Description
Class C09G : POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
Subclass 1/04: Polishing compositions (French polish C09F 11/00; detergents C11D) Aqueous dispersions (C09G 1/02 takes precedence)
C09G 1/04
Sub-Class
Stats
- 272 US PATENTS IN FORCE
- 34 US APPLICATIONS PENDING
- 70 Total Patent Owners
- 834 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12247141 | Polishing slurry composition | Nov 04, 19 | Mar 11, 25 | KCTECH CO., LTD. |
| 12163058 | Semiconductor element | Nov 06, 20 | Dec 10, 24 | Not available |
| 12157834 | Composition and method for polysilicon CMP | Sep 02, 20 | Dec 03, 24 | CMC MATERIALS LLC |
| 12146076 | Semiconductor element | Nov 06, 20 | Nov 19, 24 | Not available |
| 12146077 | Polishing composition | Dec 03, 21 | Nov 19, 24 | FUJIMI INCORPORATED |
| 12104278 | Silicon carbide substrate | Mar 19, 20 | Oct 01, 24 | Sumitomo Electric Industries, Ltd. |
| 12098301 | Polishing liquid and chemical mechanical polishing method | Nov 11, 21 | Sep 24, 24 | FUJIFILM Corporation |
| 12077681 | CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same | Mar 15, 22 | Sep 03, 24 | Samsung SDI Co., Ltd. |
| 12065587 | Polishing compositions for reduced defectivity and methods of using the same | Jul 19, 22 | Aug 20, 24 | Fujifilm Hunt Chemicals Inc. |
| 12060498 | Hydrophilization treatment liquid for semiconductor wafer surface | Mar 18, 20 | Aug 13, 24 | Daicel Corporation Industries Ltd. |
| 12037517 | Ruthenium CMP chemistry based on halogenation | Oct 18, 23 | Jul 16, 24 | Tokyo Electron Limited |
| 12024651 | Chemical mechanical polishing slurry composition and method of polishing metal layer | Mar 07, 22 | Jul 02, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12012525 | Composition for etching and manufacturing method of semiconductor device using the same | Nov 06, 20 | Jun 18, 24 | Not available |
| 11912902 | Composition for etching and manufacturing method of semiconductor device using the same | Dec 21, 18 | Feb 27, 24 | Not available |
| 11862472 | Methods for polishing dielectric layer in forming semiconductor device | Aug 23, 22 | Jan 02, 24 | Yangtze Memory Technologies Co., Ltd. |
| 11820919 | Ruthenium CMP chemistry based on halogenation | Feb 17, 22 | Nov 21, 23 | Tokyo Electron Limited |
| 11820918 | Hard abrasive particle-free polishing of hard materials | Jul 01, 21 | Nov 21, 23 | Entegris Inc. |
| 11813713 | Chemical mechanical polishing pad and polishing method | Jan 21, 21 | Nov 14, 23 | Rohm and Haas Electronic Materials CMP Holdings, Inc. |
| 11806836 | Calcium carbonate slurry | Dec 06, 21 | Nov 07, 23 | Illumina Inc. |
| 11773293 | Freeze-thaw stable water-in-oil emulsion cleaner and/or polish compositions | Nov 15, 17 | Oct 03, 23 | S. C. Johnson & Son, Inc. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0075,105 | ANTIFOAMER FOR GRINDING OR POLISHING COMPOSITIONS AND METHODS FOR USING THE SAME | Oct 15, 24 | Mar 06, 25 | LaPel, LLC |
| 2025/0066,641 | POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | Mar 12, 24 | Feb 27, 25 | Samsung Electronics Co., Ltd. |
| 2025/0026,962 | COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | Sep 27, 24 | Jan 23, 25 | Not available |
| 2024/0395,562 | CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE | Jul 31, 24 | Nov 28, 24 | Not available |
| 2024/0327,677 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER | Jun 04, 24 | Oct 03, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0318,039 | CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Mar 13, 24 | Sep 26, 24 | Samsung Electronics Co., Ltd. |
| 2024/0318,040 | CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Mar 19, 24 | Sep 26, 24 | Not available |
| 2024/0141,205 | COMPOSITIONS AND METHODS OF USE THEREOF | Jan 10, 24 | May 02, 24 | Not available |
| 2024/0076,522 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | Sep 05, 23 | Mar 07, 24 | Not available |
| 2024/0016,154 | SURFACE TREATMENT ARTICLES, DEVICES AND METHODS FOR MAKING THE SAME | Nov 12, 21 | Jan 18, 24 | Not available |
| 2023/0357,601 | POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE | Apr 11, 23 | Nov 09, 23 | Not available |
| 2023/0143,013 | CHEMICAL PLANARIZATION | Dec 30, 22 | May 11, 23 | Not available |
| 2023/0052,829 | COMPOSITIONS AND METHODS OF USE THEREOF | Jul 28, 22 | Feb 16, 23 | Not available |
| 2022/0298,381 | CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME | Mar 15, 22 | Sep 22, 22 | Not available |
| 2022/0243,094 | SILICON CARBONITRIDE POLISHING COMPOSITION AND METHOD | Feb 04, 22 | Aug 04, 22 | Not available |
| 2022/0145,133 | FREEZE-THAW STABLE WATER-IN-OIL EMULSION CLEANER AND/OR POLISH COMPOSITIONS | Jan 28, 22 | May 12, 22 | S. C. Johnson & Son, Inc. |
| 2022/0064,489 | POLISHING SLURRY COMPOSITION | Jul 03, 19 | Mar 03, 22 | KCTECH CO., LTD. |
| 2022/0033,684 | POLISHING LIQUID | Jul 21, 21 | Feb 03, 22 | Not available |
| 2021/0062,044 | METHOD FOR PRODUCING ALUMINUM PLATTER | Dec 27, 17 | Mar 04, 21 | Kao Corporation |
| 2021/0054,237 | COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | Nov 06, 20 | Feb 25, 21 | Not available |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 27 Months (last 2 years Issuances)
- 27 Months (last 5 years Issuances)