Class B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
Subclass 1/012: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering with the use of hot gas
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 10563920 | Oven-style nozzle for reworking operations involving bottom-side terminated components or other components | Dec 08, 14 | Feb 18, 20 | Raytheon Company |
| 10500662 | Device for feeding a stream of hot gas | Jun 26, 14 | Dec 10, 19 | ERSA GMBH |
| 10486262 | Method and system for joining workpieces | May 09, 13 | Nov 26, 19 | Carrier Corporation |
| 10478911 | Method of joining metals and non-metals with foil and products so joined | Oct 18, 16 | Nov 19, 19 | MHI Health Devices, LLC |
| 10406636 | Thermal interface material and method | Mar 14, 16 | Sep 10, 19 | Purdue Research Foundation |
| 10386134 | Heat transfer tube and method for producing same | Nov 21, 17 | Aug 20, 19 | Mitsubishi Aluminum Co., Ltd. |
| 10350713 | No clean flux composition and methods for use thereof | Oct 24, 17 | Jul 16, 19 | IBM Corporation |
| 10305239 | Pane comprising an electrical connection element | Apr 17, 12 | May 28, 19 | SAINT - GOBAIN GLASS FRANCE |
| 10269762 | Rework process and tool design for semiconductor package | Oct 29, 15 | Apr 23, 19 | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 10237926 | Inductive heater for area array rework system and soldering handpieces | Mar 25, 16 | Mar 19, 19 | PACE, INC. |
| 10157877 | Semiconductor device and manufacturing method of semiconductor device | Oct 08, 15 | Dec 18, 18 | Fuji Electric Co. Ltd. |
| 10144079 | Soldering system | Jul 19, 17 | Dec 04, 18 | FANUC CORPORATION |
| 10095025 | Optical unit, endoscope apparatus, and manufacturing method of optical unit | Aug 29, 14 | Oct 09, 18 | FUJIFILM Corporation |
| 10065274 | Joining to aluminum | Aug 29, 14 | Sep 04, 18 | Not available |
| 9974191 | Method of manufacturing semiconductor device, substrate processing apparatus and recording medium | Jul 22, 15 | May 15, 18 | Hitachi Kokusai Electric Inc. |
| 9966487 | Strain relief apparatus for solar modules | Dec 30, 15 | May 08, 18 | Solarcity Corporation |
| 9914185 | Aluminum alloy brazing sheet | May 02, 13 | Mar 13, 18 | UACJ CORPORATION |
| 9899554 | Method of installing a strain relief apparatus to a solar cell | Dec 30, 15 | Feb 20, 18 | SOLARCITY CORPORATION |
| 9875985 | Flip-chip bonder with induction coils and a heating element | Nov 18, 14 | Jan 23, 18 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 9857128 | Heat transfer tube and method for producing same | Mar 25, 13 | Jan 02, 18 | MITSUBISHI ALUMINUM CO., LTD. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2019/0388,991 | FLUX COLLECTION METHOD AND FLUX COLLECTION APPARATUS | Feb 12, 19 | Dec 26, 19 | Not available |
| 2018/0141,166 | ALUMINUM ALLOY BRAZING SHEET | Jan 22, 18 | May 24, 18 | Not available |
| 2018/0126,474 | SOLDERING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC UNIT | Oct 27, 17 | May 10, 18 | Not available |
| 2018/0015,558 | SOLDERING APPARATUS | Feb 25, 15 | Jan 18, 18 | FUJI MACHINE MFG. CO., LTD. |
| 2015/0174,686 | METHOD AND DEVICE FOR JOINING CONDUCTORS TO SUBSTRATES | Feb 25, 15 | Jun 25, 15 | MASCHINENFABRIK REINHAUSEN GMBH |
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