Description
Class C22C : ALLOYS
Subclass 7/00: Alloys based on mercury
Class C22C : ALLOYS
Subclass 7/00: Alloys based on mercury
Patent # | Title | Filing Date | Issue Date | Patent Owner |
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11650193 | Stable binary nanocrystalline alloys and methods of identifying same | Jan 22, 19 | May 16, 23 | Massachusetts Institute of Technology |
11621101 | Conductive composites | Jun 22, 21 | Apr 04, 23 | The Boeing Company |
11075021 | Conductive composites | Dec 21, 17 | Jul 27, 21 | The Boeing Company |
10689768 | Amalgam electrode, producing method thereof, and method of electrochemical reduction of carbon dioxide using the same | Aug 01, 14 | Jun 23, 20 | SOGANG UNIVERSITY RESEARCH FOUNDATION; Korea Southern Power Co., Ltd; |
10234410 | Stable binary nanocrystalline alloys and methods of identifying same | Mar 12, 12 | Mar 19, 19 | Massachusetts Institute of Technology |
9659762 | Amalgam balls having an alloy coating | Jan 19, 16 | May 23, 17 | UMICORE AG & CO. KG |
9324555 | Amalgam spheres for energy-saving lamps and their production | Jun 27, 13 | Apr 26, 16 | UMICORE AG & CO. KG |
9263245 | Amalgam balls having an alloy coating | Mar 05, 12 | Feb 16, 16 | UMICORE AG & CO. KG |
9133537 | Superalloy component and method of improving the same | Feb 18, 10 | Sep 15, 15 | SIEMENS AKTIENGESELLSCHAFT |
9109275 | High-strength galvanized steel sheet and method of manufacturing the same | Aug 31, 10 | Aug 18, 15 | NIPPON STEEL & SUMITOMO METAL CORPORATION |
8975810 | Compositions of mercury isotopes for lighting | May 13, 14 | Mar 10, 15 | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM |
8834747 | Compositions containing tin nanoparticles and methods for use thereof | Mar 03, 11 | Sep 16, 14 | LOCKHEED MARTIN CORPORATION |
8430977 | Hollow drilling steel rod and method of manufacturing the same | Feb 17, 12 | Apr 30, 13 | DAIDO STEEL CO., LTD., MITSUBISHI MATERIALS CORPORATION, |
6648210 | Lead-free solder alloy powder paste use in PCB production | Feb 09, 01 | Nov 18, 03 | MULTICORE SOLDERS LIMITED |
6231691 | Lead-free solder | Feb 10, 97 | May 15, 01 | IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. |
6224690 | Flip-Chip interconnections using lead-free solders | Mar 12, 96 | May 01, 01 | ULTRATECH, INC. |
6176947 | Lead-free solders | Oct 12, 99 | Jan 23, 01 | SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE LTE |
6071359 | Shot for use as ammunition | Oct 24, 97 | Jun 06, 00 | Grillo-Werke AG |
5938862 | Fatigue-resistant lead-free alloy | Apr 03, 98 | Aug 17, 99 | RPX CORPORATION |
5490870 | Amalgamable composition and method of production | Jul 12, 94 | Feb 13, 96 | KERR CORPORATION |
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