTURING PROTECTIVE STRUCTURE AND METHOD OF MANUFACTURING PROTECTIVE STRUCTURE OF COMPOSITE ELECTRIC WIREJan 14, 16Jul 14, 16YAZAKI CORPORATION
2015/0115,070 PRINTING PLATE ASSEMBLY AND METHOD FOR AN INK JET PRINT HEAD ASSEMBLYAug 26, 14Apr 30, 15ILLINOIS TOOL WORKS INC.
2015/0024,642 BONDABLE ELECTRICAL CONNECTOR AND METHOD OF UTILIZING SAMEFeb 08, 13Jan 22, 15PILKINGTON GROUP LIMITED
2014/0183,181 METHOD AND APPARATUS FOR FORMING A VEHICLE WINDOW ASSEMBLY USING INDUCTION SOLDERINGDec 05, 13Jul 03, 14PILKINGTON GROUP LIMITED
2014/0091,152 TEMPERATURE SENSOR USING ALUMINUM CAPILLARYSep 28, 12Apr 03, 14Invensys Appliance Controls South America

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Patents Issued To Date - By Filing Year

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