B81B 7/02

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Class  B81B : MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES


Subclass 7/02: Micro-structural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. micro-electro-mechanical systems (MEMS) (B81B 7/04 takes precedence)

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10598689 Out-of plane-accelerometerDec 11, 17Mar 24, 20SAFRAN COLIBRYS SA
10600700 Test structure and manufacturing method thereforJun 01, 18Mar 24, 20Semiconductor Manufacturing (Shanghai) International Corporation; Semiconductor Manufacturing (Beijing) International Corporation;
10597287 Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer moduleDec 27, 18Mar 24, 20STMicroelectronics, S.R.L.
10588882 Pharmaceutical suspensions containing drug particles, devices for their administration, and methods of their useJun 10, 19Mar 17, 20SynAgile Corporation
10591326 Sensor package with ingress protectionNov 13, 18Mar 17, 20Knowles Electronics, LLC
10589990 MEMS microphoneSep 18, 18Mar 17, 20Infineon Technologies AG
10574100 Magnetic circuits for MEMS devicesMar 31, 16Feb 25, 20Intel Corp.
10562763 Fence structure to prevent stiction in a MEMS motion sensorAug 28, 17Feb 18, 20Taiwan Semiconductor Manufacturing Co Ltd.
10564263 Chip-scale LIDAR with a single MEMS scanner in a compact optical packageJun 27, 18Feb 18, 20GM Global Technology Operations LLC
10556790 Method for forming multi-depth MEMS packageNov 27, 17Feb 11, 20Taiwan Semiconductor Manufacturing Co Ltd.
10556791 CMOS compatible capacitive absolute pressure sensorsJul 19, 17Feb 11, 20KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
10556789 Laser resealing with stress-reducing prestructuringOct 19, 16Feb 11, 20Robert Bosch GmbH
10556792 Wafer level integrated MEMS device enabled by silicon pillar and smart capNov 28, 17Feb 11, 20Taiwan Semiconductor Manufacturing Co Ltd.
10551611 Techniques for removing particulate from an optical surfaceApr 18, 18Feb 04, 20Microsoft Technology Licensing, LLC.
10544035 Sensor component having two sensor functionsApr 23, 15Jan 28, 20TDK Corporation
10547954 MEMS microphone and method for manufacturing the sameMar 12, 18Jan 28, 20Semiconductor Manufacturing International ( Shanghai) Corporation; Semiconductor Manufacturing International (Beijing) Corporation;
10538428 MEMS device and method for manufacturing the sameMay 16, 18Jan 21, 20MIRAMEMS SENSING TECHNOLOGY CO., LTD
10540006 Tracking torso orientation to generate inputs for computer systemsNov 15, 17Jan 21, 20Finch Technologies Ltd.
10536150 Microelectromechanical systems-based logic gatesMar 15, 19Jan 14, 20Qorvo US, Inc.
10534242 Electronic apparatus including holding structure for micro electro mechanical system (MEMS) microphone that reduces sound noise due to photoelectric effectOct 16, 18Jan 14, 20CANON KABUSHIKI KAISHA

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2020/0079,644 MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFORNov 14, 19Mar 12, 20VERSANA MICRO INC
2020/0048,076 MEMS CHIP AND ELECTRICAL PACKAGING METHOD FOR MEMS CHIPOct 18, 19Feb 13, 20Not available
2020/0031,662 SEMICONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOFOct 07, 19Jan 30, 20Not available
2019/0367,357 MICROFLUIDIC MEMS DEVICE FOR FLUID EJECTION WITH PIEZOELECTRIC ACTUATIONMay 24, 19Dec 05, 19Not available
2019/0367,356 MICROELECTROMECHANICAL SYSTEMS (MEMS) SWITCHING CIRCUIT AND RELATED APPARATUSNov 15, 18Dec 05, 19Not available
2019/0352,176 System of Non-Acoustic Sensor Combined with MEMS MicrophoneNov 17, 17Nov 21, 19Not available
2019/0345,027 MICRO-MECHANICAL SENSOR AND METHOD FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL SENSORApr 26, 19Nov 14, 19Not available
2019/0330,050 MICROELECTRONIC STRUCTURE WITH VISCOUS DAMPING CONTROLLED BY CONTROLLING A THERMO-PIEZORESISTIVE EFFECTDec 22, 17Oct 31, 19Not available
2019/0330,052 SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL SYSTEMSJul 08, 19Oct 31, 19Not available
2019/0276,307 ELECTRONIC SYSTEM COMPRISING A MICROELECTROMECHANICAL SYSTEM AND A BOX ENCAPSULATING THIS MICROELECTROMECHANICAL SYSTEMMar 05, 19Sep 12, 19Not available
2019/0270,640 MEMS-COMPONENTFeb 27, 19Sep 05, 19Not available
2019/0270,639 MEMS-SensorFeb 07, 19Sep 05, 19Not available
2019/0233,278 PRESSURE SENSOR, IN PARTICULAR A MICROPHONE WITH IMPROVED LAYOUTOct 03, 17Aug 01, 19Commissariat A L' Energie Atomique Et Aux Energies Alternatives
2019/0225,487 Micro-electro-mechanical device with ion exchange polymerAug 15, 18Jul 25, 19Not available
2019/0218,093 MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFORMar 21, 19Jul 18, 19VERSANA MICRO INC
2019/0210,866 MEMS MICROPHONE WITH TUNABLE SENSITIVITYJul 02, 18Jul 11, 19Not available
2019/0210,867 ULTRASONIC TRANSDUCER AND METHOD FOR MANUFACTURING THE SAME, DISPLAY SUBSTARTE AND METHOD FOR MANUFACTURING THE SAMEDec 19, 18Jul 11, 19Not available
2019/0202,685 CHIP PACKAGE AND CHIP PACKAGING METHODDec 05, 18Jul 04, 19China Wafer Level CSP Co., Ltd.
2019/0202,686 SEMICONDUCTOR DEVICE PACKAGEDec 06, 18Jul 04, 19Advanced Semiconductor Engineering, Inc.
2019/0204,586 MICROELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE AND METHOD OF FORMATIONJun 14, 18Jul 04, 19Not available

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