B23K 1/008

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/008: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering within a furnace (B23K 1/012 takes precedence)

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10563920 Oven-style nozzle for reworking operations involving bottom-side terminated components or other componentsDec 08, 14Feb 18, 20Raytheon Company
10561405 Method for manufacturing a biological fluid sensorApr 13, 17Feb 18, 20CoreSyte, Inc.
10559409 Process for manufacturing a leadless feedthrough for an active implantable medical deviceMar 25, 19Feb 11, 20Greatbatch Ltd.
10537031 Reflow soldering apparatus, system and methodMar 21, 18Jan 14, 20S.sup.3 Service Support Specialties Inc.
10510606 Protected chip-scale package (CSP) pad structureApr 26, 19Dec 17, 19Taiwan Semiconductor Manufacturing Co Ltd.
10406636 Thermal interface material and methodMar 14, 16Sep 10, 19Purdue Research Foundation
10365048 Multiply-wound tube, method of manufacturing multiply-wound tube, and device for manufacturing multiply-wound tubeJul 29, 16Jul 30, 19SANOH INDUSTRIAL CO., LTD.
10366836 Electronic component structures with reduced microphonic noiseOct 04, 16Jul 30, 19Kemet Electronics Corporation
10350713 No clean flux composition and methods for use thereofOct 24, 17Jul 16, 19IBM Corporation
10335880 Racks for high-temperature metal processingFeb 17, 16Jul 02, 19H. C. Starck Inc.
10323890 Method for joining metal partsSep 10, 14Jun 18, 19Alfa Laval Corporate AB
10307849 Vacuum-processing device and control method therefor, and vacuum soldering device and control method thereforAug 28, 15Jun 04, 19Senju Metal Industry Co., Ltd.
10302372 Plate fin heat exchanger and manufacturing method for heat exchanger corrugated finsFeb 12, 15May 28, 19Sumitomo Precision Products Co. Ltd.
10293439 Soldering apparatus and flux-applying deviceFeb 17, 16May 21, 19Senju Metal Industry Co., Ltd.
10287215 Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesApr 17, 17May 14, 19Component Re-Engineering Company, Inc.
10259082 Self brazing material and a method of making the materialApr 25, 16Apr 16, 19EMS Engineered Materials Solution, LLC
10252364 Soldering apparatus and vacuum-soldering methodJul 23, 13Apr 09, 19Senju Metal Industry Co., Ltd.
10249415 Process for manufacturing a leadless feedthrough for an active implantable medical deviceJan 05, 18Apr 02, 19Greatbatch Ltd.
10227183 Conveyance apparatusDec 01, 17Mar 12, 19Senju Metal Industry Co., Ltd.
10213859 Racks for high-temperature metal processingFeb 17, 16Feb 26, 19H. C. Starck Inc.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2019/0337,071 RACKS FOR HIGH-TEMPERATURE METAL PROCESSINGMay 20, 19Nov 07, 19Not available
2019/0314,916 BRAZING FURNACE AND ALUMINUM-MATERIAL BRAZING METHODNov 28, 17Oct 17, 19Not available
2019/0314,917 VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUSFeb 12, 19Oct 17, 19Not available
2019/0210,133 RACKS FOR HIGH-TEMPERATURE METAL PROCESSINGJan 10, 19Jul 11, 19Not available
2018/0190,430 Leadless Multi-Layered Ceramic Capacitor StackMar 01, 18Jul 05, 18Kemet Electronics Corporation
2018/0161,908 APPARATUS AND METHOD FOR BRAZINGFeb 12, 18Jun 14, 18Not available
2018/0141,166 ALUMINUM ALLOY BRAZING SHEETJan 22, 18May 24, 18Not available
2017/0318,676 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOFJul 17, 17Nov 02, 17NITTO DENKO CORPORATION
2017/0282,271 BRAZING FURNACE AND ALUMINUM-MATERIAL BRAZING METHODJul 17, 15Oct 05, 17UACJ CORPORATION
2017/0151,637 ALUMINUM-ALLOY BRAZING SHEETJul 29, 15Jun 01, 17UACJ CORPORATION
2017/0072,491 Soldering Device Minimizing Voids When Soldering Printed Circuit BoardsNov 02, 16Mar 16, 17Not available
2017/0028,494 APPARATUS AND METHOD FOR SOLDERING JOINING PARTNERS, SAID APPARATUS COMPRISING A VACUUM CHAMBER AND PLATE ELEMENTSMar 31, 15Feb 02, 17CENTROTHERM PHOTOVOLTAICS AG
2015/0266,139 Nickel-Iron-Phosphorus Brazing AlloysMar 18, 14Sep 24, 15METGLAS, INC.

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Top Owners in This Subclass

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Patents Issued To Date - By Filing Year

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