Description
Class B81C : PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
Subclass 1/00: Manufacture or treatment of devices or systems in or on a substrate (B81C 3/00 takes precedence)
B81C 1/00
Sub-Class
Stats
- 4,233 US PATENTS IN FORCE
- 674 US APPLICATIONS PENDING
- 519 Total Patent Owners
- 7,289 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12263482 | Methods and devices for magnetic separation in a flow path | Jun 03, 21 | Apr 01, 25 | 10X GENOMICS, INC. |
| 12263506 | Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices | Dec 06, 23 | Apr 01, 25 | BFLY OPERATIONS, INC. |
| 12264063 | Three-dimensional stress-sensitive device | Apr 22, 22 | Apr 01, 25 | Rosemount Aerospace Inc. |
| 12264065 | Method for manufacturing mirror device | Aug 24, 20 | Apr 01, 25 | Hamamatsu Photonics K. K. |
| 12257602 | Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity | Jul 25, 22 | Mar 25, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12259287 | Low hysteresis and flexible pressure sensitive composite | Feb 07, 20 | Mar 25, 25 | Institute of Microelectronics National University of Singapore |
| 12259656 | Method of fabricating structured membranes | Sep 23, 22 | Mar 25, 25 | United States of America as represented by the Administrator of NASA |
| 12258263 | Method of manufacture and assembly of XY flexure mechanism assembly | Mar 14, 24 | Mar 25, 25 | The Regents of the University of Michigan |
| 12258264 | Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate | Jun 03, 22 | Mar 25, 25 | IBM Corporation |
| 12258265 | Bonding process for forming semiconductor device structure | Jul 18, 23 | Mar 25, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12258266 | Method and system for fabricating a MEMS device | Jul 29, 22 | Mar 25, 25 | Invensense, Inc. |
| 12251729 | Piezoelectric micromachined ultrasonic transducer comprising a lobed membrane element and methods of manufacturing thereof | Oct 08, 21 | Mar 18, 25 | SMI STMicroelectronics S.r.l |
| 12252393 | Resonance device and resonance device manufacturing method | Sep 08, 21 | Mar 18, 25 | Murata Manufacturing Co Ltd. |
| 12252394 | Micromechanical component for a sensor device | Jan 06, 22 | Mar 18, 25 | 502 Robert Bosch GmbH |
| 12252396 | Multi-level microelectromechanical system structure with non-photodefinable organic polymer spacer layers | Apr 25, 22 | Mar 18, 25 | Agilent Technologies Texas Instruments Incorporated |
| 12246155 | Silicon carbide nanoneedles and fabrication thereof | Aug 06, 20 | Mar 11, 25 | Lawrence Livermore National Security, LLC |
| 12249468 | Method for manufacturing variable radio frequency micro-electromechanical switch | Dec 27, 21 | Mar 11, 25 | Universite de Limoges; Centre National De La Recherche Scientifique (CNRS); AIRMEMS; |
| 12249540 | Managing trench depth in integrated systems | Jan 12, 22 | Mar 11, 25 | Ciena Corporation |
| 12250519 | MEMS capacitance microphone and manufacturing method thereof | Aug 24, 22 | Mar 11, 25 | Qsensing Microelectronics Co., Ltd |
| 12240749 | MEMS device, assembly comprising the MEMS device, and methods for operating the MEMS device | Nov 13, 19 | Mar 04, 25 | Not available |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0114,980 | IMPRINTING APPARATUS | Nov 30, 24 | Apr 10, 25 | Not available |
| 2025/0109,011 | INTEGRATED SENSOR DEVICE | Sep 18, 24 | Apr 03, 25 | Not available |
| 2025/0109,012 | MEMS STRUCTURES WITH GAPS | Sep 25, 24 | Apr 03, 25 | Not available |
| 2025/0109,013 | CANTILEVER-BASED OPTO-ELECTROMECHANICAL SYSTEMS AND FABRICATION METHODS | Oct 03, 23 | Apr 03, 25 | Not available |
| 2025/0109,014 | Method For Manufacturing Vibration Device | Sep 26, 24 | Apr 03, 25 | Not available |
| 2025/0109,015 | MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A METHOD FOR MANUFACTURING IT | Sep 24, 24 | Apr 03, 25 | Not available |
| 2025/0109,016 | PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRESPONDING MICROMECHANICAL SENSOR COMPONENT | Sep 26, 24 | Apr 03, 25 | Not available |
| 2025/0100,014 | METHOD AND SYSTEM FOR PROVIDING A RELIABLE ISOLATION STACK IN CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS | Sep 27, 23 | Mar 27, 25 | Not available |
| 2025/0100,869 | PROBE AND METHOD OF FABRICATING ULTRASONIC TRANSDUCER UNIT | Sep 10, 24 | Mar 27, 25 | Qisda Corporation |
| 2025/0093,212 | DEVICE FOR NANOSCALE THERMAL MEASUREMENTS AND ASSOCIATED METHOD FOR MANUFACTURING SAID DEVICE | Jan 17, 23 | Mar 20, 25 | Centre National De La Recherche Scientifique (CNRS) |
| 2025/0091,858 | SANDWICH STRUCTURES FOR MICROELECTROMECHANICAL SYSTEM MICRO-MIRRORS | Sep 03, 24 | Mar 20, 25 | Not available |
| 2025/0091,860 | COMPOUND SENSOR AND MANUFACTURING METHOD | Apr 05, 24 | Mar 20, 25 | Not available |
| 2025/0091,861 | LASER MICROMACHINING OF MEMS RESONATORS FROM BULK OPTICALLY TRANSPARENT MATERIAL | Jan 06, 23 | Mar 20, 25 | The Regents of the University of California |
| 2025/0085,175 | PRESSURE SENSOR AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE | Nov 15, 22 | Mar 13, 25 | Not available |
| 2025/0083,951 | PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH REDUCED STICTION PHENOMENON | Aug 16, 24 | Mar 13, 25 | STMicroelectronics International N.V. |
| 2025/0076,135 | SENSING ELEMENT AND RELATED METHODS | Nov 20, 24 | Mar 06, 25 | Not available |
| 2025/0074,763 | CURVED CANTILEVER DESIGN TO REDUCE STRESS IN MEMS ACTUATOR | Nov 18, 24 | Mar 06, 25 | Not available |
| 2025/0074,765 | HIGH RELIABILITY SENSOR | Aug 28, 23 | Mar 06, 25 | Not available |
| 2025/0074,762 | MEMS SOUND TRANSDUCER AND METHOD FOR PRODUCING SAME | Aug 27, 24 | Mar 06, 25 | Not available |
| 2025/0074,764 | MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF | Nov 30, 22 | Mar 06, 25 | Not available |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 25 Months (last 2 years Issuances)
- 25 Months (last 5 years Issuances)