Description
Class C22C : ALLOYS
Subclass 9/00: Alloys based on copper
C22C 9/00
Sub-Class
Stats
- 664 US PATENTS IN FORCE
- 107 US APPLICATIONS PENDING
- 188 Total Patent Owners
- 2,161 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12264390 | Pure copper material, insulating substrate, and electronic device | Jul 27, 23 | Apr 01, 25 | Mitsubishi Materials Corporation |
| 12260974 | Stranded wire conductors and methods for manufacturing stranded wires | Sep 11, 24 | Mar 25, 25 | HUZHOU JIN TAI CONDUCTOR TECHNOLOGY CO., LTD. |
| 12255000 | Compound superconducting twisted wire and rewinding method for compound superconducting twisted wire | Sep 20, 19 | Mar 18, 25 | FURUKAWA ELECTRIC CO., LTD.; Japan as Represented by President of Tohoku University; Tokai University Educational System; |
| 12247276 | Copper powder, method for manufacturing copper powder, and method for manufacturing solid shaped object | Jan 12, 18 | Mar 11, 25 | JX Advanced Metals Corporation |
| 12241149 | Electrical contact element | May 05, 20 | Mar 04, 25 | ERNI INTERNATIONAL AG |
| 12234531 | Apparatus and method for production of high purity copper-based alloys | Apr 04, 23 | Feb 25, 25 | DOGGONE INVESTMENT CO. LLC |
| 12203158 | Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate | Jun 30, 21 | Jan 21, 25 | Mitsubishi Materials Corporation |
| 12199277 | Negative electrode active material, negative electrode, and battery | Jan 17, 20 | Jan 14, 25 | 501 Nippon Steel Corporation |
| 12139783 | Copper-beryllium alloy with high strength | May 05, 20 | Nov 12, 24 | MATERION CORPORATION |
| 12142864 | Electric contact element for high operating voltages | May 05, 20 | Nov 12, 24 | ERNI INTERNATIONAL AG |
| 12129538 | Use of a copper alloy | Sep 13, 19 | Oct 29, 24 | CUNOVA GMBH |
| 12119131 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Aug 09, 21 | Oct 15, 24 | Senju Metal Industry Co. LTD; Osaka University; |
| 12120852 | Composite material and heat dissipation part | Apr 08, 22 | Oct 15, 24 | THE GOODSYSTEM CORP. |
| 12110446 | Composite material and heat dissipation part comprising the composite material | Nov 21, 22 | Oct 08, 24 | THE GOODSYSTEM CORP. |
| 12103113 | Copper-phosphorus brazing wire for brazing copper alloy spectacle frame as well as preparing method and system thereof | Feb 14, 23 | Oct 01, 24 | ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD |
| 12098452 | Graphene/copper composite deformed copper-chromium-zirconium alloy layered strip and preparation method thereof | Apr 07, 24 | Sep 24, 24 | CHANGZHOU UNIVERSITY |
| 12091766 | Electrolytic copper foil and method for producing same | Dec 03, 19 | Sep 17, 24 | NIPPON DENKAI, LTD. |
| 12084745 | Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article | Mar 04, 21 | Sep 10, 24 | Daihen Corporation; OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY; |
| 12071692 | Electrically conducting material with coating | Dec 21, 20 | Aug 27, 24 | Wieland Werke AG |
| 12037669 | Metal-alloy biphasic systems, and powders and methods for making metal-alloy biphasic systems | Feb 07, 20 | Jul 16, 24 | HRL Laboratories, LLC |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0114,857 | COPPER ALLOY BONDED BODY | Dec 16, 24 | Apr 10, 25 | NGK INSULATORS, LTD. |
| 2025/0114,858 | COPPER ALLOY JOINED BODY | Dec 16, 24 | Apr 10, 25 | NGK INSULATORS, LTD. |
| 2025/0114,878 | BRAZE ALLOYS | May 16, 24 | Apr 10, 25 | Not available |
| 2025/0109,462 | PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE | Jul 27, 23 | Apr 03, 25 | Mitsubishi Materials Corporation |
| 2025/0109,463 | PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE | Jul 27, 23 | Apr 03, 25 | Mitsubishi Materials Corporation |
| 2025/0109,470 | METHOD OF MANUFACTURING SHEET MATERIAL MADE OF COPPER-SILVER ALLOY AND METHOD OF MANUFATURING SHEET FOR ELECTRODE OF PROBE CARD | Oct 31, 24 | Apr 03, 25 | SWCC Corporation |
| 2025/0083,227 | COPPER ALLOY POWDER FOR LAMINATION SHAPING, LAMINATION SHAPED PRODUCT PRODUCTION METHOD, AND LAMINATION SHAPED PRODUCT | Nov 19, 24 | Mar 13, 25 | JX Nippon Mining & Metals Corporation |
| 2025/0059,636 | COPPER-BERYLLIUM ALLOY WITH HIGH STRENGTH | Nov 07, 24 | Feb 20, 25 | MATERION CORPORATION |
| 2025/0034,679 | COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, BUS BAR, AND LEAD FRAME | Oct 12, 22 | Jan 30, 25 | Mitsubishi Materials Corporation |
| 2025/0022,628 | COPPER ALLOY WIRE, COVERED WIRE, COVERED WIRE WITH TERMINAL, AND METHOD FOR MANUFACTURING COPPER ALLOY WIRE | Jun 07, 22 | Jan 16, 25 | SUMITOMO ELECTRIC INDUSTRIES LTD.; AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; |
| 2024/0396,242 | TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL MATERIAL | Aug 31, 22 | Nov 28, 24 | Mitsubishi Materials Corporation |
| 2024/0384,394 | LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME | Jul 26, 24 | Nov 21, 24 | Tosoh SMD, Inc. |
| 2024/0384,395 | LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME | Jul 26, 24 | Nov 21, 24 | Tosoh SMD, Inc. |
| 2024/0376,570 | VERY HIGH STRENGTH COPPER-TITANIUM ALLOY WITH IMPROVED FORMABILITY IN THE SOLUTION ANNEALED TEMPER | Aug 16, 22 | Nov 14, 24 | Not available |
| 2024/0336,994 | METAL-ALLOY BIPHASIC SYSTEMS, AND POWDERS AND METHODS FOR MAKING METAL-ALLOY BIPHASIC SYSTEMS | Jun 19, 24 | Oct 10, 24 | Not available |
| 2024/0327,953 | OXIDATION AND CORROSION RESISTANT NANOSTRUCTURED COPPER-BASED METALLIC SYSTEMS | Mar 28, 23 | Oct 03, 24 | Not available |
| 2024/0307,960 | CUTTING TOOL | Dec 20, 21 | Sep 19, 24 | Not available |
| 2024/0279,775 | APPARATUS AND METHOD FOR PRODUCTION OF HIGH PURITY COPPER-BASED ALLOYS | Oct 04, 23 | Aug 22, 24 | Not available |
| 2024/0279,777 | COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY | Apr 25, 24 | Aug 22, 24 | Not available |
| 2024/0271,248 | APPARATUS AND METHOD FOR PRODUCTION OF HIGH PURITY COPPER-BASED ALLOYS | Apr 03, 24 | Aug 15, 24 | Not available |
Top Owners in This Subclass
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
Patents Issued To Date - By Filing Year
Average Time to Issuance
- 35 Months (last 2 years Issuances)
- 35 Months (last 5 years Issuances)