Description
Class C09G : POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
Subclass 1/02: Polishing compositions (French polish C09F 11/00; detergents C11D) containing abrasives or grinding agents
Class C09G : POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
Subclass 1/02: Polishing compositions (French polish C09F 11/00; detergents C11D) containing abrasives or grinding agents
Patent # | Title | Filing Date | Issue Date | Patent Owner |
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12264265 | Concentrated liquid of polishing composition and polishing method using same | Jun 10, 21 | Apr 01, 25 | Fujimi Incorporated |
12264266 | Chemical mechanical polishing liquid | Dec 03, 20 | Apr 01, 25 | ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD. |
12261055 | Slurry compositions for chemical mechanical planarization | Nov 07, 22 | Mar 25, 25 | TAIWAN SSEMICONDUCTOR MANUFACTURING CO., LTD. |
12258492 | Polishing composition, polishing method, and method for manufacturing substrate | Oct 06, 23 | Mar 25, 25 | Fujimi Incorporated |
12258491 | Polishing liquid, polishing liquid set, and polishing method | Jan 06, 21 | Mar 25, 25 | Resonac Corporation |
12252633 | Polishing liquid and method for manufacturing glass substrate | May 22, 23 | Mar 18, 25 | 501 Hoya Corporation |
12252632 | Chemical-mechanical polishing composition, rinse composition, chemical- mechanical polishing method, and rinsing method | Jun 11, 20 | Mar 18, 25 | Entegris Inc. |
12247140 | Slurry and polishing method | Sep 25, 18 | Mar 11, 25 | Resonac Corporation |
12247141 | Polishing slurry composition | Nov 04, 19 | Mar 11, 25 | KCTECH CO., LTD. |
12234382 | CMP composition including anionic and cationic inhibitors | Jul 26, 21 | Feb 25, 25 | CMC MATERIALS LLC |
12234383 | Low dishing oxide CMP polishing compositions for shallow trench isolation applications and methods of making thereof | May 25, 21 | Feb 25, 25 | VERSUM MATERIALS US, LLC |
12227673 | Composition and method for silicon nitride CMP | Dec 04, 18 | Feb 18, 25 | CMC MATERIALS LLC |
12227674 | Polishing composition comprising polishing particles having high water affinity | Jul 20, 22 | Feb 18, 25 | Nissan Chemical Corporation |
12221557 | Polishing composition and polishing method | Feb 24, 22 | Feb 11, 25 | FUJIMI INCORPORATED |
12224179 | Metal heterojunction structure with capping metal layer | Mar 15, 23 | Feb 11, 25 | Taiwan Semiconductor Manufacturing Co., Ltd. |
12203007 | Polishing liquid | Jul 23, 21 | Jan 21, 25 | 501 Hoya Corporation |
12203008 | Polishing slurry | Dec 26, 19 | Jan 21, 25 | NITTA DUPONT INCORPORATED |
12195386 | Chemically strengthened glass and manufacturing method of chemically strengthened glass | Mar 25, 22 | Jan 14, 25 | AGC INC. |
12187618 | Silica particle dispersion liquid and production method thereof | Sep 23, 20 | Jan 07, 25 | JGC Catalysts and Chemicals Ltd |
12187918 | Method of manufacturing gallium oxide substrate and polishing slurry for gallium oxide substrate | Sep 21, 21 | Jan 07, 25 | AGC INC. |
Publication # | Title | Filing Date | Pub Date | Patent Owner |
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2025/0115,785 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLISHING METHOD USING THE SAME | Jul 12, 24 | Apr 10, 25 | Samsung Electronics Co. Ltd.; SOULBRAIN CO., LTD; |
2025/0115,786 | POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE USING THE SAME | Sep 30, 24 | Apr 10, 25 | SK enpulse Co., Ltd. |
2025/0115,787 | POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE USING THE SAME | Sep 30, 24 | Apr 10, 25 | SK enpulse Co., Ltd. |
2025/0112,050 | POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME | Sep 28, 23 | Apr 03, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
2025/0109,317 | POLISHING COMPOSITION | Jul 25, 24 | Apr 03, 25 | Fujimi Incorporated |
2025/0109,319 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | Sep 20, 24 | Apr 03, 25 | Fujimi Incorporated |
2025/0109,318 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE | Aug 29, 24 | Apr 03, 25 | Fujimi Incorporated |
2025/0101,260 | CMP POLISHING SOLUTION, STORAGE SOLUTION, AND POLISHING METHOD | Jan 12, 22 | Mar 27, 25 | Not available |
2025/0101,261 | CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME | Aug 12, 22 | Mar 27, 25 | Not available |
2025/0101,262 | POLISHING COMPOSITION | Sep 17, 24 | Mar 27, 25 | Fujimi Incorporated |
2025/0101,263 | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | Sep 19, 24 | Mar 27, 25 | Not available |
2025/0092,284 | POLISHING COMPOSITION AND SURFACE TREATMENT METHOD | Aug 19, 24 | Mar 20, 25 | Fujimi Incorporated |
2025/0084,280 | MOLYBDENUM CHEMICAL MECHANICAL POLISHING COMPOUNDS AND METHODS OF USE THEREOF | Aug 29, 24 | Mar 13, 25 | Not available |
2025/0084,294 | SLURRY AND POLISHING METHOD | Nov 26, 24 | Mar 13, 25 | Not available |
2025/0084,281 | POLISHING COMPOSITION AND METHOD FOR POLISHING SUBSTRATE USING THE COMPOSITION | Sep 05, 24 | Mar 13, 25 | Not available |
2025/0075,103 | SLURRY SOLUTION, METHOD FOR FABRICATING THE SLURRY SOLUTION, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SLURRY SOLUTION | Apr 19, 24 | Mar 06, 25 | Samsung Electronics Co. Ltd. |
2025/0075,104 | TITANIUM OXIDE-BASED CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR HEAVILY-DOPED BORON SILICON FILMS | Aug 30, 24 | Mar 06, 25 | Not available |
2025/0059,400 | INSULATING FILM POLISHING SOLUTION AND USAGE METHOD THEREOF | Dec 23, 22 | Feb 20, 25 | Not available |
2025/0059,401 | CHEMICAL MECHANICAL POLISHING SOLUTION AND USAGE METHOD THEREOF | Dec 23, 22 | Feb 20, 25 | Not available |
2025/0043,149 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING APPARATUS | Feb 02, 24 | Feb 06, 25 | Not available |
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