Description
Class C09J : ADHESIVES; ADHESIVE PROCESSES IN GENERAL
Subclass 11/02: Features of adhesives not provided for in group C09J 9/00, e.g. additives Non-macromolecular additives
C09J 11/02
Sub-Class
Stats
- 43 US PATENTS IN FORCE
- 2 US APPLICATIONS PENDING
- 12 Total Patent Owners
- 151 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12195350 | Adhesive layer, near-infrared shielding film, laminated structure, stacked body and adhesive agent composition | Oct 27, 16 | Jan 14, 25 | Sumitomo Metal Mining Co. Ltd. |
| 12139644 | Dual lap high strength adhesive for sheet membrane application, having reflectivity granular particle layer to fully bond to concrete/shotcrete, and a method of making, and using same | Jun 13, 22 | Nov 12, 24 | Not available |
| 11768321 | Optically variable security devices | Sep 28, 22 | Sep 26, 23 | Viavi Solutions Inc. |
| 11476222 | Adhesive bonding composition and electronic components prepared from the same | Mar 16, 20 | Oct 18, 22 | Immunolight, LLC |
| 11452216 | Method for manufacturing multilayer printed wiring board | Jul 25, 18 | Sep 20, 22 | Panasonic Intellectual Property Management Co., Ltd. |
| 11370942 | Pressure-sensitive adhesive composition | Aug 21, 19 | Jun 28, 22 | LG Chem Ltd. |
| 11359115 | Adhesive system made of a multiplicity of pressure-sensitive adhesive layers | Oct 05, 17 | Jun 14, 22 | tesa SE |
| 11306225 | Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same | Aug 07, 18 | Apr 19, 22 | Furukawa Electric Co. Ltd. |
| 11230649 | Electrically conductive adhesive film and dicing-die bonding film using the same | Aug 07, 18 | Jan 25, 22 | Furukawa Electric Co. Ltd. |
| 11193047 | Electrically conductive adhesive film and dicing-die bonding film using the same | Aug 07, 18 | Dec 07, 21 | Furukawa Electric Co. Ltd. |
| 11136479 | Electrically conductive adhesive film and dicing-die bonding film using the same | Aug 07, 18 | Oct 05, 21 | Furukawa Electric Co. Ltd. |
| 11098226 | Electrically conductive adhesive film and dicing-die bonding film using the same | Aug 07, 18 | Aug 24, 21 | Furukawa Electric Co. Ltd. |
| 10982120 | Thermocurable electroconductive adhesive | Aug 17, 17 | Apr 20, 21 | THREEBOND CO., LTD. |
| 10947419 | Method for joining dissimilar materials | Jul 23, 18 | Mar 16, 21 | Palo Alto Research Center Incorporated |
| 10920114 | Label with adhesive and silicone-free release coating | Dec 19, 19 | Feb 16, 21 | Iconex LLC |
| 10899947 | Method for plasma-initiated adhesive bonding | Mar 27, 15 | Jan 26, 21 | tesa SE |
| 10852455 | Laminate of optical elements having a layer of a pressure-sensitive adhesive, and a method for producing such laminate of optical elements | Jan 16, 15 | Dec 01, 20 | Nitto Denko Corporation |
| 10689550 | Electrically conductive composition | Aug 21, 17 | Jun 23, 20 | FURUKAWA ELECTRIC CO., LTD. |
| 10676649 | Adhesive sheet and method for producing adhesive sheet | Sep 27, 16 | Jun 09, 20 | LINTEC Corporation |
| 10593642 | Adhesive bonding composition and electronic components prepared from the same | Jan 18, 19 | Mar 17, 20 | Immunolight, LLC |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0287,358 | ADHESIVE SHEET, FLEXIBLE IMAGE DISPLAY MEMBER, AND FLEXIBLE IMAGE DISPLAY DEVICE | May 02, 24 | Aug 29, 24 | Kimmon Manufacturing Co. Ltd. and Mitsubishi Chemical Corporation |
| 2023/0091,482 | METHOD AND APPARATUS FOR APPLYING LIGHT TO CURE ADHESIVES | Sep 15, 22 | Mar 23, 23 | Not available |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 37 Months (last 2 years Issuances)
- 37 Months (last 5 years Issuances)