Class B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
Subclass 1/008: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering within a furnace (B23K 1/012 takes precedence)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 10563920 | Oven-style nozzle for reworking operations involving bottom-side terminated components or other components | Dec 08, 14 | Feb 18, 20 | Raytheon Company |
| 10561405 | Method for manufacturing a biological fluid sensor | Apr 13, 17 | Feb 18, 20 | CoreSyte, Inc. |
| 10559409 | Process for manufacturing a leadless feedthrough for an active implantable medical device | Mar 25, 19 | Feb 11, 20 | Greatbatch Ltd. |
| 10537031 | Reflow soldering apparatus, system and method | Mar 21, 18 | Jan 14, 20 | S.sup.3 Service Support Specialties Inc. |
| 10510606 | Protected chip-scale package (CSP) pad structure | Apr 26, 19 | Dec 17, 19 | Taiwan Semiconductor Manufacturing Co Ltd. |
| 10406636 | Thermal interface material and method | Mar 14, 16 | Sep 10, 19 | Purdue Research Foundation |
| 10365048 | Multiply-wound tube, method of manufacturing multiply-wound tube, and device for manufacturing multiply-wound tube | Jul 29, 16 | Jul 30, 19 | SANOH INDUSTRIAL CO., LTD. |
| 10366836 | Electronic component structures with reduced microphonic noise | Oct 04, 16 | Jul 30, 19 | Kemet Electronics Corporation |
| 10350713 | No clean flux composition and methods for use thereof | Oct 24, 17 | Jul 16, 19 | IBM Corporation |
| 10335880 | Racks for high-temperature metal processing | Feb 17, 16 | Jul 02, 19 | H. C. Starck Inc. |
| 10323890 | Method for joining metal parts | Sep 10, 14 | Jun 18, 19 | Alfa Laval Corporate AB |
| 10307849 | Vacuum-processing device and control method therefor, and vacuum soldering device and control method therefor | Aug 28, 15 | Jun 04, 19 | Senju Metal Industry Co., Ltd. |
| 10302372 | Plate fin heat exchanger and manufacturing method for heat exchanger corrugated fins | Feb 12, 15 | May 28, 19 | Sumitomo Precision Products Co. Ltd. |
| 10293439 | Soldering apparatus and flux-applying device | Feb 17, 16 | May 21, 19 | Senju Metal Industry Co., Ltd. |
| 10287215 | Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices | Apr 17, 17 | May 14, 19 | Component Re-Engineering Company, Inc. |
| 10259082 | Self brazing material and a method of making the material | Apr 25, 16 | Apr 16, 19 | EMS Engineered Materials Solution, LLC |
| 10252364 | Soldering apparatus and vacuum-soldering method | Jul 23, 13 | Apr 09, 19 | Senju Metal Industry Co., Ltd. |
| 10249415 | Process for manufacturing a leadless feedthrough for an active implantable medical device | Jan 05, 18 | Apr 02, 19 | Greatbatch Ltd. |
| 10227183 | Conveyance apparatus | Dec 01, 17 | Mar 12, 19 | Senju Metal Industry Co., Ltd. |
| 10213859 | Racks for high-temperature metal processing | Feb 17, 16 | Feb 26, 19 | H. C. Starck Inc. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2019/0337,071 | RACKS FOR HIGH-TEMPERATURE METAL PROCESSING | May 20, 19 | Nov 07, 19 | Not available |
| 2019/0314,916 | BRAZING FURNACE AND ALUMINUM-MATERIAL BRAZING METHOD | Nov 28, 17 | Oct 17, 19 | Not available |
| 2019/0314,917 | VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS | Feb 12, 19 | Oct 17, 19 | Not available |
| 2019/0210,133 | RACKS FOR HIGH-TEMPERATURE METAL PROCESSING | Jan 10, 19 | Jul 11, 19 | Not available |
| 2018/0190,430 | Leadless Multi-Layered Ceramic Capacitor Stack | Mar 01, 18 | Jul 05, 18 | Kemet Electronics Corporation |
| 2018/0161,908 | APPARATUS AND METHOD FOR BRAZING | Feb 12, 18 | Jun 14, 18 | Not available |
| 2018/0141,166 | ALUMINUM ALLOY BRAZING SHEET | Jan 22, 18 | May 24, 18 | Not available |
| 2017/0318,676 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOF | Jul 17, 17 | Nov 02, 17 | NITTO DENKO CORPORATION |
| 2017/0282,271 | BRAZING FURNACE AND ALUMINUM-MATERIAL BRAZING METHOD | Jul 17, 15 | Oct 05, 17 | UACJ CORPORATION |
| 2017/0151,637 | ALUMINUM-ALLOY BRAZING SHEET | Jul 29, 15 | Jun 01, 17 | UACJ CORPORATION |
| 2017/0072,491 | Soldering Device Minimizing Voids When Soldering Printed Circuit Boards | Nov 02, 16 | Mar 16, 17 | Not available |
| 2017/0028,494 | APPARATUS AND METHOD FOR SOLDERING JOINING PARTNERS, SAID APPARATUS COMPRISING A VACUUM CHAMBER AND PLATE ELEMENTS | Mar 31, 15 | Feb 02, 17 | CENTROTHERM PHOTOVOLTAICS AG |
| 2015/0266,139 | Nickel-Iron-Phosphorus Brazing Alloys | Mar 18, 14 | Sep 24, 15 | METGLAS, INC. |
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