Description
Class B81B : MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
Subclass 3/00: Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B 5/00 takes precedence)
Class B81B : MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
Subclass 3/00: Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B 5/00 takes precedence)
Patent # | Title | Filing Date | Issue Date | Patent Owner |
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11965787 | Sealed force sensor with etch stop layer | Jul 08, 22 | Apr 23, 24 | NEXTINPUT, INC. |
11964866 | MEMS device having uniform contacts | Apr 13, 23 | Apr 23, 24 | Qorvo US, Inc. |
11968497 | MEMS chip | May 09, 22 | Apr 23, 24 | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD |
11968902 | Piezoelectric body and MEMS device using same | Nov 26, 19 | Apr 23, 24 | Japan as represented by Director General of National Institute of Advanced Industrial Science and Technology Ministry of Economy Trade and Industry |
11959806 | MEMS sensors and systems | Apr 10, 23 | Apr 16, 24 | OBSIDIAN SENSORS, INC. |
11961722 | Method and apparatus for controlling stress variation in a material layer formed via pulsed DC physical vapor deposition | Dec 04, 22 | Apr 16, 24 | SPTS TECHNOLOGIES LIMITED |
11963452 | Method of making piezoelectric microphone with deflection control | Nov 24, 20 | Apr 16, 24 | VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD. |
11944412 | Blood pressure detection device | Jun 02, 21 | Apr 02, 24 | Microjet Technology Co. Ltd. |
11946741 | Mems sensor for sensing deformation by breaking contact between two electrodes | May 07, 20 | Apr 02, 24 | SILMACH |
11946822 | Semiconductor transducer device with multilayer diaphragm and method of manufacturing a semiconductor transducer device with multilayer diaphragm | Oct 16, 19 | Apr 02, 24 | Sciosense B.V. |
11945712 | Process for manufacturing a micro-electro-mechanical device, and MEMS device | May 14, 21 | Apr 02, 24 | SMI STMicroelectronics S.r.l |
11945713 | Systems and methods for providing getters in microelectromechanical systems | Jul 08, 19 | Apr 02, 24 | Invensense, Inc. |
11944998 | Capacitive micromachined ultrasonic transducer and method of fabricating the same | Mar 18, 20 | Apr 02, 24 | Korea Institute of Science and Technology |
11950053 | MEMS chip | May 09, 22 | Apr 02, 24 | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD |
11940345 | Micromechanical component for a capacitive pressure sensor device | Dec 19, 19 | Mar 26, 24 | 502 Robert Bosch GmbH |
11940346 | Micromechanical pressure sensor device and a corresponding production method | Dec 13, 19 | Mar 26, 24 | 502 Robert Bosch GmbH |
11940618 | Micromechanical component and method for producing a micromechanical component | Aug 20, 19 | Mar 26, 24 | 502 Robert Bosch GmbH |
11939211 | Actuator device | Apr 28, 23 | Mar 26, 24 | Hamamatsu Photonics K. K. |
11939215 | Microelectromechanical structure including a functional element situated in a cavity of the microelectromechanical structure | Oct 04, 19 | Mar 26, 24 | 502 Robert Bosch GmbH |
11938726 | Droplet jetting device | Sep 21, 21 | Mar 26, 24 | CANON KABUSHIKI KAISHA |
Publication # | Title | Filing Date | Pub Date | Patent Owner |
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2024/0126,070 | OPTICAL DEVICE | Dec 28, 23 | Apr 18, 24 | Hamamatsu Photonics K.K. |
2024/0124,299 | PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDING TWO CHAMBERS AT DIFFERENT PRESSURES AND RELATED MICRO-ELECTRO-MECHANICAL DEVICE | Oct 12, 23 | Apr 18, 24 | SMI STMicroelectronics S.r.l |
2024/0130,240 | MICRO ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF | Dec 11, 23 | Apr 18, 24 | SMI STMicroelectronics S.r.l |
2024/0116,749 | METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM DEVICE | Dec 13, 23 | Apr 11, 24 | Vanguard International Semiconductor Corporation |
2024/0118,533 | OPTO-MECHANICAL STRUCTURE AND ASSOCIATED MANUFACTURING METHODS | Oct 05, 23 | Apr 11, 24 | Not available |
2024/0121,545 | TRUE WIRELESS DEVICE AND DUAL-MODE TRUE WIRELESS DEVICE | Dec 09, 22 | Apr 11, 24 | Not available |
2024/0121,559 | CYLINDRICAL MEMS STRUCTURES FOR AUDIO COMPONENTS | Aug 28, 23 | Apr 11, 24 | Not available |
2024/0109,770 | Spring Supported and Sealed MEMS Diaphragm Assembly | Sep 30, 22 | Apr 04, 24 | Not available |
2024/0109,771 | METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-FABRICATED DEVICES FABRICATED IN ACCORDANCE WITH SAME | Sep 27, 23 | Apr 04, 24 | Not available |
2024/0110,779 | MIRROR UNIT AND OPTICAL MODULE | Dec 11, 23 | Apr 04, 24 | Hamamatsu Photonics K.K. |
2024/0114,292 | Triple-Membrane MEMS Device | Dec 07, 23 | Apr 04, 24 | Not available |
2024/0100,565 | CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS | Nov 30, 23 | Mar 28, 24 | Not available |
2024/0100,566 | ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES | Dec 06, 23 | Mar 28, 24 | BFLY OPERATIONS, INC. |
2024/0101,410 | MEMS OPTICAL MICROPHONE | Sep 26, 22 | Mar 28, 24 | Not available |
2024/0101,411 | MEMS OPTICAL MICROPHONE | Sep 26, 22 | Mar 28, 24 | Not available |
2024/0101,412 | Support Device for One or More MEMS Components | Sep 05, 23 | Mar 28, 24 | Not available |
2024/0106,357 | Vibration-Driven Energy Harvesting Element and Method for Manufacturing the Same | Oct 13, 21 | Mar 28, 24 | Not available |
2024/0107,239 | MEMS OPTICAL MICROPHONE | Sep 26, 22 | Mar 28, 24 | Not available |
2024/0092,629 | INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD | Jun 13, 22 | Mar 21, 24 | Not available |
2024/0092,630 | CAPACITIVE SENSOR | Jan 17, 22 | Mar 21, 24 | Not available |
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