B26F 1/31

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Description

Class  B26F : PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING


Subclass 1/31: Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor (perforating by laser beam B23K 26/00; subjecting the grinding tools or the abrading medium to vibration, e.g. grinding with ultrasonic frequency, B24B 1/04; perforating by sand-blasting B24C; punching cards or tapes for statistical and record purposes G06K 1/00) Perforating by non-mechanical means, e.g. by fluid jet by radiation

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11318560 Process of treating a workpiece using a liquid jet guided laser beamJul 27, 16May 03, 22SYNOVA SA
10982060 Glass-free dielectric layers for printed circuit boardsFeb 13, 18Apr 20, 21International Business Machine Corporation
10611046 Rotatable manifold cutter for use in portioningApr 13, 17Apr 07, 20John Bean Technologies Corporation

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