C09K 5/14

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Class  C09K : MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR


Subclass 5/14: Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion Materials not undergoing a change of physical state when used (C09K 5/16, C09K 5/2 take precedence) Solid materials, e.g. powdery or granular

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12257586 Porous particle composite for PCR with heat dissipation functionMay 14, 19Mar 25, 25Korea Institute of Science and Technology
12246967 Process for producing integral graphene films from functionalized graphene sheetsMay 15, 18Mar 11, 25Global Graphene Group, Inc.
12234364 Three-dimensional printing system employing a thermally conductive polymer compositionDec 14, 20Feb 25, 25Ticona LLC
12219742 Converter including heat transfer layerNov 13, 20Feb 04, 25LG INNOTEK CO., LTD.
12195340 Uniform dispersing of graphene nanoparticles in a hostMar 12, 16Jan 14, 25University of Central Florida Research Foundation, Inc.
12195582 Conductive polymer compositionNov 12, 19Jan 14, 25PPG Industries Ohio, Inc.
12195666 Thermal interface material and method for making the sameJul 27, 20Jan 14, 25Google LLC
12195667 Boron nitride nanomaterial and resin compositionOct 29, 19Jan 14, 25SEKISUI CHEMICAL CO., LTD.
12199255 Curable compositions comprising polyol component, functional butadiene component, and thermally conductive filler, articles therefrom, and methods of making and using sameNov 15, 19Jan 14, 253M Innovative Properties Company
12187951 Thermal interface material and method for making the sameJul 27, 20Jan 07, 25Google LLC
12187954 SiC-filled polymers with high electrical resistivity and high thermal conductivityNov 18, 21Jan 07, 25WASHINGTON MILLS MANAGEMENT, INC.
12180411 Thermally conductive component with a bulk molded compound and no base coatApr 27, 23Dec 31, 24Valeo Vision
12180412 Thermally conductive polymer compositions containing carbon blackJun 28, 23Dec 31, 24Cabot Corporation
12173222 High heat dissipation polymer composite material sheet and manufacturing method thereofFeb 03, 23Dec 24, 24SAMDO ATS CO., LTD.
12163091 Thermal interface materialMar 09, 21Dec 10, 24Henkel AG & Co. KGaA
12146093 Thermal management materials and methods of making the sameMay 10, 19Nov 19, 24Georgia Tech Research Corporation; South Dakota School of Mines & Technology;
12150262 Composite structure, flexible display assembly, and foldable display terminalJul 21, 20Nov 19, 24HUAWEI TECHNOLOGIES CO., LTD.
12139568 High temperature, conductive thermosetting resin compositionsDec 30, 19Nov 12, 24TCLAD INC.
12140380 Method for producing a heat regenerating material particleAug 22, 23Nov 12, 24Kabushiki Kaisha Toshiba; Toshiba Materials Co. Ltd.;
12140381 Method for producing a two-stage heat regenerating cryogenic refrigeratorAug 22, 23Nov 12, 24Kabushiki Kaisha Toshiba; Toshiba Materials Co. Ltd.;

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0115,784 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND PRODUCTION METHOD THEREFORJan 16, 23Apr 10, 25Shin-Etsu Chemical Co. Ltd.
2025/0109,076 BORON NITRIDE COMPOSITE AND MANUFACTURING METHOD THEREOFDec 13, 24Apr 03, 25Not available
2025/0101,219 TWO-PART THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCTJan 26, 23Mar 27, 25Not available
2025/0101,286 Composition and Filler MixtureJul 22, 22Mar 27, 25Not available
2025/0101,287 MATERIAL, METHOD FOR MANUFACTURING MATERIAL, AND ELECTRONIC DEVICESep 17, 24Mar 27, 25Not available
2025/0092,296 THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAMEDec 04, 24Mar 20, 25Not available
2025/0092,297 COLD STORAGE MATERIALAug 04, 22Mar 20, 25Not available
2025/0084,296 Method For Storing Thermal Energy In A Ceramic MaterialNov 21, 24Mar 13, 25OCP SA; Prayon Development; ASSOCIATION POUR LA RECHERCHE DEVELOPPEMENT DES METHODES ET PROCESSUS INDUSTRIELS (ARMINES);
2025/0051,530 METHOD OF MAKING A BIODEGRADABLE THERMAL INSULATION COMPOSITE BASED ON POLY (BETA-HYDROXYBUTYRATE)Aug 08, 23Feb 13, 25Not available
2025/0034,386 FLUORORESIN COMPOSITION AND MOLDED BODYSep 26, 24Jan 30, 25DAIKIN INDUSTRIES, LTD.
2025/0034,437 THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION AND A THERMALLY CONDUCTIVE COMPOSITEOct 21, 22Jan 30, 25Not available
2025/0026,645 APPLICATIONS OF ENGINEERED GRAPHENESep 30, 24Jan 23, 25Alpha Assembly Solutions Inc.
2025/0026,659 APPARATUS FOR PRODUCING MAGNESIUM OXIDEOct 12, 22Jan 23, 25Not available
2025/0027,267 SUBSTRATE COMPRISING GRAPHENE, METHOD OF PREPARATION, AND APPLICATIONS THEREOFMar 10, 22Jan 23, 25Not available
2025/0019,511 FIRE-RESISTANT, FIRE RETARDANT AND/OR THERMAL INSULATIONJul 19, 24Jan 16, 25Not available
2025/0019,585 ALUMINUM-CONTAINING THERMAL PASTESJan 28, 22Jan 16, 25Wacker Chemie AG
2025/0019,584 GRAPHENE-BASED NANOCOOLANT WITH HIGH THERMAL CONDUCTIVITY AND THERMAL PERFORMANCEJul 14, 23Jan 16, 25Ford Global Technologies, LLC
2025/0012,516 INVERTED BAROCALORIC EFFECTSSep 06, 24Jan 09, 25Not available
2025/0016,962 HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIALJun 12, 24Jan 09, 25Not available
2025/0002,771 INORGANIC FILLER AND HEAT DISSIPATION MEMBERNov 10, 22Jan 02, 25DENKA COMPANY LIMITED

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Patents Issued To Date - By Filing Year

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