C09G 1/02

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Class  C09G : POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES


Subclass 1/02: Polishing compositions (French polish C09F 11/00; detergents C11D) containing abrasives or grinding agents

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
10607853 CMP slurry composition for polishing copper line and polishing method using sameOct 12, 15Mar 31, 20Samsung SDI Co., Ltd.
10604678 Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compoundsFeb 08, 19Mar 31, 20Rohrn and Haas Electronic Materials CMP Holdings, Inc.
10600655 Chemical mechanical polishing method for tungstenApr 24, 18Mar 24, 20Rohm and Haas Electronic Materials CMP Holdings, Inc.
10597558 Chemical mechanical polishing composition and method for tungstenOct 20, 18Mar 24, 20Rohm and Haas Electronic Materials CMP Holdings, Inc.
10589401 Sintered vitrified superfinishing grindstoneAug 05, 15Mar 17, 20MIZUHO CO., LTD.
10584266 CMP compositions containing polymer complexes and agents for STI applicationsMar 14, 18Mar 10, 20Cabot Microelectronics Corporation
10584265 Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using themSep 28, 17Mar 10, 20Rohm and Haas Electronic Materials CMP Holdings, Inc.
10586708 Uniform CMP polishing methodOct 05, 17Mar 10, 20Rohm and Haas Electronic Materials CMP Holdings, Inc.
10577445 Polishing composition for magnetic disk substrateOct 24, 18Mar 03, 20YAMAGUCHI SEIKEN KOGYO CO., LTD.
10570322 Polishing compositionJan 10, 19Feb 25, 20Fujimi Incorporated
10570315 Buffered slurry formulation for cobalt CMPOct 30, 17Feb 25, 20Fujimi Incorporated
10569384 Chemical mechanical polishing pad and polishing methodNov 06, 18Feb 25, 20Rohm and Haas Electronic Materials CMP Holdings, Inc.
10573524 Method of chemical mechanical polishing a semiconductor substrateMar 04, 16Feb 25, 20Rohm and Haas Electronic Materials CMP Holdings, Inc.
10570313 Dishing reducing in tungsten chemical mechanical polishingFeb 03, 16Feb 25, 20VERSUM MATERIALS US, LLC
10570314 Polishing agent, polishing method, and liquid additive for polishingSep 11, 17Feb 25, 20AGC Inc.
10562783 Processing of aluminaOct 20, 15Feb 18, 20Fujimi Incorporated
10557058 Polishing agent, polishing agent set, and substrate polishing methodFeb 14, 13Feb 11, 20Hitachi Chemical Company, Ltd.
10557059 Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateMar 26, 13Feb 11, 20Hitachi Chemical Company, Ltd.
10557060 Method of chemical mechanical polishing a substrateMar 01, 16Feb 11, 20Rohm and Haas Electronic Materials CMP Holdings, Inc.
10549399 Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateMar 26, 13Feb 04, 20HITACHI CHEMCIAL COMPANY, LTD.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2020/0102,476 Barrier Slurry Removal Rate ImprovementSep 20, 19Apr 02, 20VERSUM MATERIALS US, LLC
2020/0102,478 CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF POLISHING SILCON DIOXIDE OVER SILICON NITIRIDESep 25, 19Apr 02, 20Not available
2020/0102,475 CHEMICAL MECAHNICAL POLISHING COMPOSITION AND METHOD OF POLISHING SILCON DIOXIDE OVER SILICON NITIRIDESep 28, 18Apr 02, 20Not available
2020/0102,479 HARD ABRASIVE PARTICLE-FREE POLISHING OF HARD MATERIALS METHODDec 04, 19Apr 02, 20Not available
2020/0102,477 POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF PRODUCING SUBSTRATESep 23, 19Apr 02, 20Fujimi Incorporated
2020/0095,467 INTERMEDIATE RAW MATERIAL, AND POLISHING COMPOSITION AND COMPOSITION FOR SURFACE TREATMENT USING THE SAMESep 23, 19Mar 26, 20Fujimi Incorporated
2020/0095,468 TUNGSTEN DISSOLUTION INHIBITOR, AND POLISHING COMPOSITION AND COMPOSITION FOR SURFACE TREATMENT USING THE SAMESep 23, 19Mar 26, 20Fujimi Incorporated
2020/0095,466 POLISHING COMPOSITIONSep 04, 19Mar 26, 20Fujimi Incorporated
2020/0087,539 LIQUID SUSPENSION OF CERIUM OXIDE PARTICLESMay 28, 19Mar 19, 20Not available
2020/0087,538 COMPOSITION FOR SELECTIVE POLISHING OF WORK FUNCTION METALSSep 14, 18Mar 19, 20FUJIMI CORPORATION
2020/0079,975 Slurry Composition And Method Of Selective Silica PolishingAug 02, 17Mar 12, 20FERRO CORPORATION
2020/0079,976 Chemical Mechanical Planarization For Tungsten-Containing SubstratesSep 04, 19Mar 12, 20VERSUM MATERIALS US, LLC
2020/0071,568 POLISHING COMPOSITION AND POLISHING SYSTEMSep 03, 19Mar 05, 20Fujimi Incorporated
2020/0071,566 SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHINGAug 28, 19Mar 05, 20KCTECH CO., LTD.
2020/0071,567 POLISHING COMPOSITION AND POLISHING SYSTEMAug 30, 19Mar 05, 20Fujimi Incorporated
2020/0062,997 Polishing CompositionMar 09, 18Feb 27, 20Fujimi Incorporated
2020/0056,069 POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANEOct 25, 19Feb 20, 20Cabot Microelectronics Corporation
2020/0048,497 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING SAME, POLISHING METHOD, AND METHOD FOR MANUFACTURING SUBSTRATEAug 08, 19Feb 13, 20Fujimi Incorporated
2020/0048,498 CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITIONFeb 22, 18Feb 13, 20Not available
2020/0048,496 Oxide Chemical Mechanical Planarization (CMP) Polishing CompositionsAug 06, 19Feb 13, 20VERSUM MATERIALS US, LLC

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Patents Issued To Date - By Filing Year

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