B23K 1/012

Sub-Class

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/012: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering with the use of hot gas

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10563920 Oven-style nozzle for reworking operations involving bottom-side terminated components or other componentsDec 08, 14Feb 18, 20Raytheon Company
10500662 Device for feeding a stream of hot gasJun 26, 14Dec 10, 19ERSA GMBH
10486262 Method and system for joining workpiecesMay 09, 13Nov 26, 19Carrier Corporation
10478911 Method of joining metals and non-metals with foil and products so joinedOct 18, 16Nov 19, 19MHI Health Devices, LLC
10406636 Thermal interface material and methodMar 14, 16Sep 10, 19Purdue Research Foundation
10386134 Heat transfer tube and method for producing sameNov 21, 17Aug 20, 19Mitsubishi Aluminum Co., Ltd.
10350713 No clean flux composition and methods for use thereofOct 24, 17Jul 16, 19IBM Corporation
10305239 Pane comprising an electrical connection elementApr 17, 12May 28, 19SAINT - GOBAIN GLASS FRANCE
10269762 Rework process and tool design for semiconductor packageOct 29, 15Apr 23, 19Taiwan Semiconductor Manufacturing Company, Ltd.
10237926 Inductive heater for area array rework system and soldering handpiecesMar 25, 16Mar 19, 19PACE, INC.
10157877 Semiconductor device and manufacturing method of semiconductor deviceOct 08, 15Dec 18, 18Fuji Electric Co. Ltd.
10144079 Soldering systemJul 19, 17Dec 04, 18FANUC CORPORATION
10095025 Optical unit, endoscope apparatus, and manufacturing method of optical unitAug 29, 14Oct 09, 18FUJIFILM Corporation
10065274 Joining to aluminumAug 29, 14Sep 04, 18Not available
9974191 Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumJul 22, 15May 15, 18Hitachi Kokusai Electric Inc.
9966487 Strain relief apparatus for solar modulesDec 30, 15May 08, 18Solarcity Corporation
9914185 Aluminum alloy brazing sheetMay 02, 13Mar 13, 18UACJ CORPORATION
9899554 Method of installing a strain relief apparatus to a solar cellDec 30, 15Feb 20, 18SOLARCITY CORPORATION
9875985 Flip-chip bonder with induction coils and a heating elementNov 18, 14Jan 23, 18INTERNATIONAL BUSINESS MACHINES CORPORATION
9857128 Heat transfer tube and method for producing sameMar 25, 13Jan 02, 18MITSUBISHI ALUMINUM CO., LTD.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2019/0388,991 FLUX COLLECTION METHOD AND FLUX COLLECTION APPARATUSFeb 12, 19Dec 26, 19Not available
2018/0141,166 ALUMINUM ALLOY BRAZING SHEETJan 22, 18May 24, 18Not available
2018/0126,474 SOLDERING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC UNITOct 27, 17May 10, 18Not available
2018/0015,558 SOLDERING APPARATUSFeb 25, 15Jan 18, 18FUJI MACHINE MFG. CO., LTD.
2015/0174,686 METHOD AND DEVICE FOR JOINING CONDUCTORS TO SUBSTRATESFeb 25, 15Jun 25, 15MASCHINENFABRIK REINHAUSEN GMBH

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Patents Issued To Date - By Filing Year

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