B26F 1/28

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Description

Class  B26F : PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING


Subclass 1/28: Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor (perforating by laser beam B23K 26/00; subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B 1/04; perforating by sand-blasting B24C; punching cards or tapes for statistical and record purposes G06K 1/00) Perforating by non-mechanical means, e.g. by fluid jet by electrical discharges

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11224842 Method and apparatus for making a nanopore in a membrane using an electric field applied via a conductive tipMay 17, 18Jan 18, 22The Royal Institution For The Advancement of Learning(McGill University)
10201867 Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-holeDec 10, 15Feb 12, 19AGC Inc.
9981401 Apparatus using electrochemical discharge machining process and method using the sameOct 01, 15May 29, 18Foundation of Soongsil University-Industry Cooperation
9855687 Systems for and methods of manufacturing micro-structuresSep 25, 15Jan 02, 18Not available
9427885 Method of introducing a structure in a substrateDec 02, 09Aug 30, 16PICODRILL SA
9211598 Electro-hydraulic trimming of a part perimeter with multiple discrete pulsesNov 26, 13Dec 15, 15FORD GLOBAL TECHNOLOGIES, LLC
9168614 Method of generating high quality hole, recess or well in substrateAug 15, 13Oct 27, 15ASAHI GLASS COMPANY, LIMITED
9018565 Generation of holes using multiple electrodesJul 04, 11Apr 28, 15SCHOTT AG
8389903 Electrothermal focussing for the production of micro-structured substratesNov 07, 08Mar 05, 13PICODRILL SA

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Recent Publications

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